JPH02288393A - Method and device for mounting melph component - Google Patents
Method and device for mounting melph componentInfo
- Publication number
- JPH02288393A JPH02288393A JP1110395A JP11039589A JPH02288393A JP H02288393 A JPH02288393 A JP H02288393A JP 1110395 A JP1110395 A JP 1110395A JP 11039589 A JP11039589 A JP 11039589A JP H02288393 A JPH02288393 A JP H02288393A
- Authority
- JP
- Japan
- Prior art keywords
- melf
- component
- mounting
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 15
- 239000000853 adhesive Substances 0.000 claims abstract description 31
- 230000001070 adhesive effect Effects 0.000 claims description 27
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract 3
- 230000001678 irradiating effect Effects 0.000 abstract 1
- 238000001723 curing Methods 0.000 description 9
- 210000000078 claw Anatomy 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
この発明は、円筒形のチップ部品すなわちメルフ部品を
プリント基板に実装するメルフ部品実装方法および装置
に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method and apparatus for mounting a cylindrical chip component, that is, a MELF component, on a printed circuit board.
［従来の技術］
メルフ部品ヲ１個ずつプリント基板に装着するワン・パ
イ・ワン方式のメルフ部品装着機においては通常、第３
図のように、Ｘ−Ｙテーブルに乗せたプリント基板ｌ上
の所定箇所（メルフ部品を装着すべき所定箇所）に紫外
線硬化型の接着剤２を塗布し、次いでメルフ部品装着機
の装着ヘッドにより、前記接着剤の塗布された所定箇所
にメルフ部品３を１個ずつ装着しく第４図参照）、続く
工程で、接着剤硬化装置である紫外線照射装置により接
着剤に紫外線を照射して接着剤を硬化させていた。[Prior art] In a one-piece-one type Melf component mounting machine that mounts Melf parts one by one onto a printed circuit board, the third
As shown in the figure, an ultraviolet curing adhesive 2 is applied to a predetermined location on the printed circuit board l placed on an X-Y table (a predetermined location where MELF components are to be mounted), and then the mounting head of the MELF component mounting machine is used to (See Figure 4), and in the following process, the adhesive is irradiated with ultraviolet rays by an ultraviolet ray irradiation device, which is an adhesive curing device, to harden the adhesive. was hardening.
［発明が解決しようとする課題］
上記従来の接着剤硬化方法では、Ｘ−Ｙテーブルの移動
時に、接着剤が未硬化であるから例えば第５図に示すよ
うにメルフ部品３に位置ずれが発生することがある。[Problems to be Solved by the Invention] In the above-mentioned conventional adhesive curing method, when the X-Y table is moved, the adhesive is uncured, so the position of the Melf part 3 occurs as shown in FIG. 5, for example. There are things to do.
本発明は上記従来の欠点を解消して、実装すべきメルフ
部品に位置ずれが発生するおそれのないメルフ部品実装
方法および装置を得ることを目的とする。SUMMARY OF THE INVENTION An object of the present invention is to eliminate the above-mentioned conventional drawbacks and to provide a method and apparatus for mounting Melf parts without the risk of positional deviation occurring in Melf parts to be mounted.
［課題を解決するための手段］
上記課題を解決する請求項１の発明は、プリンｌ−基板
上のメルフ部品を装着すべき所定箇所にあらかじめ接着
剤を塗布し、次いで、装着ヘッドによりメルフ部品を前
記所定箇所に装着し、この装着動作と同時に紫外線を照
射して前記接着剤を硬化させることを特徴とするメルフ
部品実装方法である。[Means for Solving the Problems] The invention of claim 1 which solves the above problem is to apply an adhesive in advance to a predetermined location on the printed circuit board where the Melf parts are to be mounted, and then to attach the Melf parts using the mounting head. The MELFT component mounting method is characterized in that the adhesive is mounted on the predetermined location, and simultaneously with this mounting operation, ultraviolet rays are irradiated to cure the adhesive.
