JPS6372194A - Method of mounting electronic component - Google Patents
Method of mounting electronic componentInfo
- Publication number
- JPS6372194A JPS6372194A JP21660786A JP21660786A JPS6372194A JP S6372194 A JPS6372194 A JP S6372194A JP 21660786 A JP21660786 A JP 21660786A JP 21660786 A JP21660786 A JP 21660786A JP S6372194 A JPS6372194 A JP S6372194A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- electronic component
- mounting
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 15
- 230000001070 adhesive effect Effects 0.000 claims description 63
- 239000000853 adhesive Substances 0.000 claims description 50
- 125000000524 functional group Chemical group 0.000 claims description 26
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 5
- 230000001678 irradiating effect Effects 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000001723 curing Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- -1 acryloyloxy group Chemical group 0.000 description 1
- 238000012644 addition polymerization Methods 0.000 description 1
- 125000005250 alkyl acrylate group Chemical group 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、テレビ受像機、ビデオテープレコーダー、電
子計算機等に利用できるプリント基板への電子部品の実
装方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for mounting electronic components onto printed circuit boards that can be used in television receivers, video tape recorders, electronic computers, and the like.
従来の技術
従来、チップ抵抗、チップコンデンサ、ミニモールドト
ランジスタ等の電子部品をプリント基板に固定するさい
プリント基板に光硬化性接着剤を塗布した後、前記電子
部品を搭載し、しかる後に前記接着剤を紫外線照射ある
いは紫外線照射と加熱の併用によって硬化させていた。BACKGROUND OF THE INVENTION Conventionally, when electronic components such as chip resistors, chip capacitors, and mini-molded transistors are fixed to a printed circuit board, a photocurable adhesive is applied to the printed circuit board, the electronic components are mounted, and then the adhesive is applied. was cured by ultraviolet irradiation or a combination of ultraviolet irradiation and heating.
これらの方法は特開昭５４−８２６６８号公報、特開昭
６４−１０４５７３号公報、特開昭５４−９８９６９号
公報などに記載されている。これら従来の方法は硬化時
間が短く基板や部品の信頼性が良い、という特徴がある
。しかしながら、接着剤をプリント基板に塗布後、この
接着剤上に電子部品を自動−機械を用いて搭載するさい
、搭載速度は１個の電子部品あたり、０．６〜へ３秒と
極めて速く、しかも搭載時のプリント基板と搭載ヘッド
部の振動によって電子部品の位置ずれが生じやすく、さ
らに電子部品を搭載後、紫外線照射炉までの搬送中にも
電子部品の位置ずれが生じる場合があった。電子部品の
位置ずれが生ずると半田付は時に半田が付かなかったり
、隣接する電極と短絡するという問題があった。These methods are described in JP-A-54-82668, JP-A-64-104573, JP-A-54-98969, and the like. These conventional methods are characterized by short curing times and good reliability of substrates and parts. However, after applying adhesive to a printed circuit board, when electronic components are mounted on the adhesive using an automatic machine, the mounting speed is extremely fast at 0.6 to 3 seconds per electronic component. In addition, the electronic components are likely to be misaligned due to the vibrations of the printed circuit board and the mounting head during mounting, and furthermore, after the electronic components have been mounted, the electronic components may also be misaligned during transportation to the ultraviolet irradiation furnace. When electronic components are misaligned, there is a problem in soldering that sometimes the solder does not stick or short circuits occur with adjacent electrodes.
この問題を解決するために発明者らは特開昭５８−１８
００９０号公報により光重合性接着剤を塗布したのち紫
外線の予備照射をすることにより接着剤を増粘させ、部
品の移動をなくする方法を提案した。また特開昭５８−
１８００９１号公報により接着剤を塗布したのち加熱に
より接着剤を増粘させて、同様に問題を解決する方法を
提案した。In order to solve this problem, the inventors
No. 0090 proposed a method of applying a photopolymerizable adhesive and then pre-irradiating it with ultraviolet rays to thicken the adhesive and eliminate movement of parts. Also, JP-A-58-
No. 180091 proposed a method to similarly solve the problem by applying an adhesive and then heating it to increase the viscosity of the adhesive.
発明が解決しようとする問題点
しかしながら、これらの提案においてもなお次のような
問題点があった。Problems to be Solved by the Invention However, these proposals still have the following problems.
