JPS62190671U - - Google Patents

Info

Publication number
JPS62190671U
JPS62190671U JP8044286U JP8044286U JPS62190671U JP S62190671 U JPS62190671 U JP S62190671U JP 8044286 U JP8044286 U JP 8044286U JP 8044286 U JP8044286 U JP 8044286U JP S62190671 U JPS62190671 U JP S62190671U
Authority
JP
Japan
Prior art keywords
container
resin
nozzle
tube body
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8044286U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8044286U priority Critical patent/JPS62190671U/ja
Publication of JPS62190671U publication Critical patent/JPS62190671U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Die Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案に係る樹脂塗布装置を示す断面
図、第２図ａ〜ｄは同じく樹脂塗布装置の動作を
説明するための正面図、第３図は従来の樹脂塗布
装置を示す斜視図、第４図ａ〜ｄはその動作を説
明するための正面図である。 １……容器、２……樹脂、３……ノズル、４…
…加圧装置、５……ホース、１１……シリンダ、
１２……管体。 FIG. 1 is a sectional view showing a resin coating device according to the present invention, FIGS. 2 a to d are front views for explaining the operation of the resin coating device, and FIG. 3 is a perspective view showing a conventional resin coating device. , FIGS. 4a to 4d are front views for explaining the operation. 1... Container, 2... Resin, 3... Nozzle, 4...
...Pressure device, 5...Hose, 11...Cylinder,
12... tube body.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] その内部に半導体チツプ接着用の樹脂が貯溜さ
れ先端部にノズルを有する容器と、この容器にホ
ースを介して接続され前記ノズルから容器外に樹
脂を供給する加圧装置とを備え、前記ノズルの周
囲に駆動装置によつて昇降する管体を設け、この
管体の先端面は樹脂の供給状態において前記ノズ
ルの噴射口より下方に位置付けられていることを
特徴とする樹脂塗布装置。 The container has a container in which resin for bonding semiconductor chips is stored and has a nozzle at its tip, and a pressurizing device connected to the container via a hose to supply resin from the nozzle to the outside of the container. 1. A resin coating device, characterized in that a tube body that is raised and lowered by a drive device is provided around the tube body, and a tip end surface of the tube body is positioned below the injection port of the nozzle in a resin supply state.
JP8044286U 1986-05-28 1986-05-28 Pending JPS62190671U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8044286U JPS62190671U (en) 1986-05-28 1986-05-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8044286U JPS62190671U (en) 1986-05-28 1986-05-28

Publications (1)

Publication Number Publication Date
JPS62190671U true JPS62190671U (en) 1987-12-04

Family

ID=30931250

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8044286U Pending JPS62190671U (en) 1986-05-28 1986-05-28

Country Status (1)

Country Link
JP (1) JPS62190671U (en)

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