JPS639574B2 - - Google Patents

Info

Publication number
JPS639574B2
JPS639574B2 JP57158212A JP15821282A JPS639574B2 JP S639574 B2 JPS639574 B2 JP S639574B2 JP 57158212 A JP57158212 A JP 57158212A JP 15821282 A JP15821282 A JP 15821282A JP S639574 B2 JPS639574 B2 JP S639574B2
Authority
JP
Japan
Prior art keywords
copper
alloy
nickel
zinc
oxygen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57158212A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5947751A (ja
Inventor
Susumu Kawauchi
Masahiro Tsuji
Michiharu Yamamoto
Original Assignee
Nippon Mining Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co filed Critical Nippon Mining Co
Priority to JP57158212A priority Critical patent/JPS5947751A/ja
Publication of JPS5947751A publication Critical patent/JPS5947751A/ja
Publication of JPS639574B2 publication Critical patent/JPS639574B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]

Landscapes

  • Conductive Materials (AREA)
JP57158212A 1982-09-13 1982-09-13 半導体機器のリ−ド材用銅合金 Granted JPS5947751A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57158212A JPS5947751A (ja) 1982-09-13 1982-09-13 半導体機器のリ−ド材用銅合金

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57158212A JPS5947751A (ja) 1982-09-13 1982-09-13 半導体機器のリ−ド材用銅合金

Publications (2)

Publication Number Publication Date
JPS5947751A JPS5947751A (ja) 1984-03-17
JPS639574B2 true JPS639574B2 (enExample) 1988-02-29

Family

ID=15666727

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57158212A Granted JPS5947751A (ja) 1982-09-13 1982-09-13 半導体機器のリ−ド材用銅合金

Country Status (1)

Country Link
JP (1) JPS5947751A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11606539B1 (en) 2017-12-21 2023-03-14 Apple Inc. Imaging system

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4914345A (en) * 1988-03-04 1990-04-03 General Electric Company Corrosion resistant base for electric lamps
US6471792B1 (en) 1998-11-16 2002-10-29 Olin Corporation Stress relaxation resistant brass
KR101092616B1 (ko) * 2008-04-29 2011-12-13 일진머티리얼즈 주식회사 전자 부품용 금속 프레임
CN103938020A (zh) * 2014-03-24 2014-07-23 北京华元盛鸿机械设备有限公司 一种新型白铜及其加工方法
KR102592564B1 (ko) * 2016-06-13 2023-10-23 삼성디스플레이 주식회사 트랜지스터 표시판

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11606539B1 (en) 2017-12-21 2023-03-14 Apple Inc. Imaging system
US12041394B2 (en) 2017-12-21 2024-07-16 Apple Inc. Imaging system

Also Published As

Publication number Publication date
JPS5947751A (ja) 1984-03-17

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