JPS61202492A - Adhesion of electronic component - Google Patents
Adhesion of electronic componentInfo
- Publication number
- JPS61202492A JPS61202492A JP4506085A JP4506085A JPS61202492A JP S61202492 A JPS61202492 A JP S61202492A JP 4506085 A JP4506085 A JP 4506085A JP 4506085 A JP4506085 A JP 4506085A JP S61202492 A JPS61202492 A JP S61202492A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- printed circuit
- circuit board
- chip
- curing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明はリード線を排除して超小型にチップ化したコ
ンデンサ、抵抗体等の電子部品をプリント基板に仮固定
する際等に使用する電子部品の接着方法に関するもので
ある。[Detailed Description of the Invention] [Field of Industrial Application] This invention is an electronic device used when temporarily fixing electronic components such as capacitors and resistors to printed circuit boards, which are made into ultra-small chips by eliminating lead wires. This invention relates to a method for bonding parts.
この種の電子部品（以下、チップと称する）は、自動装
填装置によりプリント基板の定位置に搭載した後、フラ
ックスを塗布してハンダ付けにより固定するのであるが
、このハンダ付は終了までにチップが定位置から不用意
に移動するのを防止するために、予め接着剤を用いてチ
ップをプリント基板に仮固定しなければならない。This type of electronic component (hereinafter referred to as a chip) is mounted in a fixed position on a printed circuit board using an automatic loading device, then fixed by applying flux and soldering. In order to prevent the chip from being accidentally moved from its fixed position, the chip must be temporarily fixed to the printed circuit board using adhesive in advance.
従来このチップを仮固定するには、プリント基板のチッ
プを搭載する位置に一液型エポキシ系接着剤のような熱
硬化性接着剤あるいは紫外線硬化性接着剤または紫外線
硬化と熱硬化を併用したタイプの接着剤を塗布し、チッ
プを搭載後、加熱硬仕あるいは紫外線硬化させることに
より接着していた。Conventionally, to temporarily fix this chip, a thermosetting adhesive such as a one-component epoxy adhesive, an ultraviolet curable adhesive, or a type that uses a combination of ultraviolet curing and thermosetting adhesive is used at the position where the chip is mounted on the printed circuit board. After applying the adhesive and mounting the chip, it was bonded by heat hardening or UV curing.
従来のチップの接着方法は以上のようであったので、加
熱だけで硬化する接着剤を用いた場合は、加熱炉が必要
であると共に、加熱炉へ搬送するまでの間の振動や加熱
中の接着剤の流動等によりチップがずれやすく、また高
温での加熱によりプリント基板が変形したり、チップに
悪影響を及１１す等の問題点があった。Conventional chip bonding methods are as described above, so if an adhesive that cures only by heating is used, a heating furnace is required, and there is also a risk of vibration and heating during transportation to the heating furnace. There have been problems such as the chips tend to shift due to the flow of the adhesive, and heating at high temperatures can deform the printed circuit board and adversely affect the chips.
また、紫外線硬化だけによる接着方法では１接着剤の塗
布量が少なすぎた場合、チップの側面へ接着剤が十分に
はみ出さず紫外線を照射しても必要な接着強度が得られ
ないので、ハンダ付時にチップが脱落しやすいという問
題点があった。In addition, when using an adhesive method that uses only UV curing, if the amount of adhesive applied is too small, the adhesive will not protrude to the side of the chip and the necessary adhesive strength will not be obtained even if UV rays are irradiated. There was a problem in that the chip easily fell off when attached.
さらに、紫外線硬化と熱硬化を併用したタイプの接着剤
を用いた場合にも、熱硬化だけで硬化する接着剤の場合
と類似の問題点があった。Furthermore, even when using a type of adhesive that uses both ultraviolet curing and heat curing, there are similar problems as with adhesives that are cured only by heat curing.
この発明は上記のような問題点を解消するためになされ
たもので、チップの仮固定工程において、加熱が不要で
信頼性にも優れた電子部品の接着方法を得ることを目的
とする。This invention was made to solve the above-mentioned problems, and an object of the present invention is to provide a method for bonding electronic components that does not require heating and has excellent reliability in the temporary fixing process of chips.
この発明に係る電子部品の接着方法は、プリント基板の
所定位置に光硬化性樹脂と光増感剤を添加し九二液室温
硬化型エポキシ系接着剤を塗布する工程を施した後、上
記接着剤に紫外線を照射して上記接着剤の粘度を上げる
工程、上記プリント基板の接着剤上に電子部品を載せる
工程、及び上記二液室温硬化型エポキシ系接着剤の反応
硬化により上記電子部品を上記プリント基板に接着固定
する工程を施すようにしたものである。The method for bonding electronic components according to the present invention includes adding a photocurable resin and a photosensitizer to predetermined positions of a printed circuit board and applying a 92-liquid room temperature curing epoxy adhesive, and then applying the above adhesive. A step of increasing the viscosity of the adhesive by irradiating the adhesive with ultraviolet rays, a step of placing the electronic component on the adhesive of the printed circuit board, and a reaction curing of the two-component room temperature curing epoxy adhesive to attach the electronic component to the adhesive. A process of adhesively fixing it to a printed circuit board is performed.
