JPS6410666A - Manufacture of solid-state image sensing device - Google Patents

Manufacture of solid-state image sensing device

Info

Publication number
JPS6410666A
JPS6410666A JP62166532A JP16653287A JPS6410666A JP S6410666 A JPS6410666 A JP S6410666A JP 62166532 A JP62166532 A JP 62166532A JP 16653287 A JP16653287 A JP 16653287A JP S6410666 A JPS6410666 A JP S6410666A
Authority
JP
Japan
Prior art keywords
resin layer
transparent material
layer
external shape
thermoplastic resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62166532A
Other languages
Japanese (ja)
Other versions
JP2776810B2 (en
Inventor
Kazuaki Ogawa
Hiromi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP62166532A priority Critical patent/JP2776810B2/en
Publication of JPS6410666A publication Critical patent/JPS6410666A/en
Application granted granted Critical
Publication of JP2776810B2 publication Critical patent/JP2776810B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Abstract

PURPOSE:To resolve the problem concerning to the accuracy of a manufacturing process, and enlarge the selection range of transparent material, by transforming thermoplastic resin on a transparent material layer, and processing the transparent material layer by reflecting the shape of the transformed thermoplastic resin layer. CONSTITUTION:After the patterning of a thermoplastic resin layer 6, the resin layer 6 divided by every unit region U, is heated and transformed so as to have a gentle lens-type external shape R. By an anisotropic etching such as RIE applying said resin layer to a mask, selective elimination in the vertical direction is performed. The thermoplastic resin layer 6 also is gradually etched. When the whole part or a part of the resin layer 6 is etched, and a transparent material layer 5 is sufficiently processed, the etching is ended. The transparent material layer 5 has a lens-type external shape (r) reflecting the external shape R of the resin layer 6. The transparent material layer 5 having the lens-type external shape (r) is not formed by thermal deformation, so that material of high heat-resisting properties can be used, and the selection of material in a wide range is enabled.
JP62166532A 1987-07-03 1987-07-03 Method for manufacturing solid-state imaging device Expired - Lifetime JP2776810B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62166532A JP2776810B2 (en) 1987-07-03 1987-07-03 Method for manufacturing solid-state imaging device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62166532A JP2776810B2 (en) 1987-07-03 1987-07-03 Method for manufacturing solid-state imaging device

Publications (2)

Publication Number Publication Date
JPS6410666A true JPS6410666A (en) 1989-01-13
JP2776810B2 JP2776810B2 (en) 1998-07-16

Family

ID=15833039

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62166532A Expired - Lifetime JP2776810B2 (en) 1987-07-03 1987-07-03 Method for manufacturing solid-state imaging device

Country Status (1)

Country Link
JP (1) JP2776810B2 (en)

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992009105A1 (en) * 1990-11-16 1992-05-29 Kabushiki Kaisha Toshiba Solid-state imaging device and method of manufacturing the same
EP0502340A2 (en) * 1991-02-12 1992-09-09 Sony Corporation CCD solid state imager
US5426058A (en) * 1991-07-12 1995-06-20 Sharp Kabushiki Kaisha Method of manufacturing solid-state imaging device
JP2008103614A (en) * 2006-10-20 2008-05-01 Mitsui Eng & Shipbuild Co Ltd Photoelectric transducer device
WO2014065100A1 (en) 2012-10-23 2014-05-01 日産化学工業株式会社 Non-photosensitive resin composition
US9029467B2 (en) 2011-09-05 2015-05-12 Nissan Chemical Industries, Ltd. Resin composition
US9159760B2 (en) 2011-09-30 2015-10-13 Sony Corporation Solid-state imaging device with layered microlenses and method for manufacturing same
WO2016021348A1 (en) * 2014-08-08 2016-02-11 日産化学工業株式会社 Resin composition for flattened film or microlens
KR20160113593A (en) 2014-01-30 2016-09-30 닛산 가가쿠 고교 가부시키 가이샤 Resin composition for forming microlens
WO2017110393A1 (en) 2015-12-21 2017-06-29 日産化学工業株式会社 Resin composition
US9994685B2 (en) 2011-07-07 2018-06-12 Nissan Chemical Industries, Ltd. Resin composition
KR20180072697A (en) 2015-10-27 2018-06-29 닛산 가가쿠 고교 가부시키 가이샤 Polymers and resin compositions containing them
KR20190035615A (en) 2016-07-28 2019-04-03 닛산 가가쿠 가부시키가이샤 Resin composition
KR20210052452A (en) 2018-08-30 2021-05-10 닛산 가가쿠 가부시키가이샤 Negative photosensitive resin composition
KR20210092732A (en) 2018-11-21 2021-07-26 닛산 가가쿠 가부시키가이샤 Thermosetting resin composition
KR20220092416A (en) 2020-12-24 2022-07-01 도오꾜오까고오교 가부시끼가이샤 Curable resin composition, cured product thereof, method for producing cured film and method for producing microlens
KR20220098133A (en) 2019-11-06 2022-07-11 닛산 가가쿠 가부시키가이샤 Non-photosensitive resin composition
KR20240021719A (en) 2022-08-10 2024-02-19 도쿄 오카 고교 가부시키가이샤 Photosensitive resins composition
KR20240036559A (en) 2021-07-28 2024-03-20 닛산 가가쿠 가부시키가이샤 Positive photosensitive resin composition
KR20240037946A (en) 2021-07-28 2024-03-22 닛산 가가쿠 가부시키가이샤 Positive type photosensitive resin composition containing a specific copolymer

