JPS63172143U - - Google Patents
Info
- Publication number
- JPS63172143U JPS63172143U JP6547287U JP6547287U JPS63172143U JP S63172143 U JPS63172143 U JP S63172143U JP 6547287 U JP6547287 U JP 6547287U JP 6547287 U JP6547287 U JP 6547287U JP S63172143 U JPS63172143 U JP S63172143U
- Authority
- JP
- Japan
- Prior art keywords
- package
- heat dissipation
- mounting part
- semiconductor device
- plate portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 230000017525 heat dissipation Effects 0.000 claims description 4
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第1図は本考案に係る半導体装置の放熱構造の
実施例を示す部分断面斜視図、第2図はリードフ
レームを示す平面図、第3図は従来例を示す部分
断面図である。
1……半導体レーザ装置、2……半導体レーザ
チツプ、3……取付板、3a……放熱板部、4…
…電極部。
FIG. 1 is a partially sectional perspective view showing an embodiment of a heat dissipation structure for a semiconductor device according to the present invention, FIG. 2 is a plan view showing a lead frame, and FIG. 3 is a partially sectional view showing a conventional example. DESCRIPTION OF SYMBOLS 1... Semiconductor laser device, 2... Semiconductor laser chip, 3... Mounting plate, 3a... Heat sink part, 4...
...Electrode part.
Claims (1)
該電極部が外方に突出するように一体に保持し且
つ内部に前記半導体素子を収容するパツケージを
設けてなる半導体装置において、 前記取付部は板状体で形成されると共に、前記
パツケージ下面より突出するように延設して放熱
板部を有し、該放熱板部を幅広に形成し且つパツ
ケージ下面に沿うように折り曲げ、形成したこと
を特徴とする半導体装置の放熱構造。[Scope of claim for utility model registration] A mounting part and an electrode part in which a semiconductor element is disposed,
In a semiconductor device comprising a package in which the electrode part is integrally held so as to protrude outward and the semiconductor element is housed inside, the mounting part is formed of a plate-shaped body, and the mounting part is formed from a lower surface of the package. 1. A heat dissipation structure for a semiconductor device, comprising a protruding and extending heat dissipation plate portion, the heat dissipation plate portion being formed wide and bent along the lower surface of a package.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6547287U JPS63172143U (en) | 1987-04-30 | 1987-04-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6547287U JPS63172143U (en) | 1987-04-30 | 1987-04-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63172143U true JPS63172143U (en) | 1988-11-09 |
Family
ID=30902573
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6547287U Pending JPS63172143U (en) | 1987-04-30 | 1987-04-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63172143U (en) |
-
1987
- 1987-04-30 JP JP6547287U patent/JPS63172143U/ja active Pending