すなわち、特開昭５８−１８００９０号公報および特開
昭５８−１８００９１号公報の方法では、接着剤の光重
合性官応基と、熱重合性官能基が同一であるため、紫外
線の予備照射または加熱により接着剤を増粘させる場合
に反応の制御が微妙で、これらの増粘処理により反応が
進み過ぎ接着力が減少したり、増粘が不十分であったり
、ばらつきを生ずることがあった。That is, in the methods of JP-A-58-180090 and JP-A-58-180091, since the photopolymerizable functional group and the thermally polymerizable functional group of the adhesive are the same, preliminary irradiation with ultraviolet rays or When increasing the viscosity of adhesives by heating, the control of the reaction is delicate, and these thickening treatments sometimes cause the reaction to proceed too much, reduce adhesive strength, or thicken the adhesive insufficiently, resulting in variations. .
問題点を解決するだめの手段
前記従来の欠点を解決するため、本発明はまず第１に部
品の仮固定用の液状の接着剤を基板に塗布したのち、紫
外線を照射して前記接着剤の光重合性官能基を反応させ
て前記接着剤をゲル化させて流動性を消減し感圧接着性
を付与するに際し、この接着剤を官能基の種類の異なる
熱重合性官能基と光重合性官能基を有するものとした。Means for Solving the Problems In order to solve the above-mentioned drawbacks of the conventional art, the present invention first applies a liquid adhesive for temporary fixing of components to a substrate, and then irradiates the adhesive with ultraviolet rays. When a photopolymerizable functional group is reacted to gel the adhesive to reduce fluidity and impart pressure-sensitive adhesive properties, the adhesive is combined with a thermopolymerizable functional group of different types and a photopolymerizable functional group. It has a functional group.
第２に部品を搭載した後、加熱により前記接着剤の熱重
合性官能基を反応させて感圧接着性を消減させることを
特徴としている。Second, after the components are mounted, the thermopolymerizable functional groups of the adhesive are reacted by heating to reduce the pressure-sensitive adhesive properties.
作 用
本発明の電子部品の実装方法は、プリント基板の部品搭
載部に光重合性でかつ熱重合性の接着剤を塗布する工程
と、前記接着剤に紫外線を照射して、前記接着剤をゲル
化させることにより感圧接着性を付与する工程と、感圧
接着性を付与された前記接着剤の上に電子部品を搭載す
る工程と、前記プリント基板と前記電子部品を半田付け
する工程とを含む電子部品の実装方法において、前記接
着剤の光重合性官応基と熱重合性官能基とは異なる種類
の官能基であることを特徴とする電子部品の実装方法と
することによって、接着剤の光重合性官能基は紫外線に
より活性となり重合して接着剤の流動性を消減させ、感
圧接着性を付与すると共に、紫外線によって重合しない
。熱重合性官能基の存在によって、接着剤がこの工程に
おいて、すべて硬化することが防止される。このような
光重合性官能基としては、ビニル基、アクリロイルオキ
シ基のようなビニル性二重結合を持つものがあげられる
。このような光重合性官能基の感度を上げるだめ、紫外
線増感剤を加えておけば、紫外線による感度は上り重合
が促進される。Function The electronic component mounting method of the present invention includes the steps of applying a photopolymerizable and thermally polymerizable adhesive to the component mounting portion of a printed circuit board, and irradiating the adhesive with ultraviolet rays to remove the adhesive. a step of imparting pressure-sensitive adhesive properties by gelation; a step of mounting electronic components on the adhesive imparted with pressure-sensitive adhesive properties; and a step of soldering the printed circuit board and the electronic components. In the electronic component mounting method, the photopolymerizable functional group and the thermally polymerizable functional group of the adhesive are different types of functional groups. The photopolymerizable functional group of the agent becomes activated by ultraviolet light and polymerizes, reducing the fluidity of the adhesive and imparting pressure-sensitive adhesive properties, while not being polymerized by ultraviolet light. The presence of the thermally polymerizable functional group prevents the adhesive from curing completely during this step. Examples of such photopolymerizable functional groups include those having a vinyl double bond such as a vinyl group and an acryloyloxy group. In order to increase the sensitivity of such photopolymerizable functional groups, adding an ultraviolet sensitizer increases the sensitivity to ultraviolet rays and promotes polymerization.
