JPS6399557A - セラミツク基板における端子部と金属リ−ドとの接続方法 - Google Patents
セラミツク基板における端子部と金属リ−ドとの接続方法Info
- Publication number
- JPS6399557A JPS6399557A JP20123186A JP20123186A JPS6399557A JP S6399557 A JPS6399557 A JP S6399557A JP 20123186 A JP20123186 A JP 20123186A JP 20123186 A JP20123186 A JP 20123186A JP S6399557 A JPS6399557 A JP S6399557A
- Authority
- JP
- Japan
- Prior art keywords
- barrier layer
- substrate
- terminal part
- pure
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 24
- 239000000919 ceramic Substances 0.000 title claims abstract description 12
- 238000000034 method Methods 0.000 title claims description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 title 1
- 229910052751 metal Inorganic materials 0.000 claims abstract description 23
- 239000002184 metal Substances 0.000 claims abstract description 23
- 239000000463 material Substances 0.000 claims abstract description 19
- 230000004888 barrier function Effects 0.000 claims abstract description 16
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 4
- 238000005219 brazing Methods 0.000 claims description 20
- 238000005476 soldering Methods 0.000 abstract description 8
- 229910052763 palladium Inorganic materials 0.000 abstract description 4
- 238000009792 diffusion process Methods 0.000 abstract description 3
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 abstract description 2
- 229910045601 alloy Inorganic materials 0.000 abstract description 2
- 239000000956 alloy Substances 0.000 abstract description 2
- 238000007747 plating Methods 0.000 abstract description 2
- 229910052697 platinum Inorganic materials 0.000 abstract description 2
- 239000011521 glass Substances 0.000 description 10
- 239000010410 layer Substances 0.000 description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 230000005496 eutectics Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 2
- 239000005388 borosilicate glass Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910004490 TaAl Inorganic materials 0.000 description 1
- -1 TaN Chemical class 0.000 description 1
- 229910001080 W alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/089,762 US4801067A (en) | 1986-08-29 | 1987-08-27 | Method of connecting metal conductor to ceramic substrate |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61-101164 | 1986-05-02 | ||
| JP10116486 | 1986-05-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6399557A true JPS6399557A (ja) | 1988-04-30 |
| JPH0545064B2 JPH0545064B2 (enrdf_load_stackoverflow) | 1993-07-08 |
Family
ID=14293395
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20123186A Granted JPS6399557A (ja) | 1986-05-02 | 1986-08-29 | セラミツク基板における端子部と金属リ−ドとの接続方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6399557A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6864579B2 (en) * | 2001-01-25 | 2005-03-08 | Siemens Aktiengesellschaft | Carrier with a metal area and at least one chip configured on the metal area |
-
1986
- 1986-08-29 JP JP20123186A patent/JPS6399557A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6864579B2 (en) * | 2001-01-25 | 2005-03-08 | Siemens Aktiengesellschaft | Carrier with a metal area and at least one chip configured on the metal area |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0545064B2 (enrdf_load_stackoverflow) | 1993-07-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |