JPH07335798A - Lsi cooling structure - Google Patents

Abstract

PURPOSE:To provide a cooling structure which cods LSI efficiently. CONSTITUTION:A cold plate 10 comprises a recess 5 for coolant to pass through, on its side opposed to the heat radiating surface 51 of LSI 20. The cold plate 10 also comprises nipples 7 to feed coolant 90 into the recess 5. The cold plate 10 is placed on the LSI 20 with its surface containing the recess in tight contact with the heat radiating surface 51. As a result, coolant is brought into direct contact with the heat radiating surface 51 of the LSI 20 when it, fed through one of the nipples 7, passes through the cold plate 10.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LSI cooling structure designed to efficiently cool an LSI package (hereinafter referred to as LSI).

[0002]

11 (a) and 11 (b) are a schematic side sectional view and a perspective view showing an example of a conventional LSI cooling structure.

As shown in FIGS. 11 (a) and 11 (b), in this conventional LSI cooling structure, a cooling plate 75 provided on the side of the coolant circulation mechanism 70 through which the coolant 90 circulates is mounted on the heat radiation surface 51 of the LSI 20Z. The LSI 20Z is cooled by bringing it into contact with each other. In the figure, 22 is an LSI lead, 77 is a nipple portion through which the refrigerant 90 flows in and out, 75 is a cooling plate made of a material having good thermal conductivity (such as a copper alloy), 71 is a space between the LSI heat radiation surface 51 and the cooling plate 75. Of the thermal conductive compound applied so as to fill the air gap.

This conventional LSI cooling structure cools the LSI 20Z by absorbing heat generated in the LSI 20Z by the refrigerant 90 which is fed from one nipple portion 77 in the arrow direction and flows in the refrigerant circulation mechanism 70 in the dotted line direction. That is.

[0005]

This conventional LSI cooling structure is widely used because of its simple structure. However, this LSI cooling structure has a structure in which the refrigerant 90 and the heating element (L
SI20Z) and cooling plate 75 and thermal conductive compound 71
Is interposed, the cooling efficiency is poor as compared with the case where the refrigerant 90 and the heat dissipation surface 51 are in direct (direct) contact.

According to the present invention, the cooling efficiency is significantly improved by constructing the refrigerant so as to come into direct contact with the LSI.
It is intended to realize an I cooling structure.

[0007]

As shown in FIG. 1, an LSI cooling structure according to the present invention is provided with a concave portion 5 for circulating a refrigerant on a surface of an LSI package 20 opposite to a heat radiating surface 51 thereof. 5 is equipped with a cold plate 10 having a nipple 7 for supplying a refrigerant 90, and the refrigerant 90 supplied from the nipple 7 comes into contact with the heat dissipation surface 51 of the LSI package 20 when passing through the cold plate 10. It is characterized in that it is configured to.

[0008]

The recess 5 is formed by engraving the surface of the LSI 20 facing the heat dissipation surface 51. Therefore, when the refrigerant 90 is supplied from the nipple 7 with the surface on the side where the concave portion 5 is formed being in close contact with the heat dissipation surface 51 of the LSI 20, the refrigerant 90 directly contacts the heat dissipation surface 51 of the LSI 20 and heat is generated from this. Take away. In this way, this LSI cooling structure has the recess 5
Since the coolant 90 introduced therein directly contacts the heat radiation surface 51 of the LSI 20 to cool it, the cooling efficiency is extremely good.

[0009]

The present invention will be described in detail below with reference to the drawings of the embodiments. 1 (a) and 1 (b) are schematic side sectional views and perspective views for explaining a first embodiment of the present invention, and FIGS. 2 (a) and 2 (b) are constituent members used in this first embodiment. 3 (a) and 3 (b) are schematic side sectional views and perspective views for explaining the second embodiment of the present invention, and FIG. 4 (a) and FIG.
FIG. 5B is a schematic perspective view for explaining the detailed structure of the constituent members used in the second embodiment, and FIGS. 5A and 5B are schematic perspective views for explaining the third embodiment of the present invention. Side sectional view and perspective view,
FIGS. 6 (a) and 6 (b) are schematic perspective views for explaining the detailed structure of the constituent members used in this third embodiment, and FIGS. 7 (a) and 7 (b).
Is a schematic side sectional view and a perspective view for explaining a first modified example of the present invention, and FIGS. 8A, 8B, and 8C illustrate a detailed structure of components used in the first modified example. 9 (a) and 9 (b) are schematic side sectional views and perspective views for explaining the second modification of the present invention, and FIGS. 10 (a), 10 (b) and 10 (c). 10] is a schematic perspective view for explaining a detailed structure of a constituent member used in a second modification. 1 to 10, the same parts as those in FIG. 11 are designated by the same reference numerals.