また本発明で使用し得る熱重合性官能基としてはグリシ
ジル基、インシアネート基などがあげられ、る。これら
の熱重合性官能基はそれぞＫの反応に必要なアミン類、
酸無水物類、ポリオール類等の硬化剤を加えておけば熱
により付加重合させて感圧接着性を消減させることがで
きる。この際熱重合性官能基は紫外線照射時には反応せ
ず、電子部品を搭載したのち加熱することによって反応
し、接着剤が完全に硬化して感圧接着性が消失させるこ
とで、接着剤にゴミ等が付着するのを防止すると共に接
着部分に耐熱性を付与する作用をする。Further, examples of the thermally polymerizable functional group that can be used in the present invention include a glycidyl group and an incyanate group. These thermally polymerizable functional groups are amines and amines necessary for the reaction of K, respectively.
If a curing agent such as an acid anhydride or a polyol is added, the pressure-sensitive adhesive property can be reduced by addition polymerization by heat. At this time, the thermopolymerizable functional group does not react when exposed to ultraviolet rays, but reacts when heated after mounting the electronic components, and the adhesive completely cures and loses its pressure-sensitive adhesive properties. It has the function of preventing the adhesion of foreign substances, etc., and imparting heat resistance to the adhesive part.
実施例 次に本発明の実施例について説明する。Example Next, examples of the present invention will be described.
まず光重合性官能基であるアクリロイル基を含むアルキ
ルアクリレート、トリメチロールプロパン） ＩＪアク
リレートと、紫外線増感剤として１−ヒドロキシシクロ
へキシルフェニルケトント、熱重合性官能基であるグリ
シジル基を含むビスフェノールＡ型エポキシ樹脂と、エ
ポキシ樹脂の硬化剤として第三級アミンと、さらに粘着
付与助剤としてロジンを混合溶解し、光重合性でかつ熱
重合性の接着剤を調合する。この接着剤を用いて第１図
に示す工程で電子部品を実装する。即ち第２図ａのよう
にこの接着剤３をプリント基板１の電子部品を載置すべ
き位置に加圧吐出型のディスペンサにより順次塗布し、
その後、高圧水銀灯により、１０秒間紫外線照射して接
着剤３をゲル化させ。First, alkyl acrylate containing an acryloyl group which is a photopolymerizable functional group, trimethylolpropane), 1-hydroxycyclohexylphenyl ketone as an ultraviolet sensitizer, and bisphenol containing a glycidyl group which is a thermally polymerizable functional group. A type epoxy resin, a tertiary amine as a curing agent for the epoxy resin, and rosin as a tackifying agent are mixed and dissolved to prepare a photopolymerizable and thermally polymerizable adhesive. Using this adhesive, electronic components are mounted in the steps shown in FIG. That is, as shown in FIG. 2a, the adhesive 3 is sequentially applied to the positions of the printed circuit board 1 where the electronic components are to be placed using a pressurized discharge type dispenser.
Thereafter, the adhesive 3 was gelled by irradiating ultraviolet rays for 10 seconds using a high-pressure mercury lamp.
流動性を消失させるとともに、感圧接着性を付与する。Eliminates fluidity and imparts pressure-sensitive adhesive properties.
このプリント基板１をチップ部品の自動搭載機にセット
し、第２図すの如くチ・ンブ状の電子部品４をゲル化し
た接着剤３の上から順次１つずつ載せ、マウントヘッド
で十分に加圧し、チップ状の電子部品４を接着する。こ
の状態で、プリント基板１が振動し、または平面方向に
高速で移動してもチップ状の電子部品４は位置ずれする
ことかない。つづいてこのプリント基板１を１６０°Ｃ
で３分間加熱し接着剤３を硬化させ、感圧接着性を消減
させる。その後、第２図Ｃのようにプリント基板１の部
品接着面を下にして噴流半田槽の半田流５によりプリン
ト基板の半田付はランド２と、チップ状電尺部品の電極
６とを半田付けし、同図ｄのようにする。This printed circuit board 1 is set in an automatic chip component mounting machine, and as shown in Fig. 2, the chimney-shaped electronic components 4 are placed one by one on top of the gelled adhesive 3, and the mounting head is used to place the electronic components 4 one by one on top of the gelled adhesive 3. Pressure is applied to bond the chip-shaped electronic component 4. In this state, even if the printed circuit board 1 vibrates or moves at high speed in the plane direction, the chip-shaped electronic component 4 will not be displaced. Next, heat this printed circuit board 1 to 160°C.
for 3 minutes to harden the adhesive 3 and reduce its pressure-sensitive adhesive properties. After that, as shown in Fig. 2C, the printed circuit board 1 is soldered with the solder flow 5 of the jet solder tank with the component adhesion side facing down, and the lands 2 and the electrodes 6 of the chip-shaped electrical scale component are soldered. Then, do as shown in Figure d.
