JPH0824213B2 - Electronic component mounting method - Google Patents
Electronic component mounting methodInfo
- Publication number
- JPH0824213B2 JPH0824213B2 JP61216607A JP21660786A JPH0824213B2 JP H0824213 B2 JPH0824213 B2 JP H0824213B2 JP 61216607 A JP61216607 A JP 61216607A JP 21660786 A JP21660786 A JP 21660786A JP H0824213 B2 JPH0824213 B2 JP H0824213B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- electronic component
- mounting
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、テレビ受像機，ビデオテープレコーダー，
電子計算機等に利用できるプリント基板への電子部品の
実装方法に関するものである。The present invention relates to a television receiver, a video tape recorder,
The present invention relates to a method for mounting an electronic component on a printed circuit board that can be used for an electronic computer or the like.
従来の技術 従来、チップ抵抗，チップコンデンサ，ミニモールド
トランジスタ等の電子部品をプリント基板に固定するさ
いプリント基板に光硬化性接着剤を塗布した後、前記電
子部品を搭載し、しかる後に前記接着剤を紫外線照射あ
るいは紫外線照射と加熱の併用によって硬化させてい
た。これらの方法は特開昭54−82668号公報，特開昭54
−104573号公報，特開昭54−98969号公報などに記載さ
れている。これら従来の方法は硬化時間が短く基板や部
品の信頼性が良い、という特徴がある。しかしながら、
接着剤をプリント基板に塗布後、この接着剤上に電子部
品を自動機械を用いて搭載するさい、搭載速度は１個の
電子部品あたり、0.6〜0.3秒と極めて速く、しかも搭載
時のプリント基板と搭載ヘッド部の振動によって電子部
品の位置ずれが生じやすく、さらに電子部品を搭載後、
紫外線照射炉までの搬送中にも電子部品の位置ずれが生
じる場合があった。電子部品の位置ずれが生ずると半田
付け時に半田が付かなかったり、隣接する電極と短絡す
るという問題があった。2. Description of the Related Art Conventionally, when an electronic component such as a chip resistor, a chip capacitor, and a mini-mold transistor is fixed to a printed circuit board, a photocurable adhesive is applied to a printed circuit board, and then the electronic component is mounted. Was cured by ultraviolet irradiation or a combination of ultraviolet irradiation and heating. These methods are disclosed in JP-A-54-82668 and JP-A-54-54668.
No. 104573, JP-A-54-98969 and the like. These conventional methods are characterized in that the curing time is short and the reliability of substrates and components is good. However,
After applying the adhesive to the printed circuit board, when mounting electronic parts on this adhesive using an automatic machine, the mounting speed is extremely fast at 0.6 to 0.3 seconds per electronic part, and the printed circuit board at the time of mounting With the vibration of the mounting head, the electronic components are easily displaced, and after mounting the electronic components,
There was a case where the electronic components were displaced during the transportation to the ultraviolet irradiation furnace. If the electronic component is displaced, there is a problem that the solder is not attached at the time of soldering or a short circuit occurs with an adjacent electrode.
この問題を解決するために発明者らは特開昭58−1800
90号公報により光重合性接着剤を塗布したのち紫外線の
予備照射をすることにより接着剤を増粘させ、部品の移
動をなくする方法を提案した。また特開昭58−180091号
公報により接着剤を塗布したのち加熱により接着剤を増
粘させて、同様に問題を解決する方法を提案した。In order to solve this problem, the inventors of the present invention have disclosed JP-A-58-1800.
No. 90 proposes a method of applying a photopolymerizable adhesive and then pre-irradiating it with ultraviolet rays to increase the viscosity of the adhesive and eliminate the movement of parts. Further, JP-A-58-180091 proposes a method of applying the adhesive and then increasing the viscosity of the adhesive by heating to solve the same problem.
発明が解決しようとする問題点 しかしながら、これらの提案においてもなお次のよう
な問題点があった。Problems to be Solved by the Invention However, these proposals still have the following problems.