この発明における二液室温硬化型エポキシ系接着剤は、
適当量の光硬化性樹脂と光増感剤とを叡加しているので
、紫外線を照射することにより瞬時に粘着性を発現し、
チップを載せた時にチップを仮止めすることができる。The two-component room temperature curing epoxy adhesive in this invention is
Since it contains an appropriate amount of photocurable resin and photosensitizer, it instantly becomes sticky when exposed to ultraviolet rays.
The chip can be temporarily fixed when the chip is placed on it.
そして、ただちにエポキシ樹脂と硬化剤とによる通常の
硬化が進行していく。Then, normal curing using the epoxy resin and curing agent immediately proceeds.
以下、この発明の一実施例について説明する。 An embodiment of the present invention will be described below.
先ず、プリント基板のチップを固定すべき定位置に、光
硬化性樹脂と光増感剤を添加した二液室温硬化型エポキ
シ系接着剤をディスペンサーによって塗布する。次いで
、この接着剤に紫外線を照射する。そこで、この接着剤
上にチップを載せると、既に紫外線照射により粘着性が
発現しているので、チップはプリント基板に仮固定され
る。またチップとプリント基板の接着力は、二液室温硬
化型エポキシ系接着剤の構成要素である工？キシ樹脂と
硬化剤による硬化反応の進行に伴なって増していきチッ
プはプリント基板に接着固定され、また、その後のチッ
プの半田付工程における半田付前に行なわれるチップの
予熱によってさらに硬化が促進されるので、半田付前に
チップが移動したり脱落したりすることはない。また二
液室温硬化型エポキシ系接着剤は室温硬化型なので室温
ないしそれに近い比較的低い温度で接着硬化できるので
電子部品に与える熱的影響がほとんど無い。First, a two-component room temperature curing epoxy adhesive containing a photocurable resin and a photosensitizer is applied using a dispenser to a predetermined position on a printed circuit board where a chip is to be fixed. Next, this adhesive is irradiated with ultraviolet light. Therefore, when a chip is placed on this adhesive, it has already developed adhesive properties due to ultraviolet irradiation, so the chip is temporarily fixed to the printed circuit board. Also, the adhesive strength between the chip and the printed circuit board is determined by the adhesive strength of the two-component room temperature curing epoxy adhesive. As the curing reaction between the resin and the curing agent progresses, the amount increases and the chip is adhesively fixed to the printed circuit board, and the curing is further accelerated by preheating the chip before soldering in the subsequent chip soldering process. This prevents the chip from moving or falling off before soldering. Furthermore, since the two-component room temperature curing type epoxy adhesive is a room temperature curing type, it can be adhesively cured at room temperature or a relatively low temperature close to it, so that there is almost no thermal influence on electronic components.
なおこの発明で用いられる二液室温硬化型エポキシ系接
着剤の硬化剤としてはポリアミン、ポリアミドアミン等
がよい。エポキシ系接着剤に添加する光硬化性樹脂とし
ては、ポリエステル、ポリウレタン等の（メタ）アクリ
レート系、ポリチオ−〜−ジアリルエーテμ系あるいは
（メタ）アクリレート系の樹脂であり、光増感剤として
は、アリルジアゾニウム塩、ベンゾフェノン、ペンゾイ
ンエーテμ等を用いる。The curing agent for the two-component room temperature curing type epoxy adhesive used in the present invention is preferably polyamine, polyamide amine, or the like. The photocurable resin added to the epoxy adhesive is a (meth)acrylate resin such as polyester or polyurethane, a polythio--diallyl ether μ-based resin, or a (meth)acrylate-based resin, and the photosensitizer is Allyl diazonium salt, benzophenone, penzoinether μ, etc. are used.
これらの光硬化性樹脂と光増感剤を含有した二液室温硬
化型エポキシ系接着剤は、エポキシ樹脂組成１光硬化性
樹脂と光増感剤の種類と量により任意の特性のものが得
られるが、例えば太田薬品工業社製「ＸＥＡ−１１」の
様なものを使用すればよいユ
接着剤の塗布は、ディスペンサーに限らず、スクリーン
印刷あるいはスタンピングによって行ってもよい。These two-component room temperature curing epoxy adhesives containing a photocurable resin and a photosensitizer can have arbitrary characteristics depending on the epoxy resin composition, the type and amount of the photocurable resin and the photosensitizer. However, for example, "XEA-11" manufactured by Ohta Pharmaceutical Co., Ltd. may be used. Application of the adhesive is not limited to a dispenser, and may be performed by screen printing or stamping.
また上記実施例ではチップを接着剤上に載せる前に紫外
線照射を行った場合について説明したが、チップを載せ
た後に紫外線を照射してもよく、上記実施例と同様の効
果を奏する。Further, in the above embodiment, a case was explained in which ultraviolet rays were irradiated before the chip was placed on the adhesive, but ultraviolet rays may be irradiated after the chip was placed, and the same effect as in the above embodiment can be obtained.