なお接着剤の加熱硬化工程は、噴流半田付は前のフラッ
クスを塗布したプリント基板のプリヒートと半田流の熱
により代用することも可能である。Note that in the heat curing step of the adhesive, jet soldering can be replaced by preheating the printed circuit board to which the flux has been applied and the heat of the solder flow.
発明の効果
以上、説明したように１本発明では光重合性でかつ熱重
合性の液状の接着剤を使用しているので、ディスペンサ
ーでの塗布が容易であり、さらに紫外線により接着剤を
ゲル化させているので、流動性が消減すると同時に感圧
接着性があり、電子部品がずれない。まだ接着剤の光重
合性官能基と熱重合性官能基とは異なる種類の官能基で
あるので必要以上に重合が進むことなく極めて安定した
感圧接着性と、熱硬化性があるため部品の固着力が優れ
、接着剤に異物が付着しないなど、工業的利用価値が大
きい。As explained above, the present invention uses a liquid adhesive that is photopolymerizable and thermally polymerizable, so it is easy to apply with a dispenser, and the adhesive can be gelled by ultraviolet rays. This reduces fluidity and at the same time provides pressure-sensitive adhesive properties to prevent electronic components from slipping. However, the photopolymerizable functional group and the thermopolymerizable functional group of the adhesive are different types of functional groups, so polymerization does not proceed more than necessary, resulting in extremely stable pressure-sensitive adhesion, and the thermosetting property allows parts to be easily bonded. It has excellent adhesive strength and does not allow foreign matter to adhere to the adhesive, so it has great industrial value.
第１図は本発明の実施例における工程ブロック図、第２
図は同各工程における基板側面図である。
１・・・・・・プリント基板、３・・・・・・接着剤、
４・・・・・・電子部品、６・・・・・・半田流。
代理人の氏名゛弁理士 中 尾 敏 男 ほか１名、〜
灼 呼 −一Figure 1 is a process block diagram in an embodiment of the present invention, Figure 2 is a process block diagram in an embodiment of the invention.
The figures are side views of the substrate in each step. 1... Printed circuit board, 3... Adhesive,
4...Electronic parts, 6...Solder style. Name of agent: Patent attorney Toshio Nakao and one other person, ~
Burning Call -1
Claims (2)
合性の液状の接着剤を塗布する工程と、前記接着剤に紫
外線を照射して、前記接着剤をゲル化させることにより
感圧接着性を付与する工程と、感圧接着性を付与された
前記接着剤の上に電子部品を搭載する工程と、前記プリ
ント基板と前記電子部品を半田付けする工程とを含む電
子部品の実装方法であって、前記接着剤の光重合性官能
基と、熱重合性官能基とを異なる種類の官能基とした電
子部品の実装方法。(1) A process of applying a photopolymerizable and thermopolymerizable liquid adhesive to the component mounting area of a printed circuit board, and irradiating the adhesive with ultraviolet rays to make the adhesive gel. A method for mounting an electronic component, including the steps of imparting adhesive properties, mounting an electronic component on the adhesive imparted with pressure-sensitive adhesive properties, and soldering the electronic component to the printed circuit board. A method for mounting an electronic component, wherein the photopolymerizable functional group and the thermally polymerizable functional group of the adhesive are different types of functional groups.
