JPH05121609A - Conductive cooling structure - Google Patents

Conductive cooling structure

Info

Publication number
JPH05121609A
JPH05121609A JP3278184A JP27818491A JPH05121609A JP H05121609 A JPH05121609 A JP H05121609A JP 3278184 A JP3278184 A JP 3278184A JP 27818491 A JP27818491 A JP 27818491A JP H05121609 A JPH05121609 A JP H05121609A
Authority
JP
Japan
Prior art keywords
heat
generating component
cooling structure
package
liquid coolant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP3278184A
Other languages
Japanese (ja)
Inventor
Masahiro Mochizuki
優宏 望月
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP3278184A priority Critical patent/JPH05121609A/en
Publication of JPH05121609A publication Critical patent/JPH05121609A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To reduce the size of the module which cools heat generating components, such as LSIs, etc., mounted on a substrate of a conductive cooling structure which conductively cools the heat generating component with a liquid coolant. CONSTITUTION:This conductive cooling structure which conductively cools heat generating components 2 mounted on a substrate 1 with a liquid coolant is constituted of heat generating components 2 which are respectively composed of packages containing chips 2b and caps 2c sealing the chips 2b, pipes 3 which have a diameter larger than the thickness of the chips 2b and are put between the packages 2a and caps 2c and through which the liquid coolant is circulated, and tubes 4 which are connected to the pipes 3 and through which the liquid coolant is circulated.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、伝導冷却構造に係り、
特に基板上に実装されたＬＳＩ等の発熱部品を液体冷媒
によって伝導冷却する伝導冷却構造に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conduction cooling structure,
In particular, the present invention relates to a conduction cooling structure for conducting and cooling a heat generating component such as an LSI mounted on a substrate with a liquid coolant.

【０００２】[0002]

【従来の技術】従来は図８に示すように、基板８０上に
実装された発熱部品８１の放熱面に放熱ピストン８４を
当接させ、その放熱ピストン８４をバネ８５によって発
熱部品８１側に押圧すると共に、そのバネ８５によって
発熱部品からの熱を伝導している。2. Description of the Related Art Conventionally, as shown in FIG. 8, a heat radiating piston 84 is brought into contact with a heat radiating surface of a heat generating component 81 mounted on a substrate 80, and the heat radiating piston 84 is pressed toward the heat generating component 81 by a spring 85. In addition, the spring 85 conducts heat from the heat-generating component.

【０００３】上記発熱部品８１は図９に示す構成となっ
ており、パッケージ８１ｄの台座にチップ８１ｃが搭載
されており、そのチップ８１ｃの厚みをカバーするスペ
ーサ８１ｂを介在してフタ８１ａにて覆い、発熱部品８
１が構成されている。The heat generating component 81 is constructed as shown in FIG. 9, and a chip 81c is mounted on a pedestal of a package 81d, which is covered with a lid 81a via a spacer 81b which covers the thickness of the chip 81c. , Heating component 8
1 is configured.

【０００４】そして、上記放熱ピストン８４をガイドす
る放熱ブロック８３を介して、内部に冷却水，フロロカ
ーボン等の液体冷媒が流動する冷媒通路８２ａを有する
コールドプレート８２にその熱が伝導されていた。Then, the heat is conducted to the cold plate 82, which has a refrigerant passage 82a through which a liquid refrigerant such as cooling water or fluorocarbon flows, via the heat dissipation block 83 which guides the heat dissipation piston 84.

【０００５】尚、放熱ブロック８３には放熱ピストン８
４が収納される凹部８３ａが形成されていると共に、コ
ールドプレート８２の冷媒通路８２ａの両端には配管接
続用のニップル８２ｂが形成されている。The heat dissipation block 83 has a heat dissipation piston 8
4 is formed, and a nipple 82b for pipe connection is formed at both ends of the refrigerant passage 82a of the cold plate 82.

【０００６】よって、発熱部品８１が発する熱はコール
ドプレート８２において、液体冷媒との熱交換が行わ
れ、発熱部品８１の冷却が行われるものであった。Therefore, the heat generated by the heat generating component 81 is exchanged with the liquid refrigerant in the cold plate 82 to cool the heat generating component 81.

【０００７】[0007]

【発明が解決しようとする課題】しかしながら、従来の
構造では、特に放熱ブロック，放熱ピストンの肉厚が厚
く，また、基板，放熱ブロック，コールドプレートがそ
れぞれ多段に搭載されているため、モジュール全体が大
型化してしまい、コストが高く、重量が重く取扱いに不
便である欠点を有していた。However, in the conventional structure, the thickness of the heat dissipation block and the heat dissipation piston is particularly large, and the board, the heat dissipation block, and the cold plate are mounted in multiple stages, so that the entire module is mounted. It has the disadvantages of large size, high cost, heavy weight and inconvenience in handling.

