JPS6410686A - Semiconductor laser module with electronic cooling element - Google Patents
Semiconductor laser module with electronic cooling elementInfo
- Publication number
- JPS6410686A JPS6410686A JP16530687A JP16530687A JPS6410686A JP S6410686 A JPS6410686 A JP S6410686A JP 16530687 A JP16530687 A JP 16530687A JP 16530687 A JP16530687 A JP 16530687A JP S6410686 A JPS6410686 A JP S6410686A
- Authority
- JP
- Japan
- Prior art keywords
- cooling element
- package
- electronic cooling
- heat
- flange
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Semiconductor Lasers (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
PURPOSE:To decrease thermal resistance in the heat path from the part at which an electronic cooling element is fixed on a dual-in-line package to an external heat sink while increasing heat dissipating properties for improving cooling capacity, by fixing the electronic cooling element on the flange-side inner wall of the package such that the side of the cooling element showing a higher temperature is brought into contact with the package. CONSTITUTION:A submount 2 is soldered on a stem 6 of a material having high heat conductivity such as copper or copper tungsten, together with a monitoring photodiode 3, an optical coupling ball lens 4 and a thermistor 5. The stem 6 in turn is soldered on an electronic cooling element 7. The electronic cooling element 7 is soldered on an inner wall of a dual-in-line package 9 on which a flange 8 is provided so as to be attached to an external heat sink. Heat generated by the electronic cooling element 9 is conducted through the wall and the flange 8 of the package 9 in the direction of thickness while heat diffusion in involved, and the heat reaches the outer surface of the flange and hence the interface with the external heat sink. Since heat is not conducted to the flange through the bottom plate of the package as would be in case of prior arts, thermal resistance can be decreased significantly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16530687A JPS6410686A (en) | 1987-07-03 | 1987-07-03 | Semiconductor laser module with electronic cooling element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16530687A JPS6410686A (en) | 1987-07-03 | 1987-07-03 | Semiconductor laser module with electronic cooling element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6410686A true JPS6410686A (en) | 1989-01-13 |
Family
ID=15809828
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16530687A Pending JPS6410686A (en) | 1987-07-03 | 1987-07-03 | Semiconductor laser module with electronic cooling element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6410686A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6424486A (en) * | 1987-07-20 | 1989-01-26 | Fujitsu Ltd | Semiconductor laser module |
| JPH03120884A (en) * | 1989-10-04 | 1991-05-23 | Hitachi Ltd | Semiconductor laser module |
| JPH0482287A (en) * | 1990-07-25 | 1992-03-16 | Hitachi Ltd | Semiconductor laser module with electron cooling down element |
| JPH07140362A (en) * | 1993-11-17 | 1995-06-02 | Nec Corp | Semiconductor laser module |
| WO1998035410A1 (en) * | 1997-02-07 | 1998-08-13 | Coherent, Inc. | Composite laser diode enclosure and method for making the same |
| US6061374A (en) * | 1997-02-07 | 2000-05-09 | Coherent, Inc. | Laser diode integrating enclosure and detector |
| JP2001284699A (en) * | 2000-01-25 | 2001-10-12 | Furukawa Electric Co Ltd:The | Method for fixing optical communication equipment and optical module |
| JP2007101700A (en) * | 2005-09-30 | 2007-04-19 | Eudyna Devices Inc | Optical module |
| JP2008145807A (en) * | 2006-12-12 | 2008-06-26 | Oki Electric Ind Co Ltd | Fiber bragg grating device |
| US8094388B1 (en) | 2009-01-12 | 2012-01-10 | Vortran Laser Technology, Inc. | Removable and replaceable modular optic package with controlled microenvironment |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62276892A (en) * | 1986-05-26 | 1987-12-01 | Hitachi Ltd | Electronic component |
-
1987
- 1987-07-03 JP JP16530687A patent/JPS6410686A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62276892A (en) * | 1986-05-26 | 1987-12-01 | Hitachi Ltd | Electronic component |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6424486A (en) * | 1987-07-20 | 1989-01-26 | Fujitsu Ltd | Semiconductor laser module |
| JPH03120884A (en) * | 1989-10-04 | 1991-05-23 | Hitachi Ltd | Semiconductor laser module |
| JPH0482287A (en) * | 1990-07-25 | 1992-03-16 | Hitachi Ltd | Semiconductor laser module with electron cooling down element |
| JPH07140362A (en) * | 1993-11-17 | 1995-06-02 | Nec Corp | Semiconductor laser module |
| WO1998035410A1 (en) * | 1997-02-07 | 1998-08-13 | Coherent, Inc. | Composite laser diode enclosure and method for making the same |
| US6027256A (en) * | 1997-02-07 | 2000-02-22 | Coherent, Inc. | Composite laser diode enclosure and method for making the same |
| US6061374A (en) * | 1997-02-07 | 2000-05-09 | Coherent, Inc. | Laser diode integrating enclosure and detector |
| JP2001284699A (en) * | 2000-01-25 | 2001-10-12 | Furukawa Electric Co Ltd:The | Method for fixing optical communication equipment and optical module |
| JP2007101700A (en) * | 2005-09-30 | 2007-04-19 | Eudyna Devices Inc | Optical module |
| JP2008145807A (en) * | 2006-12-12 | 2008-06-26 | Oki Electric Ind Co Ltd | Fiber bragg grating device |
| US8094388B1 (en) | 2009-01-12 | 2012-01-10 | Vortran Laser Technology, Inc. | Removable and replaceable modular optic package with controlled microenvironment |
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