JPS6226890A - Electronic component mounting apparatus - Google Patents
Electronic component mounting apparatusInfo
- Publication number
- JPS6226890A JPS6226890A JP16641285A JP16641285A JPS6226890A JP S6226890 A JPS6226890 A JP S6226890A JP 16641285 A JP16641285 A JP 16641285A JP 16641285 A JP16641285 A JP 16641285A JP S6226890 A JPS6226890 A JP S6226890A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- adhesive
- circuit board
- printed circuit
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
Landscapes
- Lining Or Joining Of Plastics Or The Like (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（イ）産業上の利用分野
本発明はフラットパッケージ型のＩＣ又はリード線のな
いチップ状をなした電子部品をプリント基板に装着する
電子部品の装着装置に関する。DETAILED DESCRIPTION OF THE INVENTION (A) Field of Industrial Application The present invention relates to an electronic component mounting apparatus for mounting a flat package type IC or a chip-shaped electronic component without lead wires onto a printed circuit board.
（ロ） 従来技術
一般に電子部品をプリント基板の所定位置に装着する場
合、その実装方法として次のものがある。(b) Prior Art Generally, when electronic components are mounted on a predetermined position on a printed circuit board, there are the following mounting methods.
（５）接着剤をプリント基板上の接合用の銅箔間［塗布
後、電子部品を装着、接着剤を硬化、ディッピング等に
よる半田付する。(5) Apply adhesive between the copper foils for bonding on the printed circuit board [After application, electronic components are mounted, the adhesive is cured, and soldered by dipping, etc.
（Ｂ） ソルダクリームなプリント基板上の接合用の
銅箔面上に塗布後、電子部品を装着、前記ソルダクリー
ムリフローを施す。(B) After applying solder cream to the copper foil surface for bonding on a printed circuit board, electronic components are mounted and the solder cream reflow is performed.
（Ｃ） ソルダクリームをプリント基板上の接合用の
銅箔面上に塗布後、接着剤を前記銅箔間に塗布し、電子
部品を装着して前記接着剤を硬化し、ソルダクリームリ
フ０−を施す。また従来例囚における改良型として特開
昭５９−１）３６９１号において、プリント基板に塗布
した接着剤を塗布後に予め紫外線の照射あるいは加熱を
行い接着剤の保持力を強化しく接着剤の粘度を上げろ）
、電子部品の装着、接着剤硬化、ディッピング等により
半田付する技術もある。(C) After applying solder cream on the surface of the copper foil for bonding on the printed circuit board, adhesive is applied between the copper foils, electronic components are mounted, and the adhesive is hardened, and the solder cream lift 0- administer. In addition, as an improved version of the conventional example, in JP-A No. 59-1) 3691, the adhesive applied to the printed circuit board is irradiated with ultraviolet rays or heated in advance after application to strengthen the adhesive's holding power and reduce the viscosity of the adhesive. Raise it)
There are also techniques for mounting electronic components, soldering by curing adhesive, dipping, etc.
（ハ）発明が解決しようとする問題点
前述の従来例における囚では、先ず接着剤の塗布性が良
（なければならず、第２に電子部品のプリント基板への
装着後の移動時ＶＣＣ電電子部品ズしが生じないために
保持力が犬でなければならない。第３に常温（５℃〜３
５℃）における安定性が良く、又硬化条件を与えた場合
硬化速度が大で、接着力が強いことが要求され、特に第
１と第２の性質は互に相反しており、現在装着装喧の高
速化に伴って大きな問題となっている。(c) Problems to be solved by the invention In the case of the conventional example described above, firstly, the adhesive must have good coating properties, and secondly, when moving the electronic component after mounting it on the printed circuit board, the VCC voltage is The holding power must be excellent in order to prevent electronic parts from dripping.Thirdly, at room temperature (5℃~3℃)
5℃), high curing speed and strong adhesive strength under certain curing conditions.In particular, the first and second properties are contradictory to each other, and currently there are no mounting devices available. This has become a big problem as traffic speeds increase.