すなわち、特開昭58−180090号公報および特開昭58−
180091号公報の方法では、接着剤の光重合性官応基と、
熱重合性官応基が同一であるため、紫外線の予備照射ま
たは加熱により接着剤を増粘させる場合に反応の制御が
微妙で、これらの増粘処理により反応が進み過ぎ接着力
が減少したり、増粘が不十分であったり、ばらつきを生
ずることがあった。That is, JP-A-58-180090 and JP-A-58-
In the method of Japanese Patent No. 180091, a photopolymerizable functional group of an adhesive,
Since the thermopolymerizable functional groups are the same, the control of the reaction is delicate when the adhesive is thickened by pre-irradiation with ultraviolet rays or heating, and the reaction proceeds too much due to these thickening treatments and the adhesive strength decreases. However, thickening may be insufficient or uneven.
問題点を解決するための手段 前記従来の欠点を解決するために、本発明はまず第１
に、プリント基板の部品搭載部に光重合性でかつ熱重合
性の液状の接着剤を塗布する工程と、前記接着剤に紫外
線を照射して、接着剤をゲル化させることにより感圧接
着性を付与した後、前記接着剤の上に電子部品を装着す
る工程と、前記プリント基板を前記電子部品を半田付け
する工程を含む電子部品の実装方法であって、前記接着
剤は、光重合性官能基と、これと異なる種類の熱重合性
官能基を有するものとした。第２に部品を搭載した後、
加熱により前記接着剤の熱重合性官能基を反応させて感
圧接着性を消滅させることを特徴としている。Means for Solving the Problems In order to solve the above-mentioned conventional drawbacks, the present invention firstly discloses
, A step of applying a photopolymerizable and thermopolymerizable liquid adhesive to the component mounting portion of the printed circuit board, and irradiating the adhesive with ultraviolet rays to cause the adhesive to gel After mounting the electronic component on the adhesive, a mounting method of the electronic component, including a step of soldering the electronic component to the printed circuit board, the adhesive is a photopolymerizable It has a functional group and a different type of thermopolymerizable functional group. Second, after mounting the components,
It is characterized in that the pressure-sensitive adhesive property is eliminated by reacting the heat-polymerizable functional group of the adhesive by heating.
作用 本発明の電子部品の実装方法は、プリント基板の部品
搭載部に光重合性でかつ熱重合性の接着剤を塗布する工
程と、前記接着剤に紫外線を照射して、前記接着剤をゲ
ル化させることにより感圧接着性を付与する工程と、感
圧接着性を付与された前記接着剤の上に電子部品を搭載
する工程と、前記プリント基板と前記電子部品を半田付
けする工程とを含む電子部品の実装方法において、前記
接着剤の光重合性官応基と熱重合性官能基とは異なる種
類の官能基であることを特徴とする電子部品の実装方法
とすることによって、接着剤の光重合性官能基は紫外線
により活性となり重合して接着剤の流動性を消滅させ、
感圧接着性を付与すると共に、紫外線によって重合しな
い。熱重合性官能基の存在によって、接着剤がこの工程
において、すべて硬化することが防止される。このよう
な光重合性官能基としては、ビニル基，アクリロイルオ
キシ基のようなビニル性二重結合を持つものがあげられ
る。このような光重合性官能基の感度を上げるため、紫
外線増感剤を加えておけば、紫外線による感度は上り重
合が促進される。Action The electronic component mounting method of the present invention comprises a step of applying a photopolymerizable and thermopolymerizable adhesive to a component mounting portion of a printed circuit board, and irradiating the adhesive with ultraviolet rays to gel the adhesive. The step of applying pressure-sensitive adhesiveness by making the adhesive, the step of mounting an electronic component on the pressure-sensitive adhesive-provided adhesive, and the step of soldering the printed board and the electronic component. In the method for mounting an electronic component including the adhesive, the photopolymerizable functional group and the thermopolymerizable functional group of the adhesive are different types of functional groups, thereby providing an adhesive. The photopolymerizable functional group of is activated by ultraviolet rays and polymerizes to eliminate the fluidity of the adhesive,
It imparts pressure-sensitive adhesiveness and does not polymerize by ultraviolet rays. The presence of the heat-polymerizable functional group prevents the adhesive from fully curing in this step. Examples of such a photopolymerizable functional group include those having a vinylic double bond such as a vinyl group and an acryloyloxy group. In order to increase the sensitivity of such a photopolymerizable functional group, if an ultraviolet sensitizer is added, the sensitivity to ultraviolet rays rises and the polymerization is accelerated.
