JPS6369982A - 電気絶縁性無機材料のメツキ下地処理方法 - Google Patents

電気絶縁性無機材料のメツキ下地処理方法

Info

Publication number
JPS6369982A
JPS6369982A JP21066386A JP21066386A JPS6369982A JP S6369982 A JPS6369982 A JP S6369982A JP 21066386 A JP21066386 A JP 21066386A JP 21066386 A JP21066386 A JP 21066386A JP S6369982 A JPS6369982 A JP S6369982A
Authority
JP
Japan
Prior art keywords
inorg
electrically insulating
insulating inorganic
thin film
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21066386A
Other languages
English (en)
Japanese (ja)
Other versions
JPH059518B2 (enrdf_load_stackoverflow
Inventor
Katsutoshi Kakizawa
柿沢　勝利
Yutaka Hagiwara
裕 萩原
Isao Yagi
八木　績
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kawai Musical Instruments Manufacturing Co Ltd
Original Assignee
Kawai Musical Instruments Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kawai Musical Instruments Manufacturing Co Ltd filed Critical Kawai Musical Instruments Manufacturing Co Ltd
Priority to JP21066386A priority Critical patent/JPS6369982A/ja
Publication of JPS6369982A publication Critical patent/JPS6369982A/ja
Publication of JPH059518B2 publication Critical patent/JPH059518B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
    • C23C18/1208—Oxides, e.g. ceramics
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/1229—Composition of the substrate
    • C23C18/1245—Inorganic substrates other than metallic

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Chemically Coating (AREA)
JP21066386A 1986-09-09 1986-09-09 電気絶縁性無機材料のメツキ下地処理方法 Granted JPS6369982A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21066386A JPS6369982A (ja) 1986-09-09 1986-09-09 電気絶縁性無機材料のメツキ下地処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21066386A JPS6369982A (ja) 1986-09-09 1986-09-09 電気絶縁性無機材料のメツキ下地処理方法

Publications (2)

Publication Number Publication Date
JPS6369982A true JPS6369982A (ja) 1988-03-30
JPH059518B2 JPH059518B2 (enrdf_load_stackoverflow) 1993-02-05

Family

ID=16593044

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21066386A Granted JPS6369982A (ja) 1986-09-09 1986-09-09 電気絶縁性無機材料のメツキ下地処理方法

Country Status (1)

Country Link
JP (1) JPS6369982A (enrdf_load_stackoverflow)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5175991A (en) * 1974-12-25 1976-06-30 Sharp Kk Tomeidenkyokuno seiho

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5175991A (en) * 1974-12-25 1976-06-30 Sharp Kk Tomeidenkyokuno seiho

Also Published As

Publication number Publication date
JPH059518B2 (enrdf_load_stackoverflow) 1993-02-05

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