次に前述の（Ｂ）では、半田をクリーム状化するために
稀釈剤として揮発性の良い有機溶剤を使用しているため
、塗布後の放置時間が長いと前記溶剤が揮発してしまい
、粘着力が下がり、電子部品のプリント基板への装着が
できな（なったり、部品ズレが生じてしまう。又半田溶
融時には前記部品がフリーな状態にあり、該部品が動き
易い欠点がある。Next, in (B) above, a highly volatile organic solvent is used as a diluent to cream the solder, so if it is left for a long time after application, the solvent will evaporate and the adhesive will stick. The force decreases, making it impossible to attach the electronic component to the printed circuit board, or causing component misalignment.Furthermore, when the solder melts, the component is in a free state and has the disadvantage of being susceptible to movement.
更に前述の（Ｑの方法では、前記（Ａ）及び（Ｂｌの併
用であり、改良型ではあるが、ソルダクリーム塗布後）
長時間放置てより、ソルダクリームが高粘度となり、所
定の銅箔と前記部品の電極との間に距離を置いたまま、
接着剤が硬化された後に半田付され、このとき半田付不
良が生じ易い欠点がちつた。本発明は、前記欠１気に鑑
みなされたもので、塗布する接着剤の塗布性の良い状態
にて所定の接着剤？塗布して効率の良い電子部品の樅着
装置を提イ共−することを目的しする、
（に）問題へな解決するだめの手段
本発明は、複数の′７！を極を有する電子部品を、前記
電極に対応して設けた複数の銅箔を有するプリント基板
に装着する電子部品の装着装置において、前記所定の銅
箔間に前記電子部品の一面？仮固定する接着剤を塗布し
、該電子部品を前記プリント基板に装着した後、前記電
子部品のＩｐＩ面と前記プリント基板にわたって付着し
た接着に対し、硬化用のビームを照射するビーム手段を
設けた構成である。Furthermore, the above-mentioned method (Q) uses the above-mentioned (A) and (Bl) in combination, and although it is an improved type, after applying the solder cream)
After leaving it for a long time, the solder cream becomes highly viscous, and while keeping a distance between the specified copper foil and the electrode of the component,
Soldering was carried out after the adhesive had hardened, and this process had the disadvantage that poor soldering was likely to occur. The present invention was made in view of the above-mentioned concerns, and it is possible to apply a predetermined adhesive in a state where the adhesive has good coating properties. It is an object of the present invention to provide a means for solving the problems of the present invention, which aims to provide a device for coating and efficiently bonding electronic components. In an electronic component mounting apparatus for mounting an electronic component having a pole on a printed circuit board having a plurality of copper foils provided corresponding to the electrodes, one side of the electronic component is placed between the predetermined copper foils. After applying a temporary fixing adhesive and mounting the electronic component on the printed circuit board, a beam means is provided for irradiating a curing beam to the adhesive adhered across the IpI surface of the electronic component and the printed circuit board. It is the composition.
（ホ）作用
本発明の構成により、接着剤の塗布性の良い状態で、プ
リント基板に接着剤を塗布でき、更［（前記電子部品の
側面と前記プリント基板にわたって付着ｌまた接着剤を
仮硬化可能となり、該接着剤による前記電子部品の保持
力も保ち得ろ。(e) Effect: With the configuration of the present invention, the adhesive can be applied to the printed circuit board in a state where the adhesive has good applicability. This makes it possible to maintain the holding power of the electronic component by the adhesive.
（へ）実施例
図面に従−）て本発明を説明すると、第１図は本発明の
電子部品の装着装置の要部斜視図、＠２図は同装置の斜
視図を示し、（１）はチップ状の電子部品、（２）は前
記部品が収納されたテープ、（３）は該テープが巻回さ
れたテープリール、（４）は送出ユニット、（５）は前
記電子部品を吸着する手段としての真空チャック、（６
）は位置決め台、（力（８）はパルスモータ、（９）は
前記パルスモータによりＸ−Ｙ方向に移動するＸＹテー
ブル、α■はプリント基板、Ｑｌ）はテープ移動台、０
２１ａ’ａは前記電子部品の電極、（１３）Ｑりは前記
プリント基板の所定位置に設けられ、半田にて前記電極
が固定される銅箔、０４は前記プリント基板の銅箔間に
接着剤塗布手段（図示せず）＆Ｃより塗布された接着剤
で、前記真空チャックによって吸着後所定位置に装着さ
れたときに前記電子部品の側面に付着している。（１５
１（ｌＥ９は前記接着剤を仮硬化させるため、電磁ビー
ム（を磁波）を導出する光ファイバー、（１６）（ｌＧ
は該光ファイバーから放射されたビーム束、０はファイ
バー増付板を示す。The present invention will be explained according to the embodiment drawings. Figure 1 is a perspective view of the main parts of the electronic component mounting device of the present invention, Figure @2 is a perspective view of the same device, and (1) is a chip-shaped electronic component, (2) is a tape containing the component, (3) is a tape reel around which the tape is wound, (4) is a delivery unit, and (5) is a suction unit for the electronic component. Vacuum chuck as a means (6
) is a positioning table, (force (8) is a pulse motor, (9) is an XY table that moves in the X-Y direction by the pulse motor, α■ is a printed circuit board, Ql) is a tape moving table, 0
21a'a is an electrode of the electronic component, (13) Q is a copper foil provided at a predetermined position on the printed circuit board and to which the electrode is fixed with solder, and 04 is an adhesive between the copper foils of the printed circuit board. The adhesive is applied by a coating means (not shown) &C and adheres to the side surface of the electronic component when it is attached to a predetermined position after being sucked by the vacuum chuck. (15
1 (lE9 is an optical fiber for emitting an electromagnetic beam (magnetic wave) to temporarily cure the adhesive, (16) (lG
represents the beam bundle emitted from the optical fiber, and 0 represents the fiber extension plate.