請求項２の発明は、請求項１のメルフ部品実装方法を実
施する装置であり、プリント基板にメルフ部品を実装す
るためのメルフ部品実装装置であって、メルフ部品をつ
かんでプリント基板上の所定箇所に装着する装着ヘッド
に、前記プリント基板上に塗布されたメルフ部品接着用
の接着剤を硬化させるための紫外線照射装置を設けたこ
とを特徴とするメルフ部品実装装置である。The invention according to claim 2 is an apparatus for carrying out the method for mounting Melf components according to claim 1, and is a Melf component mounting apparatus for mounting Melf components on a printed circuit board, the device gripping the Melf components and placing them in a predetermined position on the printed circuit board. This is a MELF component mounting apparatus characterized in that a mounting head for mounting onto a location is provided with an ultraviolet irradiation device for curing an adhesive for adhering MELF components applied onto the printed circuit board.
［作用］
上記のメルフ部品実装方法または装置によれば、メルフ
部品をプリント基板に装着する際に同時に接着剤の硬化
が行われるので、プリント基板の移動の際にメルフ部品
に位置ずれが発生するおそれはない。[Function] According to the above Melf component mounting method or device, the adhesive is cured at the same time as the Melf component is mounted on the printed circuit board, so that the Melf component may be misaligned when the printed circuit board is moved. There's no fear.
［実施例］
以下、本発明のメルフ部品実装方法および装置の一実施
例を第１図、第２図を参照して説明する。[Example] Hereinafter, an example of the Melf component mounting method and apparatus of the present invention will be described with reference to FIGS. 1 and 2.
符号４は、プリント基板実装ラインにおけるメルフ部品
装着機の装着ヘッドであり、メルフ部品をつかむための
開閉する１対の爪４ａを備えている。この装着ヘッド４
には、紫外線発生管５に光ファイバ６を介して接続され
た紫外線照射口（紫外線照射装置）７がプリント基板１
上のメルフ部品接着箇所すなわち接着剤塗布箇所に向け
て収り付けられている。Reference numeral 4 denotes a mounting head of a MELF component mounting machine in a printed circuit board mounting line, and is provided with a pair of claws 4a that open and close for gripping MELF components. This mounting head 4
, an ultraviolet irradiation port (ultraviolet irradiation device) 7 connected to an ultraviolet generation tube 5 via an optical fiber 6 is connected to a printed circuit board 1.
It is placed toward the upper Melf parts bonding area, that is, the adhesive application area.
上記の装着ヘッド４でメルフ部品３を実装する動作を説
明すると、Ｘ−Ｙテーブルに乗せられたプリント基板１
にはそのメルフ部品接着箇所にあらかしめ紫外線硬化型
の接着剤が塗布される。接着剤を塗布されたプリント基
板１はＸ−Ｙテーブルの移動によりＸ−Ｙ方向に移動し
、メルフ部品装着位置が順次装着ヘッド４の部品装着の
定位置に位置決めされる。装着ヘッド４は、開閉する爪
４ａでメルフ部品３をつかんで部品装着の定位置に移動
し、この定位置で下降し、メルフ部品３をプリント基板
１のメルフ部品装着位置に装着する。To explain the operation of mounting MELF components 3 using the mounting head 4 described above, the printed circuit board 1 placed on the X-Y table is
An ultraviolet curing adhesive is applied to the parts where the Melf parts are to be glued. The printed circuit board 1 coated with adhesive is moved in the X-Y direction by the movement of the X-Y table, and the MELF component mounting position is sequentially positioned at the regular component mounting position of the mounting head 4. The mounting head 4 grasps the Melf component 3 with claws 4a that open and close, moves to a fixed position for mounting the component, descends from this fixed position, and mounts the Melf component 3 to the Melf component mounting position on the printed circuit board 1.
これによりメルフ部品３には前記のあらがしめ塗布され
た接着剤２が図示のように付着する。この状態で、つま
り装着ヘッド２によりメルフ部品３をつかんだままの状
態で、紫外線発生管５からの紫外線を紫外線照射ロアが
ら接着剤２に照射し、接着剤２を硬化させる。この硬化
に要する時間は短時間でよいから、工程上特に問題はな
い。硬化後、装着ヘッド４はメルフ部品３を開放すると
ともに上昇し、次のメルフ部品の装着動作に移る。As a result, the rough-applied adhesive 2 adheres to the MELF component 3 as shown in the figure. In this state, that is, while the MELF component 3 is being gripped by the mounting head 2, the adhesive 2 is irradiated with ultraviolet rays from the ultraviolet ray generating tube 5 through the ultraviolet irradiation lower part to harden the adhesive 2. Since the time required for this curing is only a short time, there is no particular problem in the process. After curing, the mounting head 4 releases the MELF component 3 and moves upward to proceed to the mounting operation of the next MELF component.
一方、プリント基板１はＸ−Ｙテーブルの移動で次の部
品装着位置が装着ヘッド４の定位置に位置決めされる。On the other hand, the next component mounting position of the printed circuit board 1 is determined by the movement of the X-Y table at the fixed position of the mounting head 4.
この動作をメルフ部品１個ずつ繰り返してプリント基板
上の必要なメルフ部品の実装を行う、１枚のプリント基
板についてすべてのメルフ部品の実装が終わると、プリ
ント基板は次の他の工程に移送される。This operation is repeated for each Melf part one by one to mount the necessary Melf parts on the printed circuit board. When all the Melf parts have been mounted on one printed board, the printed board is transferred to the next other process. Ru.
上記動作において、プリント基板１が１個の部品装着毎
にＸ−Ｙテーブルとともに移動する時には既に接着剤が
硬化しているから、メルフ部品３に位置ずれが発生する
おそれはない。したがって、Ｘ−Ｙテーブルの移動速度
を速めることも可能である。In the above operation, the adhesive has already hardened when the printed circuit board 1 moves together with the XY table each time one component is mounted, so there is no possibility that the MELF component 3 will be misaligned. Therefore, it is also possible to increase the moving speed of the X-Y table.
なお、紫外線を照射する間、装着ヘッド４の爪４ａはメ
ルフ部品３から離し装着ヘッド４自体はそのままの位置
としておくことも可能である。この場きでも、プリント
基板の移動がないので位置ずれのおそれはない。Note that, while the ultraviolet rays are being irradiated, the claws 4a of the mounting head 4 can be separated from the MELF component 3, and the mounting head 4 itself can be left in the same position. Even in this case, since there is no movement of the printed circuit board, there is no risk of misalignment.
なお、実施例は、装着ヘッドは定位置にあり、プリント
基板が部品毎に移動する場合のものであるが、このよう
な方式に限らず、プリント基板に塗布した接着剤にメル
フ部品を付着させたが接着剤が硬化していない、という
状態でプリント基板を移動させる工程を含む場合に適用
可能である。In addition, in the example, the mounting head is in a fixed position and the printed circuit board is moved part by part, but this method is not limited to this method.Melf parts can be attached to adhesive applied to the printed board. However, it is applicable to cases where the process includes a step of moving the printed circuit board in a state where the adhesive is not cured.
［発明の効果］
本発明のメルフ部品実装方法および装置によれば、次の
ような効果を奏する。[Effects of the Invention] According to the Melf component mounting method and apparatus of the present invention, the following effects are achieved.
装着ヘッドによりメルフ部品をプリント基板に装着する
際に同時に接着剤の硬化が行われるので、プリント基板
の移動の際にメルフ部品の位置ずれが発生するおそれは
なくなる。Since the adhesive is cured at the same time when the MELF component is mounted on the printed circuit board by the mounting head, there is no possibility that the MELF component will be misaligned when the printed circuit board is moved.
また、メルフ部品の位置ずれのおそれがないので、部品
ごとのプリント基板移動の速度（Ｘ−Ｙテーブルの移動
速度）を向上させて、能率向上を図ることができる。Furthermore, since there is no risk of positional displacement of MELF parts, the speed of moving the printed circuit board for each part (the moving speed of the X-Y table) can be improved, and efficiency can be improved.
また、別工程の接着剤硬化工程が不要となるので、工程
数が減り、生産性が向上する。Furthermore, since a separate adhesive curing step is not required, the number of steps is reduced and productivity is improved.
第１図は本発明の一実施例を示すメルフ部品実装装置の
装着ヘッド近傍の正面図、第２図は同側面図、第３図〜
第５図は従来例を説明するもので、第３図は接着剤塗布
状態の図、第４図はメルフ部品装着状態の図、第５図は
プリント基板上のメルフ部品の位置ずれを説明する平面
図である。
１・・・プリント基板、２・・・紫外線硬化型の接着剤
、３・・・メルフ部品、４・・・装着ヘッド、４ａ・・
・爪、５・・・紫外線発生管、７・・・紫外線照射口（
紫外線照射装置）。FIG. 1 is a front view of the vicinity of the mounting head of a MELF component mounting apparatus showing an embodiment of the present invention, FIG. 2 is a side view of the same, and FIGS.
Fig. 5 explains a conventional example, Fig. 3 shows a state in which adhesive is applied, Fig. 4 shows a state in which Melf parts are attached, and Fig. 5 explains misalignment of Melf parts on a printed circuit board. FIG. DESCRIPTION OF SYMBOLS 1... Printed circuit board, 2... Ultraviolet curing adhesive, 3... MELF parts, 4... Mounting head, 4a...
・Claw, 5... Ultraviolet ray generator tube, 7... Ultraviolet irradiation port (
ultraviolet irradiation device).
Claims (2)
所にあらかじめ接着剤を塗布し、次いで、装着ヘッドに
よりメルフ部品を前記所定箇所に装着し、この装着動作
と同時に紫外線を照射して前記接着剤を硬化させること
を特徴とするメルフ部品実装方法。(1) Apply adhesive in advance to a predetermined location on the printed circuit board where the MELF component is to be attached, then attach the MELF component to the predetermined location using a mounting head, and at the same time as this mounting operation, irradiate ultraviolet rays to bond the A MELF component mounting method characterized by curing the agent.
フ部品実装装置であって、メルフ部品をつかんでプリン
ト基板上の所定箇所に装着する装着ヘッドに、前記プリ
ント基板上に塗布されたメルフ部品接着用の接着剤を硬
化させるための紫外線照射装置を設けたことを特徴とす
るメルフ部品実装装置。(2) A MELF component mounting device for mounting MELF components on a printed circuit board, in which a mounting head that grasps MELF components and mounts them on a predetermined location on the printed circuit board is provided with MELF component adhesive applied onto the printed circuit board. A MELF component mounting device characterized by being equipped with an ultraviolet irradiation device for curing adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1110395A JPH02288393A (en) | 1989-04-28 | 1989-04-28 | Method and device for mounting melph component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1110395A JPH02288393A (en) | 1989-04-28 | 1989-04-28 | Method and device for mounting melph component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02288393A true JPH02288393A (en) | 1990-11-28 |
Family
ID=14534726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1110395A Pending JPH02288393A (en) | 1989-04-28 | 1989-04-28 | Method and device for mounting melph component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02288393A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015008339A (en) * | 2014-10-17 | 2015-01-15 | 富士機械製造株式会社 | Manufacturing operation machine |
| US9363936B2 (en) | 2010-04-29 | 2016-06-07 | Fuji Machine Mfg. Co., Ltd. | Manufacture work machine and manufacture work system |
| US9374935B2 (en) | 2010-04-29 | 2016-06-21 | Fuji Machine Mfg. Co., Ltd. | Manufacture work machine |
| JP2016196081A (en) * | 2016-06-22 | 2016-11-24 | 富士機械製造株式会社 | Manufacturing operation machine and manufacturing operation system |
-
1989
- 1989-04-28 JP JP1110395A patent/JPH02288393A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9363936B2 (en) | 2010-04-29 | 2016-06-07 | Fuji Machine Mfg. Co., Ltd. | Manufacture work machine and manufacture work system |
| US9374935B2 (en) | 2010-04-29 | 2016-06-21 | Fuji Machine Mfg. Co., Ltd. | Manufacture work machine |
| US9485895B2 (en) | 2010-04-29 | 2016-11-01 | Fuji Machine Mfg. Co., Ltd. | Central control device and centralized control method |
| US10098269B2 (en) | 2010-04-29 | 2018-10-09 | Fuji Machine Mfg. Co., Ltd. | Manufacture work machine for controlling a plurality of work-element performing apparatuses by central control device |
| JP2015008339A (en) * | 2014-10-17 | 2015-01-15 | 富士機械製造株式会社 | Manufacturing operation machine |
| JP2016196081A (en) * | 2016-06-22 | 2016-11-24 | 富士機械製造株式会社 | Manufacturing operation machine and manufacturing operation system |
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