JPS639008A - Production of thin film magnetic head - Google Patents
Production of thin film magnetic headInfo
- Publication number
- JPS639008A JPS639008A JP15166786A JP15166786A JPS639008A JP S639008 A JPS639008 A JP S639008A JP 15166786 A JP15166786 A JP 15166786A JP 15166786 A JP15166786 A JP 15166786A JP S639008 A JPS639008 A JP S639008A
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- organic insulating
- magnetic head
- taper
- gap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010409 thin film Substances 0.000 title claims description 13
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 238000010884 ion-beam technique Methods 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 claims abstract description 10
- 239000000758 substrate Substances 0.000 claims abstract description 7
- 239000010408 film Substances 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 12
- 239000000696 magnetic material Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 238000005530 etching Methods 0.000 abstract description 6
- 238000001039 wet etching Methods 0.000 abstract description 6
- 229920002120 photoresistant polymer Polymers 0.000 abstract description 3
- 229910052760 oxygen Inorganic materials 0.000 abstract description 2
- 239000001301 oxygen Substances 0.000 abstract description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 1
- 229910052593 corundum Inorganic materials 0.000 abstract 1
- 229910001845 yogo sapphire Inorganic materials 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 230000001133 acceleration Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- WHOPEPSOPUIRQQ-UHFFFAOYSA-N oxoaluminum Chemical compound O1[Al]O[Al]1 WHOPEPSOPUIRQQ-UHFFFAOYSA-N 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Magnetic Heads (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は薄膜磁気ヘッドに係り、特に、高精度の磁気ヘ
ッド先端部の有機絶縁膜のテーパ角、並びにギャップ深
さが得られる薄膜磁気ヘッドの製造方法に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a thin film magnetic head, and in particular to a thin film magnetic head that can obtain a highly accurate taper angle of an organic insulating film at the tip of the magnetic head and a gap depth. Relating to a manufacturing method.
従来の薄膜磁気ヘッドにおいて、磁気ヘッド先端部の有
機絶縁膜のテーパ角の加工は、第２図（ａ）に示すよう
に、有機絶縁膜６をスピン塗布。In a conventional thin-film magnetic head, the taper angle of the organic insulating film at the tip of the magnetic head is processed by spin coating an organic insulating film 6, as shown in FIG. 2(a).
熱硬化により形成した上にホトレジストパターン９を形
成し、次に（ｂ）に示すようにウェットエツチングによ
り有機絶縁膜端部をテーパ加工し、テーパ形状を得てい
た。また、ギャップ深さの加工は、（Ｃ）に示すように
有機絶縁膜６をマスクにしてギャップ材をエツチングし
１次に（ｄ）に示すように再び、有機絶縁物をエツチン
グし、ギャップ材４の先端点Ａより有機絶縁膜先端点Ｂ
を後退させ、この後退量をギャップ深さとして加工して
いた（実開昭６０−１６２３３３号公報参照）。しかし
、ウェットエツチング等の方法でテーパ形状の加工を行
うと、レジスト厚さ及び有機絶縁膜の膜厚等のばらつき
により、テーパ形状は、第３図（ａ）あるいは（ｂ）の
ように変動し、（ａ）のようなテーパ形状を呈すると、
絶縁破壊を起こし易くなる。また、（ｂ）のような形状
では上部磁性膜のカバレージが悪くなり、電気特性が得
られない、そのため、電気的特性の良好な薄膜磁気ヘッ
ドを得るには、（ｃ）に示す形状で、しかも角度一定に
加工しなければならない。また、テーパ形状並びにテー
パ角が異なると、磁気ギャップの加工工程で有機絶縁膜
の後退量が、同一条件で有機絶縁膜のエツチングを行っ
ても異なるので、磁気ギャップ深さのばらつきが大きく
なる。A photoresist pattern 9 was formed on the formed film by thermosetting, and then, as shown in (b), the end portion of the organic insulating film was tapered by wet etching to obtain a tapered shape. In addition, the gap depth is processed by etching the gap material using the organic insulating film 6 as a mask, as shown in (C), and then etching the organic insulator again as shown in (d). From the tip point A of 4 to the organic insulating film tip point B
was retracted, and the amount of retraction was used as the gap depth (see Japanese Utility Model Application No. 162333/1983). However, when a taper shape is processed using a method such as wet etching, the taper shape changes as shown in Figure 3 (a) or (b) due to variations in the resist thickness, organic insulating film thickness, etc. , if it exhibits a tapered shape as shown in (a),
Dielectric breakdown is more likely to occur. In addition, with the shape shown in (b), the coverage of the upper magnetic film is poor and electrical characteristics cannot be obtained.Therefore, in order to obtain a thin film magnetic head with good electrical characteristics, the shape shown in (c) is required. Moreover, it must be machined at a constant angle. Furthermore, if the taper shape and taper angle are different, the amount of retraction of the organic insulating film during the magnetic gap processing process will be different even if the organic insulating film is etched under the same conditions, resulting in large variations in the magnetic gap depth.
