CN208971851U - A kind of multifunctional efficient heat radiation type PCB heat board - Google Patents
A kind of multifunctional efficient heat radiation type PCB heat board Download PDFInfo
- Publication number
- CN208971851U CN208971851U CN201821383767.7U CN201821383767U CN208971851U CN 208971851 U CN208971851 U CN 208971851U CN 201821383767 U CN201821383767 U CN 201821383767U CN 208971851 U CN208971851 U CN 208971851U
- Authority
- CN
- China
- Prior art keywords
- heat
- layer
- pcb
- radiation type
- multifunctional efficient
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A kind of multifunctional efficient heat radiation type PCB heat board involved by the utility model comprising PCB substrate main body, a plurality of four-armed olfactometer elements, Plastic Package ball grid array element.Because PCB substrate main body includes top surface element layer, base component layer, ground plane, bus plane, the heat dissipating layer being set between bus plane and base component layer.The heat dissipating layer is that the thermal coefficient made of heat-dissipating aluminium plate material, using aluminium sheet or copper sheet is higher, and the speed ratio for conducting heat is very fast.When use, a plurality of four-armed olfactometer elements and Plastic Package ball grid array element generate amount of heat during the work time, the heat can be rapidly and efficiently transmitted on the heat-dissipating aluminium plate or copper sheet in the heat dissipating layer, and the peripheral equipment of pcb board periphery or pcb board is transmitted to by the heat dissipating layer, or by being radiated in ambient enviroment, the purpose for realizing rapid cooling, reach reduce printed circuit board in use because of failure rate caused by electronic equipment thermal failure.
Description
[technical field]
The utility model relates to a kind of multifunctional efficient heat radiation type PCB heat boards in circuit board technology field.
[background technique]
Modern electronic equipment industry development is rapid, different with semiconductor transistor manufacturing technology along with silicon integrated circuit plate
It breaks through, electronic chip increasingly tends to densification, densification above printed circuit board, and high power direction is developed.Member is sent out due to device
The technical problems such as heat and temperature rising are increasingly significant, so that electronic equipment thermal failure rate is continuously improved, lead to printed circuit board
Failure rate is relatively high in use.
[utility model content]
In view of this, can reduce printed circuit board the technical problem to be solved by the utility model is to provide one kind makes
With in the process because of the multifunctional efficient heat radiation type PCB heat board of failure rate caused by electronic equipment thermal failure.
Above-mentioned technical problem is solved thus, a kind of multifunctional efficient heat radiating type PCB of technical solution institute in the utility model
Plate comprising a plurality of four-armed olfactometer elements in PCB substrate body upper, plastic seal is respectively welded in PCB substrate main body
Fill ball grid array element；The PCB substrate main body includes the top surface element layer for being set to top, is set to the base component of lower section
Layer, the ground plane being set to below the element layer of top surface, the bus plane being set to above base component layer are set to bus plane and bottom
Heat dissipating layer between the element layer of face.
It further limits, the top surface element layer and base component layer are crushed to by epoxy glass fiber material respectively
's.
It further limiting, the ground plane is made of copper foil conductor layer,
It further limits, the bus plane is made of heat conductive silicon grease material.
It further limits, the heat dissipating layer is made of heat-dissipating aluminium plate material or copper sheet material.
The advantageous effects of the utility model: because the PCB substrate main body includes the top surface element layer for being set to top,
It is set to the base component layer of lower section, the ground plane being set to below the element layer of top surface, the electricity being set to above base component layer
Active layer, the heat dissipating layer being set between bus plane and base component layer.The heat dissipating layer is the benefit made of heat-dissipating aluminium plate material
Thermal coefficient with aluminium sheet or copper sheet is higher, and the speed ratio for conducting heat is very fast.In use, a plurality of four-armed olfactometer members
Part and Plastic Package ball grid array element generate amount of heat during the work time, which can rapidly and efficiently be transmitted to institute
It states on the heat-dissipating aluminium plate or copper sheet in heat dissipating layer, and is set by the periphery that the heat dissipating layer is transmitted to pcb board periphery or pcb board
It is standby, or by being radiated in ambient enviroment, realize the purpose of rapid cooling, reaching reduces printed circuit board in use
Because of failure rate caused by electronic equipment thermal failure.