また本発明で使用し得る熱重合性官能基としてはグリ
シジル基，イソシアネート基などがあがられる。これら
の熱重合性官能基はそれぞれの反応に必要なアミン類，
酸無水物類，ポリオール類等の硬化剤を加えておけば熱
により付加重合させて感圧接着性を消滅させることがで
きる。この際熱重合性官能基は紫外線照射時には反応せ
ず、電子部品を搭載したのち加熱することによって反応
し、接着剤が完全に硬化して感圧接着性が消失させるこ
とで、接着剤にゴミ等が付着するのを防止すると共に接
着部分に耐熱性を付与する作用をする。The heat-polymerizable functional group that can be used in the present invention includes a glycidyl group and an isocyanate group. These thermopolymerizable functional groups are amines necessary for each reaction,
If a curing agent such as acid anhydrides and polyols is added, the pressure-sensitive adhesiveness can be eliminated by heat addition polymerization. At this time, the thermopolymerizable functional group does not react when irradiated with ultraviolet rays, but it reacts by mounting the electronic component and then heating it to completely cure the adhesive and lose the pressure-sensitive adhesive property. It has the function of preventing adhesion of the like and imparting heat resistance to the bonded portion.
実施例 次に本発明の実施例について説明する。Example Next, an example of the present invention will be described.
まず光重合性官能基であるアクリロイル基を含むアル
キルアクリレート，トリメチロールプロパントリアクリ
レートと、紫外線増感剤として１−ヒドロキシシクロヘ
キシルフェニルケトンと、熱重合性官能基であるグリシ
ジル基を含むビスフェノールＡ型エポキシ樹脂と、エポ
キシ樹脂の硬化剤として第三級アミンと、さらに粘着付
与助剤としてロジンを混合溶解し、光重合性でかつ熱重
合性の接着剤を調合する。この接着剤を用いて第１図に
示す工程で電子部品を実装する。即ち第２図ａのように
この接着剤３をプリント基板１の電子部品を載置すべき
位置に加圧吐出型のディスペンサにより順次塗布し、そ
の後、高圧水銀灯により、10秒間紫外線照射して接着剤
３をゲル化させ、流動性を消失させるとともに、感圧接
着剤を付与する。このプリント基板１をチップ部品の自
動搭載機にセットし、第２図ｂの如くチップ状の電子部
品４をゲル化した接着剤３の上から順次１つずつ載せ、
マウントヘッドで十分に加圧し、チップ状の電子部品４
を接着する。この状態で、プリント基板１が振動し、ま
たは平面方向に高速で移動してもチップ状の電子部品４
は位置ずれすることがない。つづいてこのプリント基板
１を150℃で３分間加熱し接着剤３を硬化させ、感圧接
着性を消滅させる。その後、第２図ｃのようにプリント
基板１の部品接着面を下にして噴流半田槽の半田流５に
よりプリント基板の半田付けランド２と、チップ状電尺
部品の電極６とを半田付けし、同図ｄのようにする。First, an alkyl acrylate containing acryloyl group which is a photopolymerizable functional group, trimethylolpropane triacrylate, 1-hydroxycyclohexyl phenyl ketone as an ultraviolet sensitizer, and a bisphenol A type epoxy containing a glycidyl group which is a thermopolymerizable functional group. A resin, a tertiary amine as a curing agent for an epoxy resin, and a rosin as a tackifying aid are mixed and dissolved to prepare a photopolymerizable and thermopolymerizable adhesive. Using this adhesive, electronic parts are mounted in the step shown in FIG. That is, as shown in FIG. 2a, the adhesive 3 is sequentially applied to the position on the printed circuit board 1 where electronic parts are to be placed by a pressure discharge type dispenser, and then, a high pressure mercury lamp is used to irradiate ultraviolet rays for 10 seconds for adhesion. The agent 3 is gelated, the fluidity is lost, and the pressure-sensitive adhesive is applied. This printed circuit board 1 is set in a chip component automatic mounting machine, and as shown in FIG. 2b, the chip-shaped electronic components 4 are placed one by one from above on the gelled adhesive 3.
