JPS6063951A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6063951A
JPS6063951A JP58171992A JP17199283A JPS6063951A JP S6063951 A JPS6063951 A JP S6063951A JP 58171992 A JP58171992 A JP 58171992A JP 17199283 A JP17199283 A JP 17199283A JP S6063951 A JPS6063951 A JP S6063951A
Authority
JP
Japan
Prior art keywords
semiconductor chip
resin
semiconductor device
substrate
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58171992A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6364055B2 (enExample
Inventor
Tasao Soga
太佐男 曽我
Mamoru Sawahata
沢畠　守
Masatake Nametake
誉也 鈴木
Fumio Nakano
正剛 行武
Takaya Suzuki
文雄 中野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58171992A priority Critical patent/JPS6063951A/ja
Publication of JPS6063951A publication Critical patent/JPS6063951A/ja
Publication of JPS6364055B2 publication Critical patent/JPS6364055B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07352—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in structures or sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP58171992A 1983-09-16 1983-09-16 半導体装置 Granted JPS6063951A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58171992A JPS6063951A (ja) 1983-09-16 1983-09-16 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58171992A JPS6063951A (ja) 1983-09-16 1983-09-16 半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP1325234A Division JPH0639563B2 (ja) 1989-12-15 1989-12-15 半導体装置の製法

Publications (2)

Publication Number Publication Date
JPS6063951A true JPS6063951A (ja) 1985-04-12
JPS6364055B2 JPS6364055B2 (enExample) 1988-12-09

Family

ID=15933514

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58171992A Granted JPS6063951A (ja) 1983-09-16 1983-09-16 半導体装置

Country Status (1)

Country Link
JP (1) JPS6063951A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6250180A (ja) * 1985-08-29 1987-03-04 Mitsubishi Electric Corp サ−マルヘツド駆動装置
JPS62295332A (ja) * 1986-06-12 1987-12-22 Fujitsu Ltd 表示パネルのリ−ド線固定構造
US4825284A (en) * 1985-12-11 1989-04-25 Hitachi, Ltd. Semiconductor resin package structure
JPH01214032A (ja) * 1988-02-22 1989-08-28 Canon Inc 電気回路装置
EP0446580A1 (en) * 1990-03-14 1991-09-18 International Business Machines Corporation Solder interconnection structure with encapsulant and composition of the latter
EP0446666A3 (en) * 1990-03-14 1992-01-08 International Business Machines Corporation Solder interconnection structure on organic substrates and process for making

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5756954A (en) * 1980-09-22 1982-04-05 Hitachi Ltd Resin-sealed electronic parts
JPS5821417A (ja) * 1981-07-29 1983-02-08 Shin Etsu Chem Co Ltd 硬化性エポキシ樹脂組成物
JPS5834824A (ja) * 1981-08-26 1983-03-01 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及びその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5756954A (en) * 1980-09-22 1982-04-05 Hitachi Ltd Resin-sealed electronic parts
JPS5821417A (ja) * 1981-07-29 1983-02-08 Shin Etsu Chem Co Ltd 硬化性エポキシ樹脂組成物
JPS5834824A (ja) * 1981-08-26 1983-03-01 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及びその製造方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6250180A (ja) * 1985-08-29 1987-03-04 Mitsubishi Electric Corp サ−マルヘツド駆動装置
US4825284A (en) * 1985-12-11 1989-04-25 Hitachi, Ltd. Semiconductor resin package structure
JPS62295332A (ja) * 1986-06-12 1987-12-22 Fujitsu Ltd 表示パネルのリ−ド線固定構造
JPH01214032A (ja) * 1988-02-22 1989-08-28 Canon Inc 電気回路装置
EP0446580A1 (en) * 1990-03-14 1991-09-18 International Business Machines Corporation Solder interconnection structure with encapsulant and composition of the latter
EP0446666A3 (en) * 1990-03-14 1992-01-08 International Business Machines Corporation Solder interconnection structure on organic substrates and process for making
US5292688A (en) * 1990-03-14 1994-03-08 International Business Machines Corporation Solder interconnection structure on organic substrates and process for making

Also Published As

Publication number Publication date
JPS6364055B2 (enExample) 1988-12-09

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