合性の接着剤を塗布する工程と、前記接着剤に紫外線を
照射して、前記接着剤をゲル化させることにより感圧接
着性を付与する工程と、感圧接着性を付与された前記接
着剤の上に電子部品を搭載する工程と、前記プリント基
板と前記電子部品を半田付けする工程と、前記電子部品
を搭載する工程の後、前記接着剤を加熱し、熱重合させ
て感圧接着性を減少又は消減させる工程とを含む電子部
品の実装方法であって、前記接着剤の光重合性官能基と
、熱重合性官能基とを異なる種類の官能基とした電子部
品の実装方法。(2) Pressure-sensitive adhesiveness is achieved by applying a photopolymerizable and thermopolymerizable adhesive to the component mounting area of the printed circuit board, and irradiating the adhesive with ultraviolet rays to gel the adhesive. a step of mounting an electronic component on the adhesive imparted with pressure-sensitive adhesive properties, a step of soldering the electronic component to the printed circuit board, and a step of mounting the electronic component. and then heating the adhesive to thermally polymerize it to reduce or eliminate pressure-sensitive adhesiveness, the method of mounting an electronic component comprising the step of: A method for mounting electronic components using different types of functional groups.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61216607A JPH0824213B2 (en) | 1986-09-12 | 1986-09-12 | Electronic component mounting method |
| KR1019870010050A KR910000998B1 (en) | 1986-09-12 | 1987-09-10 | Method of mounting electronic component |
| US07/095,182 US4880486A (en) | 1986-09-12 | 1987-09-11 | Method for mounting electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61216607A JPH0824213B2 (en) | 1986-09-12 | 1986-09-12 | Electronic component mounting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6372194A true JPS6372194A (en) | 1988-04-01 |
| JPH0824213B2 JPH0824213B2 (en) | 1996-03-06 |
Family
ID=16691077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61216607A Expired - Lifetime JPH0824213B2 (en) | 1986-09-12 | 1986-09-12 | Electronic component mounting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0824213B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01276695A (en) * | 1988-04-27 | 1989-11-07 | Pfu Ltd | Surface mounted-type electronic device and its taped body |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5716083A (en) * | 1981-05-15 | 1982-01-27 | Hitachi Ltd | Adhesive polymerizable by action of both light and heat |
| JPS60152091A (en) * | 1984-01-19 | 1985-08-10 | 東洋紡績株式会社 | Chip part securing printed circuit board |
-
1986
- 1986-09-12 JP JP61216607A patent/JPH0824213B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5716083A (en) * | 1981-05-15 | 1982-01-27 | Hitachi Ltd | Adhesive polymerizable by action of both light and heat |
| JPS60152091A (en) * | 1984-01-19 | 1985-08-10 | 東洋紡績株式会社 | Chip part securing printed circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01276695A (en) * | 1988-04-27 | 1989-11-07 | Pfu Ltd | Surface mounted-type electronic device and its taped body |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0824213B2 (en) | 1996-03-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR910000998B1 (en) | Method of mounting electronic component | |
| CN101250386B (en) | Adhesive for electrode connection and connecting method using it | |
| US4398660A (en) | Method of mounting electronic components | |
| US6284057B1 (en) | Solder and soldering method | |
| JPH1197482A (en) | Electrode connecting method and electrode connection structure | |
| JPS6372194A (en) | Method of mounting electronic component | |
| JP3202774B2 (en) | Solder pattern transfer film and method of manufacturing the same | |
| JP3376968B2 (en) | Implementation method | |
| JP2589679B2 (en) | Electronic component mounting method | |
| JPS6345892A (en) | Method of mounting surface mount type electronic device | |
| JPH11279500A (en) | Circuit-connecting material and production of circuit board device | |
| JPS59998B2 (en) | Printed wiring board manufacturing method | |
| JPS58180090A (en) | Method of mounting electronic part | |
| JP2581103B2 (en) | Conductive bonding method for chip parts | |
| JPH07318962A (en) | Electrode substrate of electric device, formation of electrode and packaging method | |
| JP3750606B2 (en) | Manufacturing method of semiconductor device | |
| JPS61202492A (en) | Adhesion of electronic component | |
| JPS5985394A (en) | Cream solder | |
| JPH11284024A (en) | Manufacture of circuit board device | |
| JPH1174313A (en) | Method for connecting electrode | |
| JPH05226821A (en) | Electronic component mounting method | |
| JPH07183650A (en) | Mounting method for electronic part | |
| JPS63177584A (en) | Assembly of hybrid integrated circuit | |
| JPS6321895A (en) | Bonding system of surface mount parts | |
| JPS63261894A (en) | Method of fixing component |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |