JPS6375039U

JPS6375039U -

Info

Publication number: JPS6375039U
Application number: JP17050586U
Authority: JP
Priority date: 1986-11-06
Filing date: 1986-11-06
Publication date: 1988-05-19

Description

[Brief explanation of drawings]

第１図はこの考案の一実施例を示す斜視図、第
２図はその要部部分断面図、第３図は正常な封止
製品を示す斜視図、第４図はこの考案の他の実施
例を示す斜視図、第５図は従来の装置を示す斜視
図、第６図は従来装置の要部平面図、第７図は従
来装置のガイドピン、ブツシユ嵌合状態の部分断
面図、第８図は従来の封止製品を示す斜視図であ
る。５は下型、１０は上型、１１はガイドブツシユ
、１１ａは入口部、１１ｂは奥部、１２はガイド
ピン、１２ａは先端部、１２ｂはテーパ軸部であ
る。なお図中、同一符号は同一、又は相当部分を
示す。 Fig. 1 is a perspective view showing one embodiment of this invention, Fig. 2 is a partial sectional view of the main part thereof, Fig. 3 is a perspective view showing a normal sealed product, and Fig. 4 is another embodiment of this invention. FIG. 5 is a perspective view showing a conventional device; FIG. 6 is a plan view of essential parts of the conventional device; FIG. FIG. 8 is a perspective view showing a conventional sealed product. 5 is a lower mold, 10 is an upper mold, 11 is a guide bush, 11a is an entrance portion, 11b is a back portion, 12 is a guide pin, 12a is a tip portion, and 12b is a tapered shaft portion. In the figures, the same reference numerals indicate the same or equivalent parts.

Claims

[Scope of Claim for Utility Model Registration] (1) In a resin encapsulation device for a semiconductor device having a plurality of guide pins and guide bushes for positioning a lower mold and an upper mold covering a lead frame on which a semiconductor element is mounted, the fitting hole of the guide bush for,
A tapered and expanding entrance part and a single-diameter inner part continuous with the entrance part are formed, and the guide pin has a single-diameter tip part that fits into the inner part, and a single-diameter inner part that is continuous with the entrance part. What is claimed is: 1. A resin sealing device for a semiconductor device, characterized in that a tapered shaft portion is formed in a continuous manner with a tapered and enlarged shaft portion. (2) The fitting portions of at least two of the plurality of guide bushes are formed with the inlet portion and the deep portion, and the guide pins fitted into the fitting portions are provided with the tip portion. A resin sealing device for a semiconductor device according to claim 1, characterized in that the tapered shaft portion is formed as follows. (3) A utility model characterized in that all the fitting parts of the plurality of guide bushes are formed with the above-mentioned entrance part and the above-mentioned deep part, and all the guide bushes are formed with the above-mentioned tip part and the above-mentioned tapered shaft part. A resin sealing device for a semiconductor device according to claim 1.