JPS62236115A - Production of thin film magnetic head - Google Patents

Abstract

PURPOSE:To form an org. resin layer to a film thickness of high accuracy by forming the org. resin layer to the large film thickness until prescribed flatness is obtd. and etching the layer to a prescribed shape, then selectively etching the org. resin layer to the necessary film thickness. CONSTITUTION:An underlying film 2, a lower magnetic material 3, a gap material 4 and a conductor coil 5 are respectively formed on a substrate 1, then the org. resin layer 6 is formed. The coated film thickness of the org. resin layer 6 is determined by the flatness required for the org. resin layer 6 on the conductor coil 5. The coated film thickness varies with the coil shape, inter-coil spacing, viscosity of an org. resin, amt. of the resin, etc., and said layer is thickly coated until the required flatness is obtd. A photoresist is coated on the org. resin layer 6 and is etched after baking of a pattern. The org. resin layer 6 is further made thinner down to the required film thickness by, for example, oxygen ion milling.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for manufacturing a thin-film magnetic head, and in particular, to a method for manufacturing a thin-film magnetic head, in particular a method for making the thickness of an organic resin layer forming an insulating layer uniform to a predetermined thickness;
The present invention also relates to a method of manufacturing a thin film magnetic head suitable for simplifying the manufacturing process.

[Conventional technology]

In the conventional manufacturing method of thin film magnetic heads,
As disclosed in Japanese Patent No. 9-104718, the thickness of the organic resin layer was made uniform in a linear manner. First, an organic resin is coated sufficiently thickly and cured by heat until a predetermined flatness is obtained.Then, the organic resin layer with a predetermined flatness is coated with oxygen ion milling until it becomes thinner than the required film thickness. After etching, the altered layer on the machined surface is removed. Further, an organic resin is coated thereon and thermally cured to obtain the required film thickness. Thereafter, dry etching or wet etching is performed into a predetermined shape.

[Problem that the invention seeks to solve]

The above-mentioned conventional method for manufacturing an El film magnetic disk includes the steps of etching the organic resin layer by oxygen ion milling until it becomes thinner than the required thickness, and then re-applying the organic resin to a predetermined thickness. are doing. However, it is difficult to measure the thickness of the organic resin layer with high precision and re-apply the organic resin so as to obtain a predetermined thickness. Furthermore, it also includes steps that affect the thickness of the organic resin layer, such as removal of a modified layer on the processed surface, and there is a problem in that the accuracy of the thickness of the organic resin layer is poor. As a result, there was a problem in that the flatness of the upper magnetic body formed above the organic resin layer deteriorated.

In addition, the altered layer on the machined surface caused by oxygen ion milling is a hindrance to primary wet etching and dry etching (
In the case of wet etching, the processed surface deteriorated layer is less etched (<< in the case of dry etching, uneven etching occurs). Therefore, it becomes necessary to remove the altered layer on the machined surface, and there is a problem in that it requires complicated steps such as recoating the organic resin and measuring the film thickness of the organic resin at that time.

The present invention has been made in view of the problems of the prior art described above, and improves the accuracy of the organic resin film thickness of a thin film magnetic head that uses an organic resin layer as an insulating layer between JFGs.

This makes it possible to form an upper magnetic body with good flatness,
Another object of the present invention is to provide a method for manufacturing a thin film magnetic head that does not require complicated manufacturing processes.

[Means for solving problems]

The method for manufacturing a thin film magnetic head of the present invention includes sequentially forming a lower magnetic material, a gap material, at least one conductor coil, at least one organic resin layer, an upper magnetic material, and a protective film on a substrate, In particular, the organic resin layer is formed thickly until a predetermined flatness is obtained, then wet etched or dry etched into a predetermined shape, and then only the organic resin layer is selectively etched to obtain a predetermined film thickness. It is characterized by obtaining an organic resin layer of.

[Effect]

According to the method for manufacturing a W film magnetic head of the present invention as described above,
The organic resin layer is formed thickly until a predetermined flatness is obtained,
Thereafter, first wet etching or dry etching is performed to form a predetermined shape. After a predetermined shape is obtained, only the organic resin layer is selectively etched to obtain an organic resin layer with a predetermined thickness.

Therefore, since wet etching or dry etching for forming the shape is performed before adjusting the thickness of the organic resin layer, it is not necessary to remove the altered layer on the processed surface of the organic resin layer. Moreover, re-coating of organic resin and heat curing treatment become unnecessary. Therefore,
This simplifies the work process and eliminates the causes of variations in the thickness of the organic resin layer, making it possible to adjust the thickness of the organic resin layer with high precision. As a result, the upper magnetic body provided on the organic resin layer can have good flatness, and a thin film magnetic head with stable performance and high reliability can be manufactured.

〔Example〕

Hereinafter, the present invention will be explained in more detail with reference to embodiments shown in the accompanying drawings.