上記従来技術は、薄膜磁気ヘッド先端部の絶縁膜端部の
テーパ加工について、形状並びに角度とも再現よく高精
度に加工する点について、配慮がされておらず、電気的
特性の均一な磁気ヘッドを製造するためには歩留りが低
く問題があった。The above-mentioned conventional technology does not take into account the need to process the end of the insulating film at the tip of the thin-film magnetic head with high accuracy and reproducibility in terms of shape and angle, resulting in a magnetic head with uniform electrical characteristics. There was a problem with low yield in manufacturing.
本発明の目的は、常に同一のテーパ形状で、かつ、高精
度のテーパ角度及びギャップ深さが得られ、電気的特性
の安定した薄膜磁気ヘッドの製造方法を提供することに
ある。An object of the present invention is to provide a method for manufacturing a thin film magnetic head that always has the same taper shape, a highly accurate taper angle and gap depth, and has stable electrical characteristics.
本発明は、有機絶縁膜を所定のパターンにテーパエツチ
ング加工したのち、磁気ヘッド先端部の端部のみ集束イ
オンビームを用いてテーパ加工を行う、その際、ギャッ
プ材も同時に加工した後。In the present invention, after taper-etching an organic insulating film into a predetermined pattern, taper-etching is performed using a focused ion beam only at the end of the tip of the magnetic head, and at this time, the gap material is also processed at the same time.
さらに有機絶縁膜をエツチングする。集束イオンビーム
を用いると、テーパ部の斜面は直線状になり、また、基
板に対するビームの角度でテーパ角が決まるので、再現
性よく、高精度の角度及び形状が得られる。また、テー
パ加工と同時にギャップ材も加工でき、テーパ形状、角
度も安定するのでギャップ深さのばらつきは減少する。Furthermore, the organic insulating film is etched. When a focused ion beam is used, the slope of the tapered portion becomes linear, and since the taper angle is determined by the angle of the beam with respect to the substrate, a highly accurate angle and shape can be obtained with good reproducibility. Furthermore, the gap material can be processed at the same time as the taper process, and the taper shape and angle are stabilized, so variations in gap depth are reduced.
以下、本発明の一実施例を第１図により説明する。第１
図（ａ）において、基板１上に、下地膜２を介して、下
部磁性体３と形成する。次に、ギャップ材４．導体コイ
ル５．有機絶縁膜６を順次形成する。有機絶縁膜６はス
ピン塗布後、真空中で熱硬化させることにより形成して
、ホトレンジスト９のパターンを形成する１次に、（ｂ
）に示すように、ウェットエツチングにより、テーパ形
状に加工を行う、テーパ角度は、何度でもかまわないが
１次工程の集束イオンビームの加工角に近い角度にする
方が、集束イオンビーム加工時間が短くなるので望まし
い６次に、（Ｃ）工程で集束イオンビームで高精度に、
テーパ加工を行う。その際、有機絶縁膜６の下部のギャ
ップ材４も同時に加工する０本実施例では、ギャップ材
にＡｌ２Ｏ２゜有機絶縁膜はポリイミド樹脂を用い、基
板をビームに対し４０℃傾けて磁気ヘッド先端の有機絶
縁膜の端部に照射し、テーパ加工を行った。イオンビー
ムはＣＦａ雰囲気中で、加速電気１００ＫＶで行った。An embodiment of the present invention will be described below with reference to FIG. 1st
In Figure (a), a lower magnetic body 3 is formed on a substrate 1 with a base film 2 interposed therebetween. Next, gap material 4. Conductor coil5. Organic insulating films 6 are sequentially formed. The organic insulating film 6 is formed by thermally curing in vacuum after spin coating, and the first step (b) for forming the photoresist pattern 9 is performed.
