JPH0334228B2 - - Google Patents

Description

[Detailed Description of the Invention] [Summary] A coupling fitting for a heat pipe that transfers and cools the heat generated by an electronic component. Inserting a heat pipe increases heat transfer efficiency to the cooling heat pipe.

[Industrial application field]

The present invention relates to improving the heat transfer efficiency of a heat transfer coupling device that couples an electronic component that requires cooling to a cooling heat pipe.

Semiconductor devices such as transistors, ICs, and LSIs (hereinafter simply referred to as electronic components) are required to radiate heat generated inside them to the outside to maintain the temperature below a specified level. will be established. However, as the capacity of electronic and communication devices increases and devices become smaller, packaging density increases and internal heat generation also increases. Since electronic components mounted in such locations cannot be dissipated by their own heat dissipation device alone, heat is further transferred, for example, to the outside of the unit for heat dissipation.

[Conventional technology]

A conventional heat transfer coupling device for coupling an electronic component and a heat pipe will be explained with reference to a side view in FIG. 4 and a front view in FIG.

In the figure, a bottom notch 22 of a concave fastening fitting 21 of a columnar part 12 of a semiconductor device 1 is engaged with a heat transfer columnar part 12 and a disk-shaped heat radiation part 13 provided on a container 11 containing an LSI. Then, the first coupling fitting 25 is fitted into the recessed portion, and the bottom surface 26 of the fitting fitting 25 is brought into contact with the top surface of the disc-shaped heat dissipation section 13.

Furthermore, the second coupling fitting 31 is placed over the first coupling fitting 25, and the heat-absorbing side of the heat pipe 5 is positioned in the circular hole formed by the semicircles 27, 32 formed in the center of both of these fittings. Flange 2
Insert the screw 4 through 8 and 33 and tighten it to the clamp 21.

As described above, the heat generated by the semiconductor device 1 is transmitted from the disc-shaped heat dissipating portion 13 to the first coupling fitting 25, and is then transferred to the heat pipe 5, whereby the semiconductor device 1 is cooled and maintained at a predetermined temperature. will be done.

[Problem that the invention seeks to solve]

According to the configuration of the conventional device described above, heat is transferred to the heat pipe 5 through the maximum semicircular surface that contacts the first coupling fitting 25, and from the second coupling fitting 31 side via the tightening fitting 21 and by the screw 4. Only a small amount of heat transfer can be expected.

The above is the connection between the fastening fitting 21 and the first coupling fitting 2.
5, and between the flange 28 and the flange 33 of the second coupling fitting 31, the disc-shaped heat radiation part 13 and the first coupling fitting 25 must be in close contact with each other, and the first and second coupling This is because the metal fittings 25, 31 and the heat pipe 5 need to be in close contact with each other, so a gap is required as a tightening margin, so heat transfer does not occur between them. If the distance to the heat pipe becomes long, effective heat transfer will not occur due to internal thermal resistance.

An object of the present invention is to provide a means for more effectively transferring heat to a heat pipe.

[Means for solving problems]

In order to solve the above-mentioned problems of the prior art, the present invention provides a coupling fitting for coupling an electronic component that requires cooling and a cooling heat pipe for cooling the electronic component by transferring heat generated from the electronic component. It is composed of a first coupling fitting that is in contact with the electronic component and a second coupling fitting that is distant from the electronic component, and is provided with a heat transfer heat pipe that transfers heat from the first coupling fitting to the second coupling fitting. This is achieved by a heat transfer coupling device.

[Effect]

According to the above means of the present invention, heat is effectively transferred to the heat pipe not only from the first coupling fitting but also from the second coupling fitting, so that heat can be transferred from the entire circumference of the heat pipe. The effect is almost doubled.

〔Example〕

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The apparatus of the present invention will be specifically described below with reference to the drawings.

1 to 3 show an embodiment of the apparatus of the present invention. In FIG. 3, the semiconductor device 1 mounted on the circuit board 61 in the unit housing 6 is connected to the fastening fitting 7 and the first coupling fitting 8, and the heat absorption side 51 of the upper heat pipe 5 is The first coupling fitting 8 and the second coupling fitting 9 are connected in contact with each other.

The heat pipe 5 is arranged horizontally on the heat radiation side 52
A heat dissipating fin 53 is provided at the end of the unit housing 6 to dissipate heat to the outside space. Note that 62 is a circuit component vertically mounted between the heat pipes 5 on the circuit board 61. Further, the heat pipe 5 is stably supported by a support (not shown).

The coupling device will be explained with reference to a side cross section in FIG. 2 and a front cross section in FIG. 3. engaging the bottom notch 71 of the concave fastening fitting 7 with the columnar part 12 of the semiconductor device 1;
The first coupling fitting 8 is fitted into the recess, and the bottom surface 8 of the fitting 8 is fitted.
1 is brought into contact with the upper surface of the disc-shaped heat dissipation section 13. The fastening fitting 7 has a concave shape in both the front view and the side view, and the legs are formed at the four corners.
The connecting fittings 8 are fitted together while avoiding the leg portions.

The second coupling fitting 9 is placed over the first coupling fitting 8, and the heat-absorbing side of the heat pipe 5 is attached to the semicircular holes 82 and 91 formed in the center of both, and the upper four corners are It is tightened to the clamping fitting 7 by the screw 4 passing through it.

On both sides of the heat pipe 5, a hole 83 of sufficient depth is provided for the first coupling fitting 8 and a similar hole 92 corresponding to the second coupling fitting 9, into which the heat pipe 10 is closely fitted. inserted. The heat absorption side 10a of this heat pipe 10 is the first coupling fitting 8 side, and the heat radiation side 10b is the second coupling fitting 9 side.

With the above configuration, in the semiconductor device 1, heat is transmitted from the disc-shaped heat dissipation part 13 to the first coupling fitting 8,
Heat is transferred from here to the lower half circumference of the heat pipe 5 via the semicircular surface 82, and heat is absorbed from the heat pipe 10a and radiated to the second coupling fitting 9.
When the heat is transferred from here to the upper half of the heat pipe 5 via the semicircular surface 91, it is cooled by the heat.

The coupling fittings are preferably made of copper, aluminum, or an alloy thereof, which has good thermal conductivity.

〔Effect of the invention〕

As described above, according to the device of the present invention, heat transfer is performed from the entire circumference of the heat pipe, so the heat transfer efficiency is extremely good. By placing the side close to the heat source, heat can be efficiently transferred to the second coupling fitting, and the practical effect of substantially reducing heat transfer loss is significant.

[Brief explanation of the drawing]

1 to 3 show an embodiment of the present invention, and show a side cross section, a front cross section, and a side view of the mounting part, FIG. 4 shows a conventional side view, and FIG. 5 shows a front view. Identical parts are designated by the same reference numerals throughout the figures. In the figure, 1 is a semiconductor device, 5 is a heat pipe, 7 is a fastening fitting, 8 is a first coupling fitting, 9 is a second coupling fitting, and 10 is a heat pipe.

Claims (1)

[Claims] 1. A connecting fitting that connects an electronic component 1 that requires cooling and a cooling heat pipe 5 for cooling the electronic component by transferring heat from the electronic component is connected to a first connecting fitting 8 that is in contact with the electronic component and the electronic component. and a second coupling fitting 9 which is farther away, and is also provided with a heat transfer heat pipe 10 for transferring heat from the first coupling fitting 8 to the second coupling fitting 9. Coupling device.