JPS6399240A - ポリイミドフイルムの製造方法 - Google Patents

ポリイミドフイルムの製造方法

Info

Publication number
JPS6399240A
JPS6399240A JP24652786A JP24652786A JPS6399240A JP S6399240 A JPS6399240 A JP S6399240A JP 24652786 A JP24652786 A JP 24652786A JP 24652786 A JP24652786 A JP 24652786A JP S6399240 A JPS6399240 A JP S6399240A
Authority
JP
Japan
Prior art keywords
film
dope
inorganic particles
polyimide
solvent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP24652786A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0588852B2 (enrdf_load_stackoverflow
Inventor
Hisanori Hirata
平田 久典
Yoshiki Takeoka
武岡 慶樹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kanegafuchi Chemical Industry Co Ltd
Original Assignee
Kanegafuchi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanegafuchi Chemical Industry Co Ltd filed Critical Kanegafuchi Chemical Industry Co Ltd
Priority to JP24652786A priority Critical patent/JPS6399240A/ja
Publication of JPS6399240A publication Critical patent/JPS6399240A/ja
Publication of JPH0588852B2 publication Critical patent/JPH0588852B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/0346Organic insulating material consisting of one material containing N
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers

Landscapes

  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Moulding By Coating Moulds (AREA)
JP24652786A 1986-10-16 1986-10-16 ポリイミドフイルムの製造方法 Granted JPS6399240A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24652786A JPS6399240A (ja) 1986-10-16 1986-10-16 ポリイミドフイルムの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24652786A JPS6399240A (ja) 1986-10-16 1986-10-16 ポリイミドフイルムの製造方法

Publications (2)

Publication Number Publication Date
JPS6399240A true JPS6399240A (ja) 1988-04-30
JPH0588852B2 JPH0588852B2 (enrdf_load_stackoverflow) 1993-12-24

Family

ID=17149729

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24652786A Granted JPS6399240A (ja) 1986-10-16 1986-10-16 ポリイミドフイルムの製造方法

Country Status (1)

Country Link
JP (1) JPS6399240A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007098675A (ja) * 2005-09-30 2007-04-19 Kaneka Corp 積層ポリイミドフィルム及び該積層ポリイミドフィルムの製造方法

Also Published As

Publication number Publication date
JPH0588852B2 (enrdf_load_stackoverflow) 1993-12-24

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