JPS59208761A - Electronic part cooling mechanism - Google Patents

Abstract

PURPOSE:To perform a cooling work efficiently by a method wherein a heat dissipating member which comes in contact with the surface of an electronic part is provided on the surface of said electronic part mounted on a substrate, a heat pipe with which evaporation heat will be utilized is built-in in the heat dissipating member, and said heat dissipating member is pressed on to the electronic part using an elastic means. CONSTITUTION:A plurality of semiconductor devices 3 are adhered on the ceramic substrate 1, having a number of protruding pins 2 provided on the lower part, using a solder bump 4, and the heat dissipating member 5 whereon a radiation sleeve 12 with heat dissipating fins 13 on the circumference is contacted to each semiconductor device 3. A recessed groove is provided at the upper part of said heat dissipating member 5, a stationary block 7 is inserted into the recessed groove, a pressing plate 8 which is fixed by a bolt 9 and a nut 10 is provided on the substrate 1, and the block 7 is pressed by said pressing plate 8. Also, a cavity part is provided in the heat dissipating member 5 at the point located below a spring 6, and a heat dissipating element 11 consisting of a heat pipe with which evaporation heat is utilized and a cooling material are placed in said cavity part. Through these procedures, a vaporization process and a liquefaction process are performed repeatedly on the solution sealed in the cavity part, thereby enabling to perform an excellent cooling work efficiently.

Description

DETAILED DESCRIPTION OF THE INVENTION TECHNICAL FIELD The present invention relates to cooling technology, and in particular to a technology applicable to cooling of electronic components such as highly densely integrated semiconductor devices.

[Background Art] How to dissipate heat from semiconductor elements is extremely important in highly densely integrated semiconductor devices, especially in so-called multi-chip modules in which multiple semiconductor devices are mounted on the same substrate. becomes.

Therefore, it is conceivable to cool the module using a water cooling method, or to use a combination of a water cooling method and a helium (He) gas filling method.

However, such a cooling system has problems such as a considerably complicated structure due to water circulation for water cooling, inclusion of He gas, etc., difficulty in maintenance, and high cost.

[Object of the Invention] An object of the present invention is to provide an electronic component cooling technique that can perform efficient cooling with a simple structure.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Summary of the Invention] A brief overview of typical inventions disclosed in this application is as follows.

Of course, by providing a heat radiator with a built-in heat radiating element that utilizes vaporization heat in contact with the electronic components, efficient cooling can be performed with a simple structure without using cooling water.

[Embodiment 1] FIG. 1 is a sectional view showing an embodiment of an electronic component cooling mechanism according to the present invention.

In this embodiment, a substrate 1 made of ceramic, for example, has a large number of lead pins 2 projecting downward.

On the upper surface side of this substrate 1, a plurality of semiconductor devices 3, each of which is a so-called flip chip face-down bonded, are connected by conductive cloth using solder bumps 4.

A heat dissipation body (heat dissipation body) 5 for dissipating heat generated from each semiconductor device 3 is in surface contact with the upper surface side of each of these semiconductor devices 3 so as to be able to conduct heat. In a recess formed in the axial direction on the opposite end side of the heat sink 5, a fixing block 7 is connected to a fixing plate 8 via a spring 6 so as to press the heat sink 5 against the upper surface of the semiconductor device 3. It is held between the substrate 1 by bolts 9 and nuts 10.

Furthermore, a heat pipe 11 as an example of a heat dissipation element utilizing vaporization heat is built into the heat dissipation body 5 in this embodiment. In these pipes 1 to 11, the liquid sealed inside the enclosure vaporizes and rises due to the heat from the semiconductor device 3, and the gas liquefies again in the upper part of the enclosure, which is lower temperature than the lower part, and drips. Further, in the lower part, the heat from the semiconductor device 3 vaporizes again and rises, repeating vaporization and liquefaction in a circulation pattern, and during the vaporization, the heat of vaporization is taken away and a cooling effect can be obtained.

Further, a heat dissipation sleeve 12 with heat dissipation fins 13 is fitted and fixed around the upper portion of the heat dissipation body 5 .