【０００８】従って、本発明は、基板上に実装された発
熱部品を冷却するモジュールを小型化することを目的と
するものである。Therefore, it is an object of the present invention to reduce the size of a module for cooling heat generating components mounted on a board.

【０００９】[0009]

【課題を解決するための手段】上記目的は、基板１上に
実装された発熱部品２を、液体冷媒によって伝導冷却す
る伝導冷却構造において、チップ２ｂを有するパッケー
ジ２ａと、該チップ２ｂを封止するフタ２ｃとから構成
される前記発熱部品２と、前記チップ２ｂの肉厚よりも
その径が大きく、且つ前記パッケージ２ａと前記フタ２
ｃとの間に介在され、その内部にて液体冷媒が流動する
パイプ３と、該パイプ３に接続され、該液体冷媒を循環
するチューブ４と、を具備することを特徴とする伝導冷
却構造、によって達成される。The above object is to seal a package 2a having a chip 2b and a chip 2b in a conduction cooling structure in which a heat generating component 2 mounted on a substrate 1 is conductively cooled by a liquid coolant. And the package 2a and the lid 2 whose diameter is larger than the wall thickness of the chip 2b.
a conduction cooling structure comprising: a pipe 3 interposed between the pipe c and a liquid coolant flowing therein; and a tube 4 connected to the pipe 3 for circulating the liquid coolant, Achieved by

【００１０】[0010]

【作用】即ち、本発明では、基板に実装された発熱部品
を構成する部分に液体冷媒が流動するチューブを形成し
ていることにより、発熱部品と冷却構造とを兼ね合わせ
て構成することができるので、モジュールの小型化が可
能である。That is, according to the present invention, since the tube through which the liquid refrigerant flows is formed in the portion constituting the heat generating component mounted on the substrate, the heat generating component and the cooling structure can be combined. Therefore, the module can be downsized.

【００１１】[0011]

【実施例】以下、本発明の望ましい実施例について図１
乃至図７を用いて詳細に説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described below with reference to FIG.
It will be described in detail with reference to FIGS.

【００１２】図１は本発明の第１の実施例を示す図であ
る。図２は第１の実施例におけるパッケージの一例を示
す図である。図３は第１の実施例におけるパッケージの
他の例を示す図である。FIG. 1 is a diagram showing a first embodiment of the present invention. FIG. 2 is a diagram showing an example of a package in the first embodiment. FIG. 3 is a diagram showing another example of the package in the first embodiment.

【００１３】図４は本発明の第２の実施例を示す図であ
る。図５は第２の実施例の平面図である。図６は第２の
実施例におけるパッケージの一例を示す図である。FIG. 4 is a diagram showing a second embodiment of the present invention. FIG. 5 is a plan view of the second embodiment. FIG. 6 is a diagram showing an example of a package in the second embodiment.

【００１４】図７は第２の実施例におけるパッケージの
他の例を示す図である。尚、図１乃至図７において、同
一符号を付したものは、同一対象物をそれぞれ示すもの
である。FIG. 7 is a diagram showing another example of the package in the second embodiment. In addition, in FIGS. 1 to 7, the same reference numerals denote the same objects.

【００１５】まず第１の実施例について図１乃至図３を
用いて詳細に説明する。図１に示すように、基板１上に
端子５を介して実装された発熱部品２内に、その内部に
液体冷媒が流動するパイプ３を配管し、パイプ３の端部
には下段に液体冷媒を循環させるためにチューブ４が接
続されている。First, the first embodiment will be described in detail with reference to FIGS. As shown in FIG. 1, a pipe 3 through which a liquid refrigerant flows is laid inside a heat-generating component 2 mounted on a substrate 1 via terminals 5, and a liquid refrigerant is provided at a lower stage at an end of the pipe 3. A tube 4 is connected to circulate.

【００１６】上記発熱部品２の構成は図２に示すよう
に、パッケージ２ａの実装面にチップ２ｂが搭載されて
おり、パッケージ２ａの実装面で且つチップ２ｂの周囲
を覆うように枠状のパイプ３が配置され、このパイプ３
の径は少なくともチップ２ｂの肉厚よりも大きいように
設定されている。パイプ３を含めチップ２ｂをフタ２ｃ
によって封止され、このフタ２ｃの外部からはチューブ
４と接続されるパイプ３の先端３ａが突出している。As shown in FIG. 2, the heat-generating component 2 has a chip 2b mounted on the mounting surface of the package 2a, and a frame-shaped pipe that covers the mounting surface of the package 2a and the periphery of the chip 2b. 3 is placed and this pipe 3
Is set to be at least larger than the thickness of the tip 2b. Cover the tip 2b including the pipe 3 with the lid 2c
The tip 3a of the pipe 3 which is sealed by and is connected to the tube 4 projects from the outside of the lid 2c.

