JPS6384937U - - Google Patents

Info

Publication number
JPS6384937U
JPS6384937U JP17956286U JP17956286U JPS6384937U JP S6384937 U JPS6384937 U JP S6384937U JP 17956286 U JP17956286 U JP 17956286U JP 17956286 U JP17956286 U JP 17956286U JP S6384937 U JPS6384937 U JP S6384937U
Authority
JP
Japan
Prior art keywords
rod
jet nozzle
holder
vacuum processing
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17956286U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP17956286U priority Critical patent/JPS6384937U/ja
Publication of JPS6384937U publication Critical patent/JPS6384937U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例を示す概略構成図、
第2図は第1図の搬送ホルダのロツド部分の縦断
面図、第3図は従来の真空処理装置を示す概略構
成図である。 1……真空チヤンバ、3……ウエハ、4……電
極、6……搬送ホルダ、7……ロツド、8……配
管、9……噴出口、10……ノズル。
FIG. 1 is a schematic configuration diagram showing an embodiment of the present invention;
FIG. 2 is a longitudinal sectional view of the rod portion of the transport holder shown in FIG. 1, and FIG. 3 is a schematic configuration diagram showing a conventional vacuum processing apparatus. 1... Vacuum chamber, 3... Wafer, 4... Electrode, 6... Transfer holder, 7... Rod, 8... Piping, 9... Spout nozzle, 10... Nozzle.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 真空チヤンバの上面に半導体ウエハを処理する
放電電極を配設し、ロツドを介して昇降自在に形
成された上記ウエハの搬送ホルダを上記電極に対
向して設けてなる真空処理装置において、上記搬
送ホルダを所定位置に停止可能に構成するととも
に、上記搬送ホルダのロツド内を通りこの搬送ホ
ルダの上面に形成された噴出口に連通する雰囲気
ガスの導入配管を設け、上記噴出口に噴出ノズル
を着脱自在に係合したことを特徴とする真空処理
装置。
In a vacuum processing apparatus, a discharge electrode for processing a semiconductor wafer is disposed on the upper surface of a vacuum chamber, and a wafer transfer holder, which is formed to be freely raised and lowered via a rod, is provided opposite to the electrode. is constructed such that it can be stopped at a predetermined position, and an atmospheric gas introduction pipe is provided that passes through the rod of the transport holder and communicates with a jet nozzle formed on the top surface of the transport holder, and a jet nozzle can be freely attached and detached from the jet port. A vacuum processing device characterized in that it is engaged with.
JP17956286U 1986-11-21 1986-11-21 Pending JPS6384937U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17956286U JPS6384937U (en) 1986-11-21 1986-11-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17956286U JPS6384937U (en) 1986-11-21 1986-11-21

Publications (1)

Publication Number Publication Date
JPS6384937U true JPS6384937U (en) 1988-06-03

Family

ID=31122731

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17956286U Pending JPS6384937U (en) 1986-11-21 1986-11-21

Country Status (1)

Country Link
JP (1) JPS6384937U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5833828A (en) * 1981-08-24 1983-02-28 Hitachi Ltd Semiconductor surface treatment apparatus
JPS59145519A (en) * 1983-12-23 1984-08-21 Hitachi Ltd Vapor phase chemical treatment equipment

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5833828A (en) * 1981-08-24 1983-02-28 Hitachi Ltd Semiconductor surface treatment apparatus
JPS59145519A (en) * 1983-12-23 1984-08-21 Hitachi Ltd Vapor phase chemical treatment equipment

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