In this cooling mechanism, the cooling gas 14 is supplied from the horizontal direction of the heat radiator 5, and the flow of the cooling gas 14 promotes heat dissipation from the heat radiator 5, the heat pipe 11, and the heat radiation fins 13.

Next, the operation of this embodiment will be explained.

Electric power (
By applying a power supply voltage, an electric signal, etc.), heat is generated from the semiconductor element of the semiconductor device 3.

This heat is conducted from the upper surface side of the semiconductor device 3 to the heat radiator 5 and the heat pipe 11 built therein, and is then radiated into the atmosphere from the heat radiator fins 13 of the sleeve 12 by the cooling action of the cooling gas 14. .

At this time, in this embodiment, the liquid sealed in the heat pipe 11 built into the heat sink 5 is vaporized by the heat from the semiconductor device 3 and rises.

Since the upper part of the heat pipe 11 has a lower temperature than the lower part, the base body 11 liquefies at the negative part of the heat pipe 11 and drips to the lower part. This liquid is vaporized again by the heat transferred from the semiconductor device 3 through the lower part of the heat sink 5, rises, and is further liquefied. In this way, when the liquid in the heat pipe 11 repeatedly vaporizes, heat of vaporization is taken away and the heat radiator 5 is cooled by the heat of vaporization.

Therefore, in this embodiment, the semiconductor device can be effectively cooled by the so-called air cooling method without using cooling water by the heat dissipation effect using the heat of vaporization, and the cooling structure is simple, compact, and low cost. It is cost l-.

[Embodiment 2] FIG. 2 is a partial cross-sectional view of a part of a heat sink in Embodiment 2 of the electronic component cooling mechanism according to the present invention.

The end surface of the heat pipe 11 in this embodiment is in direct contact with the package surface of the semiconductor device 3, and the end surface is formed in a straight line, thereby increasing the contact area between the end surface of the heat pipe 11 and the package surface of the semiconductor device 3. It is configured to

Therefore, according to this embodiment, more effective heat radiation is performed.

[Effect (1): Efficient cooling can be performed by bringing a heat radiator containing a built-in heat radiating element that uses vaporization heat into thermal conductive contact with electronic components.

(2) There is no need to supply cooling water, and the structure is simple.

(:(l) According to (2) above, cost reduction is achieved.

Although the invention made by the present inventor has been specifically explained based on Examples above, the present invention is not limited to the above-mentioned Examples, and it should be noted that various changes can be made without departing from the gist of the invention. Not even.

For example, in addition to the heat pipe, another type of heat dissipation element that utilizes vaporization heat can be used.

[Field of Application] In the above explanation, the invention made by the present inventor was mainly applied to a Marginob type module, which is the field of application that formed the background of the invention, but the invention is not limited to this, and for example, it can be applied to other applications. It can also be applied to various electronic components such as various types of semiconductor devices.

[Brief explanation of drawings]

FIG. 1 is a cross-sectional view of one embodiment of an electronic component cooling mechanism according to the present invention, and FIG. 2 is a partial cross-sectional view of a part of a heat dissipation rod in another embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Board, 2... Lead bin, 3... Semiconductor device (electronic component), 4... Soldering tap, 5... Heat radiation rod, 6... Spring, 7... Fixing Block, 8... Fixed plate, 9... Bolt, 10... Nut, 11...
Heatzumive (heat dissipation element using heat of vaporization), 12.
... Heat radiation sleeve, 13... Heat radiation fin, 14...
cooling gas.

Claims (1)

[Claims] 1. A heat dissipating body that is in thermal conductive contact with the surface of an electronic component mounted on a substrate is provided, and a heat dissipating element that utilizes vaporization heat is built into the heat dissipating body. Electronic component cooling mechanism. 2. The electronic component cooling mechanism according to claim 1, wherein the heat radiation rod is pressed against the electronic component by an elastic means. 3. The electronic component cooling mechanism according to claim 1, wherein the heat dissipation element that utilizes vaporization heat is a heat pipe.