), wet etching is used to process a tapered shape. Although the taper angle can be set at any number of times, it is better to use an angle close to the focused ion beam processing angle in the primary process to reduce the focused ion beam processing time. The 6th step, which is desirable because it shortens the time, is the step (C) where the focused ion beam
Perform taper processing. At this time, the gap material 4 under the organic insulating film 6 is also processed at the same time. In this embodiment, Al2O2° is used as the gap material, polyimide resin is used as the organic insulating film, and the substrate is tilted by 40 degrees with respect to the beam to form the tip of the magnetic head. The edge of the organic insulating film was irradiated and tapered. The ion beam was performed in a CFa atmosphere with an acceleration electricity of 100 KV.
次に、第１図（ｄ）工程で、再び、有機絶縁膜６をエツ
チングしてギャップ深さの加工を行う。Next, in the step of FIG. 1(d), the organic insulating film 6 is etched again to process the gap depth.
ギャップ深さ加工は、有機絶縁膜６の先端がヘッドの先
端に露出しているとクラッシュが発生するので、ヘッド
先端（ギャップ材先端Ａ）から有機絶縁膜先端点Ｂを後
退させるためであり、本実施例では酸素イオンミーリン
グ装置を用い、加速電圧４００ｖで有機絶縁物のみエツ
チングした０次に（ａ）工程に示すように上部磁性体７
．保護膜８を形成し、磁気ヘッド素子を製造する。The purpose of gap depth processing is to retreat the organic insulating film tip point B from the head tip (gap material tip A), since a crash will occur if the tip of the organic insulating film 6 is exposed at the tip of the head. In this example, an oxygen ion milling device was used to etch only the organic insulator at an accelerating voltage of 400 V. As shown in step (a), the upper magnetic material 7
．． A protective film 8 is formed and a magnetic head element is manufactured.
本実施例によれば、ウエツチエッチングによリテーパ形
状に加工後、電気特性に大きく影響を及ぼす磁気ヘッド
先端部の有機絶縁物の端部のみ集束イオンビームでテー
パ加工するので、能率良く、テーパ角度及び形状を高精
度に加工出来る。また、素子が異なっても、集束イオン
ビーム加工により、テーパ形状が一定となるので、後工
程のギャップ深さの加工精度の向上が得られる。また、
基板面内に多数の素子を形成する場合にも集束イオンビ
ーム加工は、ウェットエツチングと異なり、レジストを
使用しないのでレジストの影響はない。また、絶縁膜の
膜厚のバラツキの影響もほとんどない。さらに、テ２−
パ角度はビームと基板の角度でほぼ決定され、加速電圧
等の影響も受けないので。According to this embodiment, after processing into a re-taper shape by wet etching, only the end of the organic insulator at the tip of the magnetic head, which greatly affects the electrical characteristics, is tapered using a focused ion beam. Angles and shapes can be processed with high precision. Further, even if the elements are different, the taper shape remains constant through focused ion beam processing, so that the processing accuracy of the gap depth in the subsequent process can be improved. Also,
Unlike wet etching, focused ion beam processing does not use a resist and is not affected by the resist even when forming a large number of elements within the substrate surface. Furthermore, there is almost no influence from variations in the thickness of the insulating film. Furthermore, Te2-
The path angle is almost determined by the angle between the beam and the substrate, and is not affected by acceleration voltage, etc.
高精度の加工が得られ、テーパ角、ギャップ深さの均一
な薄膜磁気ヘッドを製造することができる。High-precision processing can be obtained, and a thin-film magnetic head with a uniform taper angle and gap depth can be manufactured.