次に第２図における動作を説明すると、電子部品（１）
はテープ（２）（２＋・・・から送出ユニット（４）（
４）・・・によって所定ピンチずつ送出され、テープリ
ール＋３１＋３１・・・より所望のテープリールが選択
される。所定のテープリールが選択されると、真空チャ
ック（５）によって前記所定のテープリールに収納され
た電子部品が吸着され、プリント基板００）に装着され
る。Next, to explain the operation in Fig. 2, electronic component (1)
is the tape (2) (2+... to the sending unit (4) (
4) A desired tape reel is selected from tape reel +31+31, etc. by sending out a predetermined pinch at a time. When a predetermined tape reel is selected, the electronic components housed in the predetermined tape reel are sucked by the vacuum chuck (5) and mounted on the printed circuit board 00).
ここでｇ＋ｒ記Ｘ−Ｙテーブル（９）にプリント基板（
１０）が搬送される前の工程では、接着剤塗布装置（ス
クリーン印刷又はディスペンサー）による接着剤の滴下
により、電子部品の装着位置に対して接着を塗布してお
（。この状態で前記′電子部品の装着工程で接着剤Ｏａ
の上方から電子部品（１）ヲ装着すると、第１図に示す
如く、該電子部品（１）の側面に接着剤がはみ出して付
着する。Here, the printed circuit board (
10) In the process before being transported, adhesive is applied to the mounting position of the electronic component by dropping adhesive using an adhesive applicator (screen printing or dispenser). Adhesive Oa during the parts installation process
When the electronic component (1) is mounted from above, the adhesive protrudes and adheres to the side surface of the electronic component (1), as shown in FIG.
そこで前記電子部品（１）の側面に付着した接着剤０４
）に対して光ファイバ（１５）（１５） ＆通して送ら
れた電磁波のビーム束（１６１（Ｉｅを照射して前記接
着剤α滲を仮硬化させた後ＸＹテーブル（９）ヲ移動さ
せる。前記光ファイバ１５１（１５）から送出される電
磁波としては、波長が３５０ｒＬｍ〜６００／４７Ｈの
ものを用い、０．０５〜０．２秒間照射させれば曵い、
又接着剤α（イ）には、前記波長域の電磁波による硬化
可能な材質として例えばアクリル基を含んだポリエステ
ル系紫外線硬化樹脂（反応性稀釈剤、光重合触媒、安定
剤、熱硬化促進剤、無機充填剤、着色顔料等を含んだ光
重合接着剤）があげられる。Therefore, the adhesive 04 attached to the side surface of the electronic component (1)
) The beam bundle of electromagnetic waves (161 (Ie) is irradiated to temporarily harden the adhesive α exudate, and then the XY table (9) is moved. The electromagnetic wave sent out from the optical fiber 151 (15) has a wavelength of 350 rLm to 600/47H, and if irradiated for 0.05 to 0.2 seconds, it will be washed away. For example, a polyester ultraviolet curable resin containing an acrylic group (reactive diluent, photopolymerization catalyst, stabilizer, thermosetting accelerator, inorganic filler, coloring pigment, etc.) is used as a material that can be cured by electromagnetic waves in the above wavelength range. photopolymerizable adhesives).