As shown in FIGS. 1A and 1B, the LSI cooling structure disclosed in the first embodiment is an LSI package 20.
The nipple 7 for supplying the refrigerant 90 into the concave portion 5 is provided with the concave portion 5 for flowing the refrigerant on the surface opposite to the heat radiating surface 51.
Equipped with a cold plate 10 equipped with the nipple 7
The cooling medium 90 supplied from the contacting member is configured to directly (directly) contact with the heat dissipation surface 51 of the LSI package 20 when passing through the recess 5 provided in the cold plate 10. In the figure, reference numeral 15 denotes the surface of the cold plate 10 on the side where the recess 5 is formed (hereinafter referred to as the recess forming surface)
Reference numeral 19 denotes a coupling screw used to bring it into close contact with the heat radiation surface 51, and 19 denotes a nut screwed into the coupling screw 15.

The cold plate 10 is shown in FIG.
As shown in (b), the concave portion 5 for flowing the refrigerant is formed by engraving the surface of the LSI 20 opposite to the heat dissipation surface 51.
The heat dissipation surface 51 side of the LSI 20 via the packing 30
Be attached to. In addition, the packing 30 fills a gap between the cold plate 10 and the LSI 20, and the refrigerant 90
Prevent the leakage of.

This LSI cooling structure has one nipple 7
From the direction indicated by the dotted line to the other nipple 7
Since the refrigerant 90 sent from the first contact directly contacts the heat dissipation surface 51 of the LSI 20 and absorbs heat from the heat dissipation surface 51, the LSI 20 can be cooled very efficiently.

Hereinafter, the first method will be described with reference to FIGS. 2 (a) and 2 (b).
The detailed structure of the constituent members used in the examples will be described. As shown in FIG. 2 (a), the cold plate 10 has a concave portion 5 for refrigerant flow formed by engraving a surface of the LSI 20 opposite to the heat radiation surface 51, and protrudes outward from the bottom surface of the concave portion 5. A pair of nipples 7 formed in a shape, a packing engagement groove 40 formed so as to surround the outer peripheral portion of the recess 5, and a packing 30 for keeping airtightness arranged in the packing engagement groove 40.
And a pair of screw insertion holes 18 provided outside the packing engagement groove 40.

On one side of the LSI 20, as shown in FIG. 2B, a pair of coupling screws 15 are arranged upright from the heat radiation surface 51. The cold plate 10, after engaging these coupling screws 15 into the screw insertion holes 18, respectively,
The nut 19 disclosed in FIG. 1 is mounted on the LSI 20 by screwing it into the coupling screw 15.

Next, a second embodiment of the present invention will be described with reference to FIGS. 3 (a) and 3 (b). As shown in FIGS. 3A and 3B, the LSI cooling structure disclosed in the second embodiment is the LSI 20X.
The lower side heat-dissipating surface 51 is provided with a concave portion 5X for circulating a refrigerant on a surface thereof, and a lower cold plate 10X having a nipple 7 for supplying the refrigerant 90 is provided in the concave portion 5X.
Refrigerant 90 supplied from the nipple 7 is supplied to the recess 5X.
When passing through the inside of the lower cold plate 10X arranged such that the surface on which is formed (concave forming surface) is in close contact with the heat radiating surface 51, it contacts the lower heat radiating surface 51 of the LSI 20X. ing. In the figure, 13 is the lower cold plate 10X
Is a coupling screw for mounting the LSI to the LSI 20X, and 23 is a liquid passage for circulating the refrigerant that connects the nipple 7 and the recess 5X.

In this LSI cooling structure, the refrigerant 90 sent from the nipple 7 in the direction of the arrow indicated by the dotted line directly contacts the lower heat radiation surface 51 of the LSI 20X, so that the LSI 20X can be cooled very efficiently. . This LSI
The cooling structure is suitable for mounting another cooling device (for example, an air-cooled heat sink) on the upper surface of the LSI 20X.