本発明によれば、磁気ヘッド先端のテーパ形状、ギャッ
プ深さの均一な薄膜ヘッドを製造することができるので
、電気的特性の均一な薄膜ヘッドが得られ、製造プロセ
スにおける歩留りを高めることができる。According to the present invention, it is possible to manufacture a thin film head with a uniform tapered shape at the tip of the magnetic head and a uniform gap depth, so a thin film head with uniform electrical characteristics can be obtained, and the yield in the manufacturing process can be increased. .
第１図は本発明の一実施例の薄膜磁気ヘッドの製造方法
を示す工程図、第２図は従来技術の製造方法の工程図、
第３図はテーパ形状の説明図である。
６・・・有機絶縁膜。FIG. 1 is a process diagram showing a method of manufacturing a thin film magnetic head according to an embodiment of the present invention, FIG. 2 is a process diagram of a conventional manufacturing method,
FIG. 3 is an explanatory diagram of the tapered shape. 6...Organic insulating film.
Claims (1)
機絶縁膜及び上部磁性体を形成した薄膜磁気ヘッドにお
いて、 前記有機絶縁膜の磁気ヘッドの先端部を集束イオンビー
ムを用いて、テーパ加工し、前記ギャップ材をエッチン
グ加工した後に、前記有機絶縁膜をエッチングし、ギャ
ップ深さの形成を行うことを特徴とする薄膜磁気ヘッド
の製造方法。[Claims] 1. In a thin film magnetic head in which a lower magnetic material, a gap material, a conductor coil, an organic insulating film, and an upper magnetic material are formed on a substrate, the tip of the magnetic head of the organic insulating film is targeted with a focused ion beam. A method for manufacturing a thin-film magnetic head, characterized in that the organic insulating film is etched to form a gap depth after the gap material is etched.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15166786A JPS639008A (en) | 1986-06-30 | 1986-06-30 | Production of thin film magnetic head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15166786A JPS639008A (en) | 1986-06-30 | 1986-06-30 | Production of thin film magnetic head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS639008A true JPS639008A (en) | 1988-01-14 |
Family
ID=15523600
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15166786A Pending JPS639008A (en) | 1986-06-30 | 1986-06-30 | Production of thin film magnetic head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS639008A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0452846A2 (en) * | 1990-04-16 | 1991-10-23 | Hitachi, Ltd. | Narrow track thin film magnetic head and fabrication method thereof |
-
1986
- 1986-06-30 JP JP15166786A patent/JPS639008A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0452846A2 (en) * | 1990-04-16 | 1991-10-23 | Hitachi, Ltd. | Narrow track thin film magnetic head and fabrication method thereof |
| US5850326A (en) * | 1990-04-16 | 1998-12-15 | Hitachi, Ltd. | Narrow track thin film magnetic head suitable for high density recording and reproducing operations and fabrication method thereof wherein an air bearing surface has at least one groove containing a non-magnetic electrically conductive layer |
| US6111723A (en) * | 1990-04-16 | 2000-08-29 | Hitachi, Ltd. | Narrow track thin film magnetic head suitable for high density recording and reproducing operations and fabrication method thereof wherein an air bearing surface has at least one groove containing a non-magnetic electrically conductive layer |
| US6278578B1 (en) | 1990-04-16 | 2001-08-21 | Hitachi, Ltd. | Narrow track thin film head having a focused ion beam etched air bearing surface |
| US6307707B1 (en) | 1990-04-16 | 2001-10-23 | Hitachi, Ltd. | Narrow track thin film head including magnetic poles machined by focused ion beam etching |
| US6538844B2 (en) | 1990-04-16 | 2003-03-25 | Hitachi, Ltd. | Method of fabricating a magnetic head by focused ion beam etching |
| US6665141B2 (en) | 1990-04-16 | 2003-12-16 | Hitachi, Ltd. | Magnetic head having track width defined by trench portions filled with magnetic shield material |
| US6839200B2 (en) | 1990-04-16 | 2005-01-04 | Hitachi, Ltd. | Combination perpendicular magnetic head having shield material formed at both ends of an upper pole of a write element |
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