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7978255B2 (en) 2007-10-11 2011-07-12 Nikon Corporation Solid-state image sensor and image-capturing device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6060755A (en) * 1983-09-14 1985-04-08 Hitachi Ltd Manufacture of microlens
JPS6060757A (en) * 1983-09-14 1985-04-08 Hitachi Ltd Image pickup element with microlens and manufacture thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6060755A (en) * 1983-09-14 1985-04-08 Hitachi Ltd Manufacture of microlens
JPS6060757A (en) * 1983-09-14 1985-04-08 Hitachi Ltd Image pickup element with microlens and manufacture thereof

Cited By (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992009105A1 (en) * 1990-11-16 1992-05-29 Kabushiki Kaisha Toshiba Solid-state imaging device and method of manufacturing the same
EP0502340A2 (en) * 1991-02-12 1992-09-09 Sony Corporation CCD solid state imager
US5426058A (en) * 1991-07-12 1995-06-20 Sharp Kabushiki Kaisha Method of manufacturing solid-state imaging device
JP2008103614A (en) * 2006-10-20 2008-05-01 Mitsui Eng & Shipbuild Co Ltd Photoelectric transducer device
US9994685B2 (en) 2011-07-07 2018-06-12 Nissan Chemical Industries, Ltd. Resin composition
US9029467B2 (en) 2011-09-05 2015-05-12 Nissan Chemical Industries, Ltd. Resin composition
US11211417B2 (en) 2011-09-30 2021-12-28 Sony Corporation Solid-state imaging device with layered microlenses and method for manufacturing same
US9159760B2 (en) 2011-09-30 2015-10-13 Sony Corporation Solid-state imaging device with layered microlenses and method for manufacturing same
US11699712B2 (en) 2011-09-30 2023-07-11 Sony Group Corporation Solid-state imaging device with layered microlenses and method for manufacturing same
US10355038B2 (en) 2011-09-30 2019-07-16 Sony Corporation Solid-state imaging device with layered microlenses and method for manufacturing same
US9741757B2 (en) 2011-09-30 2017-08-22 Sony Corporation Solid-state imaging device with layered microlenses and method for manufacturing same
KR20150079674A (en) 2012-10-23 2015-07-08 닛산 가가쿠 고교 가부시키 가이샤 Non-photosensitive resin composition
JPWO2014065100A1 (en) * 2012-10-23 2016-09-08 日産化学工業株式会社 Non-photosensitive resin composition
WO2014065100A1 (en) 2012-10-23 2014-05-01 日産化学工業株式会社 Non-photosensitive resin composition
US9823391B2 (en) 2012-10-23 2017-11-21 Nissan Chemical Industries, Ltd. Non-photosensitive resin composition
KR20160113593A (en) 2014-01-30 2016-09-30 닛산 가가쿠 고교 가부시키 가이샤 Resin composition for forming microlens
WO2016021348A1 (en) * 2014-08-08 2016-02-11 日産化学工業株式会社 Resin composition for flattened film or microlens
KR20170041665A (en) 2014-08-08 2017-04-17 닛산 가가쿠 고교 가부시키 가이샤 Resin composition for flattened film or microlens
JPWO2016021348A1 (en) * 2014-08-08 2017-05-25 日産化学工業株式会社 Resin composition for flattening film or microlens
US10487205B2 (en) 2014-08-08 2019-11-26 Nissan Chemical Industries, Ltd. Resin composition for flattened film or microlens
KR20180072697A (en) 2015-10-27 2018-06-29 닛산 가가쿠 고교 가부시키 가이샤 Polymers and resin compositions containing them
US10793677B2 (en) 2015-10-27 2020-10-06 Nissan Chemical Industries, Ltd. Polymer and resin composition containing the same
US10752714B2 (en) 2015-12-21 2020-08-25 Nissan Chemical Industries, Ltd. Resin composition
KR20180097524A (en) 2015-12-21 2018-08-31 닛산 가가쿠 가부시키가이샤 Resin composition
WO2017110393A1 (en) 2015-12-21 2017-06-29 日産化学工業株式会社 Resin composition
KR20190035615A (en) 2016-07-28 2019-04-03 닛산 가가쿠 가부시키가이샤 Resin composition
KR20210052452A (en) 2018-08-30 2021-05-10 닛산 가가쿠 가부시키가이샤 Negative photosensitive resin composition
KR20210092732A (en) 2018-11-21 2021-07-26 닛산 가가쿠 가부시키가이샤 Thermosetting resin composition
KR20220098133A (en) 2019-11-06 2022-07-11 닛산 가가쿠 가부시키가이샤 Non-photosensitive resin composition
KR20220092416A (en) 2020-12-24 2022-07-01 도오꾜오까고오교 가부시끼가이샤 Curable resin composition, cured product thereof, method for producing cured film and method for producing microlens
KR20240036559A (en) 2021-07-28 2024-03-20 닛산 가가쿠 가부시키가이샤 Positive photosensitive resin composition
KR20240037946A (en) 2021-07-28 2024-03-22 닛산 가가쿠 가부시키가이샤 Positive type photosensitive resin composition containing a specific copolymer
KR20240021719A (en) 2022-08-10 2024-02-19 도쿄 오카 고교 가부시키가이샤 Photosensitive resins composition

Also Published As

Publication number Publication date
JP2776810B2 (en) 1998-07-16

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