With reference to the accompanying drawings and examples, the technical solution of the utility model is described in further detail.
[Detailed description of the invention]
Fig. 1 is the side schematic view of multifunctional efficient heat radiation type PCB heat board in the utility model；
Fig. 2 is the schematic rear view of multifunctional efficient heat radiation type PCB heat board in the utility model.
[specific embodiment]
In order to be clearer and more clear technical problem to be solved in the utility model, technical solution and beneficial effect, with
Under in conjunction with the accompanying drawings and embodiments, the present invention will be further described in detail.It should be appreciated that specific reality described herein
Example is applied only to explain the utility model, is not used to limit the utility model.
It please refers to shown in Fig. 1 and Fig. 2, illustrates a kind of multifunctional efficient heat radiation type PCB heat board below with reference to embodiment comprising
A plurality of four-armed olfactometer elements 1 in PCB substrate body upper, Plastic Package ball bar battle array is respectively welded in PCB substrate main body
Column element 2.
The PCB substrate main body includes the top surface element layer 3 for being set to top, is set to the base component layer 4 of lower section, if
The ground plane 5 being placed in below top surface element layer 3, the bus plane 6 being set to above base component layer 4, is set to bus plane 6 and bottom
Heat dissipating layer 7 between face element layer 4.The top surface element layer 3 and base component layer 4 are squeezed by epoxy glass fiber material respectively
It is pressed into.The ground plane 5 is made of copper foil conductor layer, and the bus plane 6 is made of heat conductive silicon grease material.It is described to dissipate
Thermosphere 7 is made of heat-dissipating aluminium plate material or copper sheet material.
When PCB substrate body of work, it is set to the resistance of PCB substrate body upper, capacitor, transformer, chip and four
Side flat package element, the components such as Plastic Package ball grid array element, will generate heat power consumption.Not due to each component temperature
Together, inconsistent identity element is in different location Temperature Distribution, heat flow be from high-temperature to transmitting at low temperature, root
Heat transfer, 3 kinds of modes such as thermal convection and heat radiation can be divided into according to PCB substrate main body thermaltransmission mode.In the present embodiment, institute
Thermaltransmission mode is stated as heat exchange pattern realization, which is the various electronics of pcb board contact with being set to above pcb board
Between component and therein, under the warm-up movement of molecule and the microcosmic particle of atom, ordinary circumstance, heat is by high temperature
The process transmitted to low temperature, as, the heat transmitted in the unit time.
In conclusion being set to the bottom of lower section because the PCB substrate main body includes the top surface element layer 3 for being set to top
Face element layer 4, the ground plane 5 being set to below top surface element layer 3, the bus plane 6 being set to above base component layer 4, setting
Heat dissipating layer 7 between bus plane 6 and base component layer 4.The heat dissipating layer 7 is to utilize aluminium made of heat-dissipating aluminium plate material
The thermal coefficient of plate or copper sheet is higher, and the speed ratio for conducting heat is very fast.In use, a plurality of four-armed olfactometer elements 1
Amount of heat is generated during the work time with Plastic Package ball grid array element 2, which can rapidly and efficiently be transmitted to institute
It states on the heat-dissipating aluminium plate or copper sheet in heat dissipating layer, and is transmitted to PCB substrate main body periphery or PCB base by the heat dissipating layer 7
The peripheral equipment of plate main body, or by being radiated in ambient enviroment, realize the purpose of rapid cooling, reach reduction printed circuit
Plate in use because of failure rate caused by electronic equipment thermal failure.
Above by reference to the preferred embodiment of Detailed description of the invention the utility model, not thereby limit to the right of the utility model
Range.Those skilled in the art do not depart from made any modification, equivalent replacement in the scope of the utility model and essence and change
Into should all be within the interest field of the utility model.
Claims (5)
1. a kind of multifunctional efficient heat radiation type PCB heat board comprising PCB substrate main body is respectively welded in PCB substrate body upper
A plurality of four-armed olfactometer elements, Plastic Package ball grid array element；It is characterized by: the PCB substrate main body includes setting
It is placed in the top surface element layer of top, is set to the base component layer of lower section, the ground plane being set to below the element layer of top surface, setting
Bus plane above base component layer, the heat dissipating layer being set between bus plane and base component layer.