Figure 1 (a), (b), (c), (d)
*(e) is a cross-sectional view according to the manufacturing process of the m-film magnetic head according to the present invention.

First, as shown in FIG. 1(a), a base film 2, a lower magnetic body 3, a gap material 4, and a conductor coil 5 are formed on a ceramic substrate 1, respectively. Next, as shown in FIG. 1(b), an organic resin layer 6 is formed.

This organic resin layer 6 is formed by spin coating an organic resin and thermally curing it. The coating thickness of the organic resin layer 6 is determined by the flatness required of the organic resin layer 6 on the conductor coil (hereinafter simply referred to as "coil") 5. For example, the coil thickness is 1.5 μm.

When the coil width is 8 μm and the coil spacing is 4 μm, if polyimide-based organic resin is used, a thickness of about 6 μm is required to achieve a flatness of 0.1 μm or less. The thickness of this coating film varies depending on the coil shape, coil spacing, organic resin viscosity, resin amount, etc., but the coating should be thick until the required flatness is obtained. Moreover, this application does not necessarily have to be performed at once, but may be performed in several parts.

Next, a photoresist is applied onto the organic resin layer 6, and after pattern baking, etching is performed. This etching is for obtaining a predetermined shape, and may be dry etching or wet etching. At the end of this process,
A structure as shown in FIG. 1(C) is obtained.

Next, as shown in FIG. 1(d), the organic resin layer 6 is thinned to a required thickness by oxygen ion milling.

Oxygen pressure 1.6 x 10-' Torr, acceleration voltage 5
Under oxygen ion milling conditions of 00V and ion incidence angle of 30 degrees, the etching rate of polyimide organic resin is 12
The etching rate is 0 stops/min, and the organic resin 6 can be selectively etched without etching other structures. By further forming a coil 7, an organic resin layer 8, an upper magnetic body 9, a retainer 10, etc. on this structure, a thin film magnetic head as shown in FIG. 1(e) can be obtained.

According to the above embodiment, the thickness of the organic resin layer 6 can be measured using a stylus thickness meter during oxygen ion milling, and the thickness can be adjusted to the required thickness with high precision. . In addition, conventionally, after oxygen ion milling, wet etching or dry etching was performed to form the desired shape, so it was essential to remove the altered layer on the machined surface of the organic resin layer that had a negative effect on wet etching or dry etching. . However, according to this embodiment, since wet etching or dry etching to form a predetermined shape is performed before oxygen ion milling, it is no longer necessary to remove the altered layer on the machined surface. Furthermore, the steps of coating and thermosetting an organic resin layer, which were required in the prior art, can be omitted.

Therefore, since it is possible to omit the steps that cause variations in the thickness of the organic resin layer, the thickness of the organic resin layer can be determined during oxygen ion milling.

It becomes possible to form the mold thickness with high accuracy.

〔Effect of the invention〕

According to the present invention, in a method for manufacturing a thin film magnetic head in which a lower magnetic material, a gap material, a coil, an organic resin layer, an upper magnetic material, and a protective film are sequentially formed, the thickness of the organic resin layer is adjusted to a predetermined flatness. The organic resin layer is formed thickly until a desired thickness is obtained, and then etched into a predetermined shape, and then the organic resin layer is selectively etched to the required thickness. It has the remarkable effect of being able to provide good flatness, allowing the thickness of the organic resin layer to be formed with high accuracy, and making it possible to manufacture a thin-film magnetic head with stable performance and high reliability. It is something. In addition, removal of the deteriorated layer on the processed surface of organic resin,
Since there is no need to apply or heat cure an organic resin layer, there is an effect that the manufacturing process can be shortened.

[Brief explanation of drawings]

Figure 1 (a), (b), (c), (d)
, (e) shows an embodiment of the method for manufacturing a thin-film magnetic head of the present invention, and is a cross-sectional view of the element of the thin-film magnetic head according to the manufacturing process. DESCRIPTION OF SYMBOLS 1... Ceramic substrate, 2... Base film, 3... Lower magnetic body, 4... Gap material, 5... Conductor coil,
6... Organic resin layer, 7... Conductor coil, 8... Organic resin layer, 9... Upper magnetic material, 10... Protective film.

Claims (1)

[Claims] 1. A method for manufacturing a thin film magnetic head, in which a lower magnetic material, a gap material, at least one conductive coil, at least one organic resin layer, an upper magnetic material, and a protective film are sequentially formed on a substrate. , the organic resin layer is formed thickly until a predetermined flatness is obtained, then wet etching or dry etching is performed into a predetermined shape, and then only the organic resin layer is selectively etched to obtain a predetermined film thickness. A method for manufacturing a thin film magnetic head, characterized by obtaining an organic resin layer. 2. The method of manufacturing a thin film magnetic head according to claim 1, wherein the method of selectively etching only the organic resin layer is oxygen ion milling.