【００１７】パッケージのその他の例として図３に示す
ように、パイプを完全な枠状体とはせず、適宜屈曲され
た部分に板３２を取り付けたパイプ３１としても良い。
尚、３１ａはチューブ４と接続されるパイプ３１の先端
である。As another example of the package, as shown in FIG. 3, the pipe may be a pipe 31 in which a plate 32 is attached to an appropriately bent portion, instead of the complete frame.
Incidentally, 31a is the tip of the pipe 31 connected to the tube 4.

【００１８】上記のように構成された第１の実施例にお
いては、チューブ４から供給された液体冷媒は発熱部品
２のパッケージ２ａ上のパイプ３で循環され、チップ２
ｂが発する熱はパッケージ２ａを介して、或いはチップ
２ｂとパイプ３との空間を介してそれぞれ熱交換され、
チップ２ｂの冷却が行われる。そして、チップ２ｂを冷
却した液体媒体は下段のパイプへと循環され、最終的に
装置外部へと排出される。In the first embodiment constructed as described above, the liquid refrigerant supplied from the tube 4 is circulated through the pipe 3 on the package 2a of the heat-generating component 2 and the chip 2
The heat generated by b is heat-exchanged through the package 2a or the space between the chip 2b and the pipe 3,
The chip 2b is cooled. Then, the liquid medium that has cooled the chip 2b is circulated through the lower pipe and finally discharged to the outside of the apparatus.

【００１９】次に第２の実施例について図４乃至図７を
用いて詳細に説明する。尚、第１の実施例と共通の部分
はその説明を省略する。第２の実施例と第１の実施例が
異なる点は、図６に示すように発熱部品２の上面にヒー
トシンク６を設け、このヒートシンク６の側面にミゾ６
ａを形成している点である。このミゾ６ａに図５に示す
如く、熱伝導性に優れた材料よりなるチューブ７を嵌合
させて巻付け、チューブ７を循環する液体冷媒によっ
て、ヒートシンク６に伝達された発熱部品２が発する熱
と熱交換を行うことによって、冷却が行われる。Next, the second embodiment will be described in detail with reference to FIGS. The description of the same parts as those in the first embodiment will be omitted. The difference between the second embodiment and the first embodiment is that a heat sink 6 is provided on the upper surface of the heat generating component 2 as shown in FIG.
This is the point where a is formed. As shown in FIG. 5, a tube 7 made of a material having excellent heat conductivity is fitted around the groove 6a and wound, and the heat generated by the heat-generating component 2 transmitted to the heat sink 6 is generated by the liquid refrigerant circulating in the tube 7. Cooling is performed by exchanging heat with

【００２０】上記パッケージの変形例として図７に示す
ようにヒートシンク６にミゾ６ａを形成するのではな
く、発熱部品２の側面２ｄにミゾ２ｅを形成し、このミ
ゾ２ｅにチューブ７を嵌合させて巻き付けるようにして
もよい。この例だと、パッケージが薄型化となり、高密
度実装が期待できる。As a modified example of the package, as shown in FIG. 7, the heat sink 6 is not formed with the groove 6a, but the side surface 2d of the heat-generating component 2 is formed with the groove 2e, and the tube 7 is fitted into the groove 2e. It may be wrapped around. In this example, the package becomes thinner and high-density mounting can be expected.

【００２１】[0021]

【発明の効果】以上説明したように本発明によると、モ
ジュールの小型化が実現でき、コストを安くすることが
でき、軽重量化とし取扱いが容易となる。As described above, according to the present invention, the module can be downsized, the cost can be reduced, the weight can be reduced, and the handling can be facilitated.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の第１の実施例を示す図である。FIG. 1 is a diagram showing a first embodiment of the present invention.

【図２】第１の実施例におけるパッケージの一例を示す
図である。FIG. 2 is a diagram showing an example of a package in the first embodiment.

【図３】第１の実施例におけるパッケージの他の例を示
す図である。FIG. 3 is a diagram showing another example of the package in the first embodiment.

【図４】本発明の第２の実施例を示す図である。FIG. 4 is a diagram showing a second embodiment of the present invention.

【図５】第２の実施例の平面図である。FIG. 5 is a plan view of the second embodiment.