Hereinafter, the second method will be described with reference to FIGS. 4 (a) and 4 (b).
The detailed structure of the constituent members used in the examples will be described. Figure 4
(a) And (b) is a perspective view which shows the detailed structure of LSI20X and the lower cold plate 10X used for a 2nd Example.

As shown in FIG. 4 (a), the LSI 20X is provided with a screw insertion hole 18 through which the coupling screw 13 (see FIG. 3) is inserted in a loosely fitted state, and a nipple 7 shown in FIG. 4 (b). A pair of nipple insertion holes 27 that are inserted in the fitted state are formed.

Further, as shown in FIG. 4 (b), a pair of screw holes 16 are formed in the lower cold plate 10X which is mounted from below the LSI 20X so as to correspond to the screw insertion holes 18, and the nipple is also provided. A pair of nipples 7 are provided upright from the recess forming surface at positions corresponding to the insertion holes 27. In the figure, 5X is a concave portion for cooling medium flow provided in a substantially central portion of the lower cold plate 10X, and 40 is this concave portion 5X.
Packing engagement groove provided in a shape surrounding the outer peripheral part of
Are shown respectively.

The lower cold plate 10X is an LSI 20
The LSI 20X is mounted by screwing the coupling screw 13 (see FIG. 3) into the screw hole 16 with the nipple 7 being inserted through the nipple insertion hole 27 on the X side. These LSI20
When connecting X and the lower cold plate 10X, the packing 30 (see FIG. 3) is arranged in advance in the packing engaging groove 40.

Next, a third embodiment of the present invention will be described with reference to FIGS. 5 (a) and 5 (b). As shown in FIGS. 5A and 5B, the LSI cooling structure disclosed in the third embodiment is the LSI 20Y.
In addition to equipping a concave portion 5Y for refrigerant flow formed by engraving a surface on the side facing the lower heat radiation surface 51, the concave portion 5Y is provided.
The lower cold plate 10Y equipped with at least two screw nipples 7A for supplying the refrigerant 90 into Y is equipped, and the refrigerant 90 supplied from the screw nipples 7A is
When passing through the inside of the lower cold plate 10Y arranged such that the recess forming surface is in close contact with the heat radiating surface 51, the heat radiating surface 51 on the lower side of the LSI 20Y is directly contacted.

In this third embodiment, the lower cold plate 10
Since the LSI 20Y and the lower cold plate 10Y are connected by screwing the nut 19 into the threaded portion 8 of the threaded nipple 7A with Y mounted on the LSI 20Y, this third embodiment is applied. In this case, the connecting screws 15 and 13 (see FIGS. 1, 2 and 3) for mounting the cold plate 10 on the LSI 20 are not required.

In this LSI cooling structure, the refrigerant 90 supplied from one screw nipple 7A in the direction of the arrow shown by the dotted line and sent from the other screw nipple 7A is LSI.
Since it directly contacts the heat dissipation surface 51 of the 20Y, the LSI 20Y can be cooled very efficiently.

FIG. 6A shows an LSI 20Y used in the third embodiment.
6B is a perspective view for explaining the detailed structure of FIG. 6B, and FIG. 6B is a perspective view showing the detailed structure of the lower cold plate 10Y. As shown in FIG. 6A, this LSI 20Y has
A pair of threaded nipple insertion holes 27 through which the pair of threaded nipples 7A disclosed in (b) are inserted in a loosely fitted state, respectively.
A is formed.

On the other hand, the lower cold plate 10Y mounted from below the LSI 20Y is, as shown in FIG. 6 (b),
The LSI 20Y is provided with a recess 5Y formed by engraving the surface on the side opposite to the heat dissipation surface 51, and at least two screw nipples 7A for supplying the refrigerant 90 into the recess 5Y.
In the figure, 40 is a packing engagement groove formed on the outer peripheral portion of the recess 5Y, and 23 is a liquid passage for refrigerant flow provided between the screw nipple 7A and the recess 5Y.

These LSI 20Y and lower cold plate 10
Y is a screw nipple insertion hole provided on the LSI20Y side
The nut 19 (see FIG. 5) is screwed into the thread portion 8 of the threaded nipple 7A while the threaded nipple 7A provided on the lower cold plate 10Y side is inserted into the thread 27A. When the LSI 20Y and the lower cold plate 10Y are joined, the packing 30 disclosed in FIG. 5 is previously arranged in the packing engaging groove 40.

