JPS6413723U - - Google Patents
Info
- Publication number
- JPS6413723U JPS6413723U JP10753787U JP10753787U JPS6413723U JP S6413723 U JPS6413723 U JP S6413723U JP 10753787 U JP10753787 U JP 10753787U JP 10753787 U JP10753787 U JP 10753787U JP S6413723 U JPS6413723 U JP S6413723U
- Authority
- JP
- Japan
- Prior art keywords
- coating liquid
- liquid supply
- coating
- die bonder
- tab portions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011248 coating agent Substances 0.000 claims description 16
- 238000000576 coating method Methods 0.000 claims description 16
- 239000007788 liquid Substances 0.000 claims description 15
- 239000006185 dispersion Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
- Die Bonding (AREA)
Description
第１図は本考案に係るダイボンダ用塗布液供給
装置の一実施例を示す全体構成図、第２図は第１
図の要部断面図、第３図はノズルの塗布液吐出口
の構成説明図、第４図はダイボンデイング装置の
全体構成図、第５図はリードフレームの外観図、
第６図は塗布液拡散部材の変形例を示す第３図と
同様の図である。
４：リードフレーム、４ａ：タブ部、５：塗布
液供給装置、１０：デイスペンサ、１１：ノズル
ホルダ、１２：ノズル、１２ａ：塗布液吐出口、
１８：塗布液拡散部材。
FIG. 1 is an overall configuration diagram showing an embodiment of a die bonder coating liquid supply device according to the present invention, and FIG.
3 is an explanatory diagram of the configuration of the nozzle's coating liquid discharge port, FIG. 4 is an overall configuration diagram of the die bonding apparatus, and FIG. 5 is an external view of the lead frame.
FIG. 6 is a diagram similar to FIG. 3 showing a modification of the coating liquid diffusion member. 4: Lead frame, 4a: Tab portion, 5: Coating liquid supply device, 10: Dispenser, 11: Nozzle holder, 12: Nozzle, 12a: Coating liquid discharge port,
18: Coating liquid diffusion member.
Claims (1)
リードフレームの各タブ部に半導体チツプを装着
・固定するための装置において、塗布液供給容器
に前記各列に対応する位置にそれぞれ塗布液供給
ノズルを設け、該各塗布液供給ノズルにおける塗
布液供給口に塗布を液拡させる塗布液拡散散部材
を装着する構成としたことを特徴とするダイボン
ダ用塗布液供給装置。 (2) 前記塗布液供給ノズルの装着部を前記塗布
液供給容器に着脱可能に装着する構成としたこと
を特徴とする実用新案登録請求の範囲第１項記載
のダイボンダ用塗布液供給装置。[Claims for Utility Model Registration] (1) In a device for attaching and fixing a semiconductor chip to each tab portion of a lead frame in which tab portions are provided in plural rows in the running direction, a coating liquid supply container is provided with tab portions in each row. A coating liquid supply for a die bonder, characterized in that coating liquid supply nozzles are provided at corresponding positions, and a coating liquid dispersion member for spreading the coating is attached to the coating liquid supply port of each coating liquid supply nozzle. Device. (2) The coating liquid supply device for a die bonder according to claim 1, wherein the mounting portion of the coating liquid supply nozzle is removably attached to the coating liquid supply container.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10753787U JPS6413723U (en) | 1987-07-15 | 1987-07-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10753787U JPS6413723U (en) | 1987-07-15 | 1987-07-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6413723U true JPS6413723U (en) | 1989-01-24 |
Family
ID=31342040
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10753787U Pending JPS6413723U (en) | 1987-07-15 | 1987-07-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6413723U (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5831543A (en) * | 1981-08-19 | 1983-02-24 | Nec Home Electronics Ltd | Manufacture of semiconductor device |
| JPS59100545A (en) * | 1982-11-30 | 1984-06-09 | Matsushita Electric Works Ltd | Die bonding device for ic chip |
| JPS6122636A (en) * | 1984-07-11 | 1986-01-31 | Toshiba Corp | Mounting process |
| JPS61121350A (en) * | 1984-11-16 | 1986-06-09 | Matsushita Electronics Corp | Manufacture of semiconductor device |
-
1987
- 1987-07-15 JP JP10753787U patent/JPS6413723U/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5831543A (en) * | 1981-08-19 | 1983-02-24 | Nec Home Electronics Ltd | Manufacture of semiconductor device |
| JPS59100545A (en) * | 1982-11-30 | 1984-06-09 | Matsushita Electric Works Ltd | Die bonding device for ic chip |
| JPS6122636A (en) * | 1984-07-11 | 1986-01-31 | Toshiba Corp | Mounting process |
| JPS61121350A (en) * | 1984-11-16 | 1986-06-09 | Matsushita Electronics Corp | Manufacture of semiconductor device |
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