JPS63116168U - - Google Patents

Info

Publication number
JPS63116168U
JPS63116168U JP767087U JP767087U JPS63116168U JP S63116168 U JPS63116168 U JP S63116168U JP 767087 U JP767087 U JP 767087U JP 767087 U JP767087 U JP 767087U JP S63116168 U JPS63116168 U JP S63116168U
Authority
JP
Japan
Prior art keywords
supplying
pasty solder
section
pasty
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP767087U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP767087U priority Critical patent/JPS63116168U/ja
Publication of JPS63116168U publication Critical patent/JPS63116168U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例図、第２図は他の実
施例図である。 １…銀ペースト供給ノズル、２…アイランド、
３…銀ペースト、４…銀ペースト除去ノズル、５
…半導体素子。 FIG. 1 shows one embodiment of the present invention, and FIG. 2 shows another embodiment. 1... Silver paste supply nozzle, 2... Island,
3...Silver paste, 4...Silver paste removal nozzle, 5
...Semiconductor element.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ソルダーを供給する装置において、一定量のペ
ースト状ソルダーをアイランド部に供給する供給
部と、供給されたペースト状ソルダーの一部を除
去する手段を含むことを特徴とするペースト状ソ
ルダー供給装置。 What is claimed is: 1. A pasty solder supplying device comprising: a supplying section for supplying a certain amount of pasty solder to an island section; and means for removing a portion of the supplied pasty solder.
JP767087U 1987-01-21 1987-01-21 Pending JPS63116168U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP767087U JPS63116168U (en) 1987-01-21 1987-01-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP767087U JPS63116168U (en) 1987-01-21 1987-01-21

Publications (1)

Publication Number Publication Date
JPS63116168U true JPS63116168U (en) 1988-07-27

Family

ID=30791340

Family Applications (1)

Application Number Title Priority Date Filing Date
JP767087U Pending JPS63116168U (en) 1987-01-21 1987-01-21

Country Status (1)

Country Link
JP (1) JPS63116168U (en)

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