Next, a first modification of the present invention will be described with reference to FIGS. 7 (a) and 7 (b). As shown in FIGS. 7 (a) and 7 (b), the LSI cooling structure disclosed in the first modification is the LSI 20A.
A lower cold plate 10B provided with a concave portion 5B for circulating the refrigerant on the surface opposite to the lower heat radiation surface 51 and a nipple 7 for supplying the refrigerant 90 into the concave portion 5B;
The upper cold plate 10A having a concave portion 5A for flowing a refrigerant is provided on the surface on the side opposite to the upper heat radiating surface 51 of the I20A and the refrigerant 90 supplied from the nipple 7 into the concave portion 5B of the lower cold plate 10B. However, it is characterized in that it flows into the recess 5A from the inter-recess communication hole 21 provided on the side of the LSI 20A and comes into contact with the heat radiation surface 51 on the upper side of the LSI 20A.

In FIGS. 7 (a) and 7 (b), 3 is a coupling screw for bringing the recess forming surface of the upper cold plate 10A and the recess forming surface of the lower cold plate 10B into close contact with the upper and lower heat radiating surfaces 51 of the LSI 20A, and 25 is A partition provided in such a manner that the recess 5B is roughly divided into two parts for controlling the flow path of the refrigerant 90, and 30 is between the upper cold plate 10A and the LSI 20A, or the lower cold plate.
The packing for airtightness is arranged between 10B and LSI 20A, respectively.

In this LSI cooling structure, the refrigerant 90 supplied from the nipple 7 in the direction of the arrow shown by the dotted line is first LS.
Touch half of the heat radiating surface 51 on the lower side of I20A to cool it,
Next, the upper radiating surface 51 of the LSI 20A is cooled via the one inter-recess communication hole 21, and finally flows out downward from the other liquid passage hole 21 to cool half of the lower radiating surface 51. Therefore, the LSI 20A can be cooled very efficiently.

The detailed structure of the constituent members used in this first modification will be described below with reference to FIGS. 8 (a), 8 (b) and 8 (c).
Figure 8 (a) shows the upper cold plate used in this first modification.
FIG. 8B is a perspective view showing the detailed structure of 10A, and FIG.
FIG. 8C is a perspective view showing the detailed structure of 20A, and FIG. 8C is a perspective view showing the detailed structure of lower cold plate 10B.

In the upper cold plate 10A used in this first modified example, as disclosed in FIG. 8 (a), a recess 5A is formed in substantially the central portion thereof, and FIG. A pair of screw insertion holes 18 through which the threaded portion of the coupling screw 3 disclosed in FIG. 1 is inserted in a loosely fitted state and nipple insertion holes 27 through which the nipple 7 is loosely inserted are formed.

Also, the LSI 20A used in this first modification
As shown in FIG. 8 (b), the pair of screw insertion holes 18 through which the threaded portion of the coupling screw 3 is inserted in a loose fitting state and the nipple 7 are loosely fitted in a corner portion thereof. A pair of nipple insertion holes 27 to be inserted are formed respectively, and at least two liquid passage holes 21 for circulating the refrigerant 90 are provided.

The lower cold plate 10B mounted from below the LSI 20A has a recess 5D divided into two parts by a partition 25, a pair of screw holes 16 corresponding to the pair of screw insertion holes 18, and A pair of nipples 7 provided so as to correspond to the pair of nipple insertion holes 27, respectively, are formed as shown in FIG. 8 (c).

Next, a second modification of the present invention will be described with reference to FIGS. 9 (a) and 9 (b). The LSI cooling structure disclosed in the second modification is characterized in that the nipple 7A disclosed in the first modification is replaced by a screw nipple 7A to simplify the structure. It is a thing.

That is, this LSI cooling structure is as shown in FIG.
As shown in (b), LS is placed on the lower cold plate 10D.
Place I20B on top of it, and then cold plate 10 on it.
The lower cold plate 10D and the upper cold plate 10C are mounted on the LSI 20B by screwing the nut 19 into the threaded portion 8 of the threaded nipple 7A provided on the lower cold plate 10D side with C placed. ing.

The detailed structure of the components used in this second modification will be described below with reference to FIGS. 10 (a), 10 (b) and 10 (c).
First, the upper cold plate mounted on the upper side of the LSI 20B
10C, the upper cold plate 10C is provided with a recess 5C and a packing engaging groove 40 as shown in FIG. 10 (a), and a pair of nipples are inserted into the outer corners thereof. A hole 27 is provided.

