JPS6364055B2 - - Google Patents

Info

Publication number
JPS6364055B2
JPS6364055B2 JP58171992A JP17199283A JPS6364055B2 JP S6364055 B2 JPS6364055 B2 JP S6364055B2 JP 58171992 A JP58171992 A JP 58171992A JP 17199283 A JP17199283 A JP 17199283A JP S6364055 B2 JPS6364055 B2 JP S6364055B2
Authority
JP
Japan
Prior art keywords
semiconductor device
resin
substrate
semiconductor chip
powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58171992A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6063951A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP58171992A priority Critical patent/JPS6063951A/ja
Publication of JPS6063951A publication Critical patent/JPS6063951A/ja
Publication of JPS6364055B2 publication Critical patent/JPS6364055B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/473—
    • H10W74/114—
    • H10W72/0711—
    • H10W72/07236—
    • H10W72/07251—
    • H10W72/07352—
    • H10W72/20—
    • H10W72/321—
    • H10W72/877—
    • H10W74/15—
    • H10W90/724—
    • H10W90/734—
    • H10W90/736—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP58171992A 1983-09-16 1983-09-16 半導体装置 Granted JPS6063951A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58171992A JPS6063951A (ja) 1983-09-16 1983-09-16 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58171992A JPS6063951A (ja) 1983-09-16 1983-09-16 半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP1325234A Division JPH0639563B2 (ja) 1989-12-15 1989-12-15 半導体装置の製法

Publications (2)

Publication Number Publication Date
JPS6063951A JPS6063951A (ja) 1985-04-12
JPS6364055B2 true JPS6364055B2 (enExample) 1988-12-09

Family

ID=15933514

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58171992A Granted JPS6063951A (ja) 1983-09-16 1983-09-16 半導体装置

Country Status (1)

Country Link
JP (1) JPS6063951A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6250180A (ja) * 1985-08-29 1987-03-04 Mitsubishi Electric Corp サ−マルヘツド駆動装置
JPS62136865A (ja) * 1985-12-11 1987-06-19 Hitachi Ltd モジユ−ル実装構造
JPS62295332A (ja) * 1986-06-12 1987-12-22 Fujitsu Ltd 表示パネルのリ−ド線固定構造
JPH01214032A (ja) * 1988-02-22 1989-08-28 Canon Inc 電気回路装置
US4999699A (en) * 1990-03-14 1991-03-12 International Business Machines Corporation Solder interconnection structure and process for making
US5121190A (en) * 1990-03-14 1992-06-09 International Business Machines Corp. Solder interconnection structure on organic substrates

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6018145B2 (ja) * 1980-09-22 1985-05-09 株式会社日立製作所 樹脂封止型半導体装置
JPS5821417A (ja) * 1981-07-29 1983-02-08 Shin Etsu Chem Co Ltd 硬化性エポキシ樹脂組成物
JPS5834824A (ja) * 1981-08-26 1983-03-01 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及びその製造方法

Also Published As

Publication number Publication date
JPS6063951A (ja) 1985-04-12

Similar Documents

Publication Publication Date Title
US6242799B1 (en) Anisotropic stress buffer and semiconductor device using the same
KR100989535B1 (ko) 접착재료
JPS6364055B2 (enExample)
KR100594343B1 (ko) 열경화성 접착재료
JPH1187424A (ja) 半導体装置およびその製造方法
JPH0566024B2 (enExample)
JPH0639563B2 (ja) 半導体装置の製法
JPS6124253A (ja) 半導体パツケ−ジ構造
KR20030077593A (ko) 언더필 혼합물
JP3422243B2 (ja) 樹脂フィルム
KR20030022669A (ko) 반도체 장치의 제조 방법 및 반도체 장치
JPS6124255A (ja) 半導体パツケ−ジ構造
JPH02173073A (ja) 絶縁ペースト
JP4446552B2 (ja) 超高密度半導体用の接着剤
JP2921717B2 (ja) 半導体装置およびその製造方法
JP2001291805A (ja) 半導体装置
JP3125137B2 (ja) 半導体装置
JP2000124262A (ja) 半導体装置
JP2000200331A (ja) Ｉｃモジュ―ル及びこれを用いたｉｃカ―ド
JP3490990B2 (ja) フリップチップ実装方法
JP2004339520A (ja) 熱硬化性接着材料
JPS6353956A (ja) 半導体装置
Robinson et al. Advances in Liquid Encapsulated Chip-on-Board/MCM-L Technology
JPS6269542A (ja) 半導体装置
JPH10135248A (ja) 半導体パッケージ用接着テープ及び半導体パッケージ