Sufficiently pressurizing with the mount head, chip-shaped electronic component 4
Glue. In this state, even if the printed circuit board 1 vibrates or moves at high speed in the planar direction, the chip-shaped electronic component 4
Does not shift. Subsequently, the printed circuit board 1 is heated at 150 ° C. for 3 minutes to cure the adhesive 3 and eliminate the pressure-sensitive adhesiveness. After that, as shown in FIG. 2C, the soldering land 2 of the printed circuit board and the electrode 6 of the chip-shaped electronic scale component are soldered with the component adhesive surface of the printed circuit board 1 downward by the solder flow 5 of the jet solder bath. , As shown in FIG.
なお接着剤の加熱硬化工程は、噴流半田付け前のフラ
ックスを塗布したプリント基板のプリヒートと半田流の
熱により代用することも可能である。The heat-curing step of the adhesive can be replaced by the heat of the solder flow and the preheat of the printed circuit board to which the flux before the jet soldering is applied.
発明の効果 以上、説明したように、本発明では光重合性でかつ熱
重合性の液状の接着剤を使用しているので、ディスペン
サーでの塗布が容易であり、さらに紫外線により接着剤
をゲル化させているので、流動性が消滅すると同時に感
圧接着性があり、電子部品がずれない。また接着剤の光
重合性官能基と熱重合性官能基とは異なる種類の官能基
であるので必要以上に重合が進むことなく極めて安定し
た感圧接着性と、熱硬化性があるため部品の固着力が優
れ、接着剤に異物が付着しないなど、工業的利用価値が
大きい。EFFECTS OF THE INVENTION As described above, in the present invention, since a photopolymerizable and thermopolymerizable liquid adhesive is used, application with a dispenser is easy, and further, the adhesive is gelated by ultraviolet rays. As a result, the fluidity disappears, and at the same time, there is pressure-sensitive adhesiveness and the electronic parts do not shift. In addition, since the photopolymerizable functional group and the thermopolymerizable functional group of the adhesive are different types of functional groups, extremely stable pressure-sensitive adhesive properties without excessive polymerization and thermosetting properties of the parts It has excellent adhesion and has a great industrial utility value because foreign substances do not adhere to the adhesive.
第１図は本発明の実施例における工程ブロック図、第２
図は同各工程における基板側面図である。 １……プリント基板、３……接着剤、４……電子部品、
５……半田流。FIG. 1 is a process block diagram in an embodiment of the present invention, FIG.
The figure is a side view of the substrate in each step. 1 ... printed circuit board, 3 ... adhesive, 4 ... electronic parts,
5: Solder style.
Claims (2)
つ熱重合性の液状の接着剤を塗布する工程と、前記接着
剤に紫外線を照射して、接着剤をゲル化させることによ
り感圧接着性を付与した後、前記接着剤の上に電子部品
を装着する工程と、前記プリント基板と前記電子部品を
半田付けする工程を含む電子部品の実装方法であって、
前記接着剤は、光重合性官能基と、これと異なる種類の
熱重合性官能基で構成された接着剤であることを特徴と
する電子部品の実装方法。1. A process of applying a photopolymerizable and thermopolymerizable liquid adhesive to a component mounting portion of a printed circuit board, and irradiating the adhesive with ultraviolet rays to gel the adhesive. A method of mounting an electronic component, comprising a step of mounting an electronic component on the adhesive after applying pressure adhesiveness, and a step of soldering the printed circuit board and the electronic component,
The electronic component mounting method, wherein the adhesive is an adhesive composed of a photopolymerizable functional group and a thermopolymerizable functional group of a different type.