Next is the LSI 20B. This LSI 20B
A pair of nipple insertion holes 27 and a pair of liquid passage holes 21 corresponding to the upper cold plate 10C are provided at the corners of the above as shown in FIG. 10 (b).

Lastly, there is a lower cold plate 10B mounted on the lower side of the LSI 20B. The lower cold plate 10D has a recess 5D which is divided into two parts by a partition 25 and the nipple insertion hole 27. Fig. 10 (c) shows a pair of threaded nipples 7A that engage with each other in a loosely fitted state.
It is provided in the form shown in.

The second modified example is the nipple 7 with a screw.
Since the upper cold plate 10C and the lower cold plate 10D can be mounted on the LSI 20B by screwing the nut 19 (see FIG. 9) into the screw portion 8 of A, the connecting screw 13 (see FIG. 7) can be omitted. You can

[0040]

As is clear from the above description, each of these LSI cooling structures according to the present invention is a structure in which the refrigerant directly contacts the heat dissipation surface of the LSI to remove heat, and
The cooling efficiency of I is extremely high.

[Brief description of drawings]

FIG. 1 is a schematic side sectional view and a perspective view for explaining a first embodiment of the present invention,

FIG. 2 is a schematic perspective view for explaining a detailed structure of constituent members used in the first embodiment,

FIG. 3 is a schematic side sectional view and a perspective view for explaining a second embodiment of the present invention,

FIG. 4 is a schematic perspective view for explaining a detailed structure of constituent members used in the second embodiment,

FIG. 5 is a schematic side sectional view and a perspective view for explaining a third embodiment of the present invention,

FIG. 6 is a schematic perspective view for explaining a detailed structure of constituent members used in the third embodiment,

FIG. 7 is a schematic side sectional view and a perspective view for explaining a first modified example of the present invention,

FIG. 8 is a schematic perspective view for explaining a detailed structure of a constituent member used in the first modified example,

FIG. 9 is a schematic side sectional view and a perspective view for explaining a second modification of the present invention,

FIG. 10 is a schematic perspective view for explaining a detailed structure of a constituent member used in a second modification,

FIG. 11 is a schematic side sectional view and a perspective view showing an example of a conventional LSI cooling structure,

[Explanation of symbols]

 5,5A, 5B, 5C, 5D, 5X, 5Y Recess 7 Nipple 7A Screw nipple 8 Thread 10 Cold plate 10A, 10C Upper cold plate 10B, 10D, 10X, 10Y Lower cold plate 3, 13, 15 Coupling screw 16 Screw hole 18 Screw insertion hole 19 Nut 20, 20A, 20B, 20X, 20Y, 20Z LSI 21 Connection hole between recesses 22 Lead 23 Liquid path 25 Partition 27 Nipple insertion hole 30 Packing 40 Packing groove 51 Heat dissipation surface 70 Refrigerant circulation mechanism 71 Thermal conductive compound 75 Cooling plate 77 Nipple part 90 Refrigerant

Claims (2)

[Claims] 1. A recess (5) for circulating a refrigerant is provided on a surface of an LSI package (20) opposite to a heat dissipation surface (51), and
A cold plate (10) having a nipple (7) for supplying a refrigerant (90) into the recess (5) is provided, and the refrigerant (90) supplied from the nipple (7)
When passing through the cold plate (10) arranged so that the surface on which (5) is formed closely contacts the heat dissipation surface (51), the heat dissipation surface (51) of the LSI package (20) is directly An LSI cooling structure characterized by being in contact with each other. 2. A lower heat radiation surface of the LSI package (20A)
A nipple for supplying a refrigerant (90) into the concave portion (5B), which is provided with a concave portion (5B) for circulating the refrigerant on the surface facing the (51).
The lower cold plate (10B) provided with (7) and the upper cold plate (10A) provided with the concave portion (5A) for refrigerant circulation on the surface opposite to the upper heat dissipation surface (51) of the LSI package (20A). )
Equipped with the nipple (7) to the recess of the lower cold plate (10B).
The refrigerant (90) supplied in (5B) is the LSI package.
From the inter-recess communication hole (21) provided on the (20A) side, the recess (5
Heat sink surface above the LSI package (20A) by flowing into A)
An LSI cooling structure characterized in that it is also in contact with (51).