2. multifunctional efficient heat radiation type PCB heat board according to claim 1, it is characterised in that: the top surface element layer and bottom surface
Element layer is crushed to by epoxy glass fiber material respectively.
3. multifunctional efficient heat radiation type PCB heat board according to claim 1, it is characterised in that: the ground plane is led by copper foil
Line layer is constituted.
4. multifunctional efficient heat radiation type PCB heat board according to claim 1, it is characterised in that: the bus plane is by thermal conductive silicon
Rouge material is made.
5. multifunctional efficient heat radiation type PCB heat board according to claim 1, it is characterised in that: the heat dissipating layer is by radiation aluminium
Made of plate material or copper sheet material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821383767.7U CN208971851U (en) | 2018-08-24 | 2018-08-24 | A kind of multifunctional efficient heat radiation type PCB heat board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821383767.7U CN208971851U (en) | 2018-08-24 | 2018-08-24 | A kind of multifunctional efficient heat radiation type PCB heat board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208971851U true CN208971851U (en) | 2019-06-11 |
Family
ID=66753582
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821383767.7U Active CN208971851U (en) | 2018-08-24 | 2018-08-24 | A kind of multifunctional efficient heat radiation type PCB heat board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208971851U (en) |
-
2018
- 2018-08-24 CN CN201821383767.7U patent/CN208971851U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101359604A (en) | Method, apparatus and system for strengthening chip cooling | |
| JPWO2020162417A1 (en) | Manufacturing methods for electronic devices, semiconductor devices, insulating sheets, and semiconductor devices | |
| JPH10260230A (en) | Apparatus for cooling heat-generating body | |
| CN206042519U (en) | Circuit board capable of fast radiating heat | |
| KR20090074487A (en) | Heat dissipation device for semiconductor package module and semiconductor package module having the same | |
| KR20220158685A (en) | Heterogeneous integrated module with thermal management unit | |
| US6552907B1 (en) | BGA heat ball plate spreader, BGA to PCB plate interface | |
| CN109588023B (en) | Heat dissipation structure and related equipment | |
| CN107708286A (en) | Printed circuit-board assembly | |
| CN104134637A (en) | Radiating structure for high-power logic chip PoP | |
| CN207053869U (en) | A kind of layer-stepping wiring board | |
| CN208971851U (en) | A kind of multifunctional efficient heat radiation type PCB heat board | |
| WO2019043835A1 (en) | Electronic device | |
| CN107172803B (en) | A kind of electronic equipment of high heat dissipation | |
| WO2020087411A1 (en) | Circuit board and supercomputing device | |
| JPH10294580A (en) | Heat transfer component for heat generating body | |
| CN102802347B (en) | Directed conductivity printed circuit board (PCB) and electronic equipment | |
| CN205122572U (en) | A QFN packaging structure for prevent short circuit among SMT | |
| CN208300108U (en) | A kind of accurate printed wiring board | |
| CN101908528A (en) | Electronic packaging structure and substrate thereof | |
| CN206196240U (en) | Heat radiation structure assembly of mobile terminal and mobile terminal | |
| CN219085966U (en) | Chip assembly | |
| CN212874483U (en) | Packaging structure of integrated circuit | |
| CN215266286U (en) | High-power heavy current diode encapsulation frame | |
| CN210467811U (en) | Chip with encryption and data storage functions |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518000 Longgang Street, Longgang District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Zhongxinhua Electronics Group Co., Ltd. Address before: 518000 Longgang Street, Longgang District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Zhongxinhua Electronics Co., Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20211027 Address after: 223000 Xingsheng Road North, Wangwang 2nd Road East, 235 provincial road south and Wangwang 5th Road West, Lianshui County, Huai'an City, Jiangsu Province Patentee after: Jiangsu Zhongxin Hua Electronic Technology Co.,Ltd. Address before: 518000 Longgang Street, Longgang District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Zhongxinhua Electronics Group Co.,Ltd. |
|
| TR01 | Transfer of patent right |