さらに、位置決め不良の電子部品をプリント基板から外
すことも、接着剤が完全硬化する前に行なえば簡単にで
きる。Furthermore, it is easy to remove misaligned electronic components from the printed circuit board before the adhesive is completely cured.
以上のように、この発明によればプリント基板の所定位
置に光硬化性樹脂と光増感剤を添加した二液室温硬化型
エポキシ系接着剤を塗布する工程を施した後、上記接着
剤に紫外線を照射して上記接着剤の粘度を上げる工程、
上記プリント基板の接着剤上に電子部品を載せる工程、
及び上記二液呈湛硬化型工メキシ系接着剤の反応硬化に
より上記電子部品を上記プリント基板に接着固定するよ
うにしたので、チップの移動や脱落が無く１熱による電
気的特性の劣化及びプリント基板等の変形が無く品質の
安定化を計ることのできる電子部品の接着方法が得られ
る効果がある。As described above, according to the present invention, after applying a two-component room temperature curing type epoxy adhesive containing a photocurable resin and a photosensitizer to a predetermined position of a printed circuit board, a step of increasing the viscosity of the adhesive by irradiating it with ultraviolet rays;
the process of placing electronic components on the adhesive of the printed circuit board;
The electronic components are bonded and fixed to the printed circuit board by the reaction curing of the two-component, double-curing type adhesive, so there is no movement or falling off of the chip, and there is no deterioration of electrical characteristics due to heat and no printing. This has the effect of providing a method for bonding electronic components that does not cause deformation of the substrate, etc. and can stabilize quality.
Claims (1)
加した二液室温硬化型エポキシ系接着剤を塗布する工程
を施した後、上記接着剤に紫外線を照射して上記接着剤
の粘度を上げる工程、上記プリント基板の接着剤上に電
子部品を載せる工程、及び上記二液室温硬化型エポキシ
系接着剤の反応硬化により上記電子部品を上記プリント
基板に接着固定する工程を施す電子部品の接着方法。After applying a two-component room temperature curing epoxy adhesive containing a photocurable resin and a photosensitizer to a predetermined position on the printed circuit board, the adhesive is irradiated with ultraviolet rays to determine the viscosity of the adhesive. placing the electronic component on the adhesive of the printed circuit board; and adhesively fixing the electronic component to the printed circuit board by reaction curing of the two-component room temperature curing epoxy adhesive. Adhesion method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4506085A JPS61202492A (en) | 1985-03-05 | 1985-03-05 | Adhesion of electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4506085A JPS61202492A (en) | 1985-03-05 | 1985-03-05 | Adhesion of electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61202492A true JPS61202492A (en) | 1986-09-08 |
Family
ID=12708813
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4506085A Pending JPS61202492A (en) | 1985-03-05 | 1985-03-05 | Adhesion of electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61202492A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006135248A (en) * | 2004-11-09 | 2006-05-25 | Fujitsu Ltd | Method and apparatus of flip-chip packaging of semiconductor chip |
-
1985
- 1985-03-05 JP JP4506085A patent/JPS61202492A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006135248A (en) * | 2004-11-09 | 2006-05-25 | Fujitsu Ltd | Method and apparatus of flip-chip packaging of semiconductor chip |
| JP4644469B2 (en) * | 2004-11-09 | 2011-03-02 | 富士通株式会社 | Flip chip mounting method and mounting apparatus for semiconductor chip |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5943557A (en) | Method and structure for attaching a semiconductor die to a lead frame | |
| JPH0774328B2 (en) | Adhesive for temporary fixing of electronic parts | |
| JP3219793B2 (en) | Method for mounting SMD components on a substrate | |
| DE60033552D1 (en) | SOLDERANT, SOLDER PASTE AND SOLDERING PROCESS | |
| JPH06326449A (en) | Electronic component fixing method | |
| JPS61202492A (en) | Adhesion of electronic component | |
| JPH0234987A (en) | Method of mounting component on both-side substrate | |
| JP2573829B2 (en) | Mounting method of surface mount type electronic element and electronic device mounting surface mount type electronic element | |
| JPS59998B2 (en) | Printed wiring board manufacturing method | |
| JPS6321895A (en) | Bonding system of surface mount parts | |
| US5881947A (en) | Method for soldering | |
| JP3525752B2 (en) | Component soldering method and circuit board manufacturing method | |
| JPS6372194A (en) | Method of mounting electronic component | |
| JPS636898A (en) | Method of soldering leadless electronic parts | |
| JPS59186388A (en) | Method of connecting printed board | |
| JPS6014492A (en) | Method of soldering printed circuit board | |
| JPS5967690A (en) | Method of mounting on both side surfaces of board | |
| JPS63262895A (en) | Method of mounting electronic component | |
| JPH02104494A (en) | Solder flux precursor of printed wiring board | |
| JPS63177584A (en) | Assembly of hybrid integrated circuit | |
| JPS6226890A (en) | Electronic component mounting apparatus | |
| JPS60150694A (en) | Method of mounting electric part | |
| JPH03163895A (en) | Mounting of electronic parts | |
| JPH03219691A (en) | Parts mounting in circuit board | |
| JPH04269893A (en) | Mounting structure for electronic component |