【図６】第２の実施例におけるパッケージの一例を示す
図である。FIG. 6 is a diagram showing an example of a package according to a second embodiment.

【図７】第２の実施例におけるパッケージの他の例を示
す図である。FIG. 7 is a diagram showing another example of the package in the second embodiment.

【図８】従来例を示す図である。FIG. 8 is a diagram showing a conventional example.

【図９】従来のパッケージ例を示す図である。FIG. 9 is a diagram showing an example of a conventional package.

【符号の説明】[Explanation of symbols]

１ 基板， ２ 発熱部品， ３ パイプ， ４，７ チューブ， ６ ヒートシンク， 1 board, 2 heat generating parts, 3 pipes, 4, 7 tubes, 6 heat sinks,

Claims (3)

【特許請求の範囲】[Claims] 【請求項１】 基板（１）上に実装された発熱部品
（２）を、液体冷媒によって伝導冷却する伝導冷却構造
において、 チップ（２ｂ）を有するパッケージ（２ａ）と、該チッ
プ（２ｂ）を封止するフタ（２ｃ）とから構成される前
記発熱部品（２）と、 前記チップ（２ｂ）の肉厚よりもその径が大きく、且つ
前記パッケージ（２ａ）と前記フタ（２ｃ）との間に介
在され、その内部にて液体冷媒が流動するパイプ（３）
と、 該パイプ（３）に接続され、該液体冷媒を循環するチュ
ーブ（４）と、 を具備することを特徴とする伝導冷却構造。1. A conduction cooling structure for conducting and cooling a heat-generating component (2) mounted on a substrate (1) with a liquid coolant, comprising a package (2a) having a chip (2b) and the chip (2b). Between the package (2a) and the lid (2c), which has a diameter larger than the wall thickness of the chip (2b) and which is composed of a lid (2c) for sealing. (3) which is interposed in the pipe and through which the liquid refrigerant flows
And a tube (4) that is connected to the pipe (3) and circulates the liquid refrigerant, a conduction cooling structure. 【請求項２】 基板（１）上に実装された発熱部品
（２）を、液体冷媒によって伝導冷却する伝導冷却構造
において、 前記発熱部品（２）の放熱面に取付けられ、ミゾ（６
ａ）を有するヒートシンク（６）と、 該ミゾ（６ａ）と嵌合すると共に、その内部にて液体冷
媒が流動する熱伝導性に優れた材料からなるチューブ
（４）と、 を具備することを特徴とする伝導冷却構造。2. A conduction cooling structure in which a heat-generating component (2) mounted on a substrate (1) is conductively cooled by a liquid coolant, and the heat-generating component (2) is attached to a heat-dissipating surface of the heat-generating component (2).
a heat sink (6) having a), and a tube (4) fitted to the groove (6a) and made of a material having excellent thermal conductivity in which a liquid refrigerant flows. Characteristic conduction cooling structure. 【請求項３】 基板（１）上に実装された発熱部品
（２）を、液体冷媒によって伝導冷却する伝導冷却構造
において、 前記発熱部品（２）の側面（２ｄ）に形成されたミゾ
（２ｅ）と、 該ミゾ（２ｅ）と嵌合すると共に、その内部にて液体冷
媒が流動する熱伝導性に優れた材料からなるチューブ
（４）と、 を具備することを特徴とする伝導冷却構造。3. A conduction cooling structure in which a heat generating component (2) mounted on a substrate (1) is conductively cooled by a liquid coolant, and a groove (2e) formed on a side surface (2d) of the heat generating component (2). ) And a tube (4) which is fitted with the groove (2e) and which is made of a material having excellent thermal conductivity in which the liquid refrigerant flows, and a conductive cooling structure.
JP3278184A 1991-10-25 1991-10-25 Conductive cooling structure Withdrawn JPH05121609A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3278184A JPH05121609A (en) 1991-10-25 1991-10-25 Conductive cooling structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3278184A JPH05121609A (en) 1991-10-25 1991-10-25 Conductive cooling structure

Publications (1)

Publication Number Publication Date
JPH05121609A true JPH05121609A (en) 1993-05-18

Family

ID=17593761

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3278184A Withdrawn JPH05121609A (en) 1991-10-25 1991-10-25 Conductive cooling structure

Country Status (1)

Country Link
JP (1) JPH05121609A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1701222A2 (en) 2005-03-10 2006-09-13 Seiko Epson Corporation Line head module, exposure apparatus, and image forming apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1701222A2 (en) 2005-03-10 2006-09-13 Seiko Epson Corporation Line head module, exposure apparatus, and image forming apparatus

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