つ熱重合性の液状の接着剤を塗布する工程と、前記接着
剤に紫外線を照射して、接着剤をゲル化させることによ
り感圧接着性を付与した後、前記接着剤の上に電子部品
を装着する工程と、前記電子部品を装着後、前記接着剤
を加熱し、熱重合させて感圧接着性を減少又は消滅させ
る工程と、前記プリント基板を前記電子部品を噴流半田
付けする工程とを有する電子部品の実装方法であって、
前記接着剤は、光重合性官能基と、これと異なる種類の
熱重合性官能基で構成された接着剤であることを特徴と
する電子部品の実装方法。2. A process of applying a photopolymerizable and thermopolymerizable liquid adhesive to a component mounting portion of a printed circuit board, and irradiating the adhesive with ultraviolet rays to gel the adhesive. After applying pressure adhesiveness, a step of mounting an electronic component on the adhesive, and a step of heating the adhesive after mounting the electronic component and thermally polymerizing to reduce or eliminate the pressure sensitive adhesiveness. And a method of mounting an electronic component, comprising the step of: jet soldering the electronic component to the printed circuit board,
The electronic component mounting method, wherein the adhesive is an adhesive composed of a photopolymerizable functional group and a thermopolymerizable functional group of a different type.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61216607A JPH0824213B2 (en) | 1986-09-12 | 1986-09-12 | Electronic component mounting method |
| KR1019870010050A KR910000998B1 (en) | 1986-09-12 | 1987-09-10 | Method of mounting electronic component |
| US07/095,182 US4880486A (en) | 1986-09-12 | 1987-09-11 | Method for mounting electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61216607A JPH0824213B2 (en) | 1986-09-12 | 1986-09-12 | Electronic component mounting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6372194A JPS6372194A (en) | 1988-04-01 |
| JPH0824213B2 true JPH0824213B2 (en) | 1996-03-06 |
Family
ID=16691077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61216607A Expired - Lifetime JPH0824213B2 (en) | 1986-09-12 | 1986-09-12 | Electronic component mounting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0824213B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01276695A (en) * | 1988-04-27 | 1989-11-07 | Pfu Ltd | Surface mounted-type electronic device and its taped body |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5716083A (en) * | 1981-05-15 | 1982-01-27 | Hitachi Ltd | Adhesive polymerizable by action of both light and heat |
| JPS60152091A (en) * | 1984-01-19 | 1985-08-10 | 東洋紡績株式会社 | Chip part securing printed circuit board |
-
1986
- 1986-09-12 JP JP61216607A patent/JPH0824213B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6372194A (en) | 1988-04-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR910000998B1 (en) | Method of mounting electronic component | |
| US4916805A (en) | Method for the attachment of components to a circuit board using photoactuatable adhesive | |
| US5137936A (en) | Method for packaging electronic parts and adhesive for use in said method | |
| US4398660A (en) | Method of mounting electronic components | |
| US6284057B1 (en) | Solder and soldering method | |
| JPH0824213B2 (en) | Electronic component mounting method | |
| JPH1197482A (en) | Electrode connecting method and electrode connection structure | |
| JP2985640B2 (en) | Electrode connector and method of manufacturing the same | |
| JP2617053B2 (en) | Electric circuit manufacturing method | |
| JP3376968B2 (en) | Implementation method | |
| JP2589679B2 (en) | Electronic component mounting method | |
| JPS6345892A (en) | Method of mounting surface mount type electronic device | |
| JPS59188955A (en) | Semiconductor device | |
| JPS59998B2 (en) | Printed wiring board manufacturing method | |
| JP2940252B2 (en) | Semiconductor device mounting structure and mounting method | |
| JP2596633B2 (en) | Semiconductor element mounting method | |
| JP2581103B2 (en) | Conductive bonding method for chip parts | |
| JPS5811114B2 (en) | Mounting method of micro parts on printed circuit board | |
| JPS636898A (en) | Method of soldering leadless electronic parts | |
| JPS61202492A (en) | Adhesion of electronic component | |
| JPS5880894A (en) | Method of producing printed board | |
| JP2000332054A (en) | Mounting method of ic chip | |
| JPH03163895A (en) | Mounting of electronic parts | |
| JPH05226821A (en) | Electronic component mounting method | |
| JPH0625611A (en) | Pressure-sensitive adhesive for forming electronic circuit and method for forming electronic circuit |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |