JPS6371542U - - Google Patents

Info

Publication number
JPS6371542U
JPS6371542U JP16721186U JP16721186U JPS6371542U JP S6371542 U JPS6371542 U JP S6371542U JP 16721186 U JP16721186 U JP 16721186U JP 16721186 U JP16721186 U JP 16721186U JP S6371542 U JPS6371542 U JP S6371542U
Authority
JP
Japan
Prior art keywords
substrate
semiconductor device
hybrid
standoffs
protrude
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16721186U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP16721186U priority Critical patent/JPS6371542U/ja
Publication of JPS6371542U publication Critical patent/JPS6371542U/ja
Pending legal-status Critical Current

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Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案になる半導体装置の好適な一実
施例を示す分解斜視図、第2図は同組立状態を示
す縦断側面図、第3図は従来の半導体装置の縦断
側面図である。 10……半導体装置、12……ハイブリツドI
C、13……ベース(基板)、15……スタンド
オフ。
FIG. 1 is an exploded perspective view showing a preferred embodiment of a semiconductor device according to the present invention, FIG. 2 is a longitudinal sectional side view showing the assembled state, and FIG. 3 is a longitudinal sectional side view of a conventional semiconductor device. 10...Semiconductor device, 12...Hybrid I
C, 13...Base (board), 15...Standoff.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板上に設けたハイブリツドICをキヤツプに
て封止したパツケージ型の半導体装置において、
スタンドオフを前記基板の両面側に所定量突出形
成して前記ハイブリツドICを前記基板より浮上
させて取付けてなる半導体装置。
In a package type semiconductor device in which a hybrid IC provided on a substrate is sealed with a cap,
A semiconductor device in which standoffs are formed to protrude by a predetermined amount on both sides of the substrate, and the hybrid IC is mounted so as to float above the substrate.
JP16721186U 1986-10-30 1986-10-30 Pending JPS6371542U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16721186U JPS6371542U (en) 1986-10-30 1986-10-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16721186U JPS6371542U (en) 1986-10-30 1986-10-30

Publications (1)

Publication Number Publication Date
JPS6371542U true JPS6371542U (en) 1988-05-13

Family

ID=31098930

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16721186U Pending JPS6371542U (en) 1986-10-30 1986-10-30

Country Status (1)

Country Link
JP (1) JPS6371542U (en)

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