JPS6364901B2 - - Google Patents

Info

Publication number
JPS6364901B2
JPS6364901B2 JP57164461A JP16446182A JPS6364901B2 JP S6364901 B2 JPS6364901 B2 JP S6364901B2 JP 57164461 A JP57164461 A JP 57164461A JP 16446182 A JP16446182 A JP 16446182A JP S6364901 B2 JPS6364901 B2 JP S6364901B2
Authority
JP
Japan
Prior art keywords
bonding
tool
bonding tool
tip
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57164461A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5954232A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP57164461A priority Critical patent/JPS5954232A/ja
Publication of JPS5954232A publication Critical patent/JPS5954232A/ja
Publication of JPS6364901B2 publication Critical patent/JPS6364901B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP57164461A 1982-09-21 1982-09-21 ボンデイングツ−ル Granted JPS5954232A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57164461A JPS5954232A (ja) 1982-09-21 1982-09-21 ボンデイングツ−ル

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57164461A JPS5954232A (ja) 1982-09-21 1982-09-21 ボンデイングツ−ル

Publications (2)

Publication Number Publication Date
JPS5954232A JPS5954232A (ja) 1984-03-29
JPS6364901B2 true JPS6364901B2 (enExample) 1988-12-14

Family

ID=15793608

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57164461A Granted JPS5954232A (ja) 1982-09-21 1982-09-21 ボンデイングツ−ル

Country Status (1)

Country Link
JP (1) JPS5954232A (enExample)

Also Published As

Publication number Publication date
JPS5954232A (ja) 1984-03-29

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