JPS6389251U - - Google Patents

Info

Publication number
JPS6389251U
JPS6389251U JP18286986U JP18286986U JPS6389251U JP S6389251 U JPS6389251 U JP S6389251U JP 18286986 U JP18286986 U JP 18286986U JP 18286986 U JP18286986 U JP 18286986U JP S6389251 U JPS6389251 U JP S6389251U
Authority
JP
Japan
Prior art keywords
chip substrate
semiconductor device
chip
view
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18286986U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18286986U priority Critical patent/JPS6389251U/ja
Publication of JPS6389251U publication Critical patent/JPS6389251U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】
第１図は本考案によるＳＭＴ半導体装置の一実
施例を示すもので、Ａは正面図、Ｂは右側面図、
Ｃは底面図である。第２図は第１図の実施例で使
用するチツプ用基板の正面図、第３図は第１図の
ＳＭＴ半導体装置を取付け基板に実装した状態を
示す図、第４図はＳＭＴ半導体装置を連続して実
装した例を示す図である。第５図は従来のＳＭＴ
半導体装置の一例を示すもので、Ａは正面図、Ｂ
は底面図、Ｃは背面図である。 １０……ＳＭＴ半導体装置；１１……チツプ用
基板；１２……半導体素子チツプ；１３……金線
；１４……外側形状；１５，１６……導電パター
ン；１７……取付け基板；１８……ハンダ。

Claims (1)

    【実用新案登録請求の範囲】
  1. 両面スルーホールのチツプ用基板上に半導体素
    子のチツプを取り付けた表面実装型半導体装置に
    おいて、該チツプ用基板の両面に亘つて電極パタ
    ーンを有するスルーホール部が、該チツプ用基板
    の隅部に形成されていて、該電極が本装置の側面
    に対しても露出していることを特徴とする、表面
    実装型半導体装置。
JP18286986U 1986-11-28 1986-11-28 Pending JPS6389251U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18286986U JPS6389251U (ja) 1986-11-28 1986-11-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18286986U JPS6389251U (ja) 1986-11-28 1986-11-28

Publications (1)

Publication Number Publication Date
JPS6389251U true JPS6389251U (ja) 1988-06-10

Family

ID=31129070

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18286986U Pending JPS6389251U (ja) 1986-11-28 1986-11-28

Country Status (1)

Country Link
JP (1) JPS6389251U (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01231772A (ja) * 1988-03-11 1989-09-18 Toyota Autom Loom Works Ltd 織機におけるクロスロール移載装置
JPH023695A (ja) * 1988-06-18 1990-01-09 Kuraray Co Ltd ステロイド誘導体及びその製造方法
JPH02296380A (ja) * 1989-05-10 1990-12-06 Nec Corp 表面実装用発光ダイオード
JPH07115227A (ja) * 1993-10-15 1995-05-02 Rohm Co Ltd 発光装置およびこれを用いた発光ユニット
JPH10107326A (ja) * 1996-09-30 1998-04-24 Sharp Corp 側面発光型ｌｅｄランプ
WO2006006255A1 (ja) * 2003-09-19 2006-01-19 Matsushita Electric Industrial Co., Ltd. 半導体発光装置
JP2019054248A (ja) * 2018-09-19 2019-04-04 日亜化学工業株式会社 発光装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58201347A (ja) * 1982-05-20 1983-11-24 Unie Kurisutaru Kk リ−ドレスチツプ部品及びその製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58201347A (ja) * 1982-05-20 1983-11-24 Unie Kurisutaru Kk リ−ドレスチツプ部品及びその製造方法

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01231772A (ja) * 1988-03-11 1989-09-18 Toyota Autom Loom Works Ltd 織機におけるクロスロール移載装置
JPH023695A (ja) * 1988-06-18 1990-01-09 Kuraray Co Ltd ステロイド誘導体及びその製造方法
JPH02296380A (ja) * 1989-05-10 1990-12-06 Nec Corp 表面実装用発光ダイオード
JPH07115227A (ja) * 1993-10-15 1995-05-02 Rohm Co Ltd 発光装置およびこれを用いた発光ユニット
JPH10107326A (ja) * 1996-09-30 1998-04-24 Sharp Corp 側面発光型ｌｅｄランプ
WO2006006255A1 (ja) * 2003-09-19 2006-01-19 Matsushita Electric Industrial Co., Ltd. 半導体発光装置
JPWO2006006255A1 (ja) * 2003-09-19 2008-04-24 松下電器産業株式会社 半導体発光装置
JP4682138B2 (ja) * 2003-09-19 2011-05-11 パナソニック株式会社 半導体発光装置
JP2019054248A (ja) * 2018-09-19 2019-04-04 日亜化学工業株式会社 発光装置

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