次に前記プリント基板αｅに対する全ての電子部品の装
着が終了したとき、該プリント基板な紫外線炉又は加熱
用の炉にて前記プリント基板に付、管した接着剤を本硬
化させ、その後の半田フローにて半田付すれば、前記電
子部品は前記プリント基板に完全に同情されると共に所
定の銅箔に対して各電子部品の電極は電気的に接続され
ろことになる。Next, when all the electronic components have been attached to the printed circuit board αe, the adhesive applied to the printed circuit board and piped is fully cured in an ultraviolet oven or a heating furnace, and the subsequent soldering flow is performed. By soldering, the electronic components will be completely aligned with the printed circuit board, and the electrodes of each electronic component will be electrically connected to the predetermined copper foil.
（ト）発明の効果
本発明の電子部品の装着装置によれば、従来の様に、あ
る程度の揮発性な有すると共に粘度を有する接着剤の上
に、電子部品な装着した後前記電子部品の側面に付着し
た接着剤を所定の時間電磁波を照射して仮硬化させるよ
うになすことができ、特に前記電子部品のプリント基板
への装着時のプリント基板の移動即ちＸＹテーブルを移
動させろ際に前記電子部品がズしたりするのを未然に防
止し得ろ。(G) Effects of the Invention According to the electronic component mounting apparatus of the present invention, after mounting the electronic component on an adhesive having a certain degree of volatility and viscosity, as in the conventional case, the side surface of the electronic component is The adhesive adhered to the electronic component can be temporarily cured by irradiating electromagnetic waves for a predetermined period of time. In particular, when the electronic component is mounted on the printed circuit board, when the printed circuit board is moved, that is, when the XY table is moved, the adhesive adhered to the electronic component can be temporarily cured. Prevent parts from coming loose.
第１図は本発明の′成子部品の装着装置の要部斜視図、
第２図は、同装瞠の斜視図を示す。
主な図番の説明
（１）・・・電子部品、 （５）・・・真空チャック、
（９）・・・ＸＹテーブル、 （Ｉｎ・・・プリント
基板、 α２・・・電極、（１３１・・・銅箔、 α■
・・・光ファイバー、（ＩＱ・・・ビーム束。
出願人 三洋電機株式会社 外１名
代理人 弁理士 佐 野 静 夫
ｊｌｌ 図
第２図FIG. 1 is a perspective view of a main part of a mounting device for a child part according to the present invention;
FIG. 2 shows a perspective view of the same ball. Explanation of main drawing numbers (1)...Electronic components, (5)...Vacuum chuck,
(9)...XY table, (In...printed circuit board, α2...electrode, (131...copper foil, α■
...Optical fiber, (IQ...beam bundle. Applicant: Sanyo Electric Co., Ltd. and one other attorney: Shizuo Sano, patent attorney) Figure 2
Claims (1)
して設けた複数の銅箔を有するプリント基板に装着する
電子部品の装着装置において、前記所定の銅箔間に前記
電子部品の一面を仮固定する接着剤を塗布し、該電子部
品を前記プリント基板に装着した後、前記電子部品の側
面と前記プリント基板にわたって付着した接着剤に対し
、硬化用のビームを照射するビーム手段を設けたことを
特徴とする電子部品の装着装置。(1) In an electronic component mounting device for mounting an electronic component having a plurality of electrodes onto a printed circuit board having a plurality of copper foils provided corresponding to the electrodes, one side of the electronic component is placed between the predetermined copper foils. After applying an adhesive to temporarily fix the electronic component and mounting the electronic component on the printed circuit board, a beam means is provided for irradiating a curing beam to the adhesive adhered to the side surface of the electronic component and the printed circuit board. An electronic component mounting device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16641285A JPS6226890A (en) | 1985-07-26 | 1985-07-26 | Electronic component mounting apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16641285A JPS6226890A (en) | 1985-07-26 | 1985-07-26 | Electronic component mounting apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6226890A true JPS6226890A (en) | 1987-02-04 |
Family
ID=15830942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16641285A Pending JPS6226890A (en) | 1985-07-26 | 1985-07-26 | Electronic component mounting apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6226890A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0426720U (en) * | 1990-06-28 | 1992-03-03 |
-
1985
- 1985-07-26 JP JP16641285A patent/JPS6226890A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0426720U (en) * | 1990-06-28 | 1992-03-03 |
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