JPS636153B2 - - Google Patents
Info
- Publication number
- JPS636153B2 JPS636153B2 JP57003626A JP362682A JPS636153B2 JP S636153 B2 JPS636153 B2 JP S636153B2 JP 57003626 A JP57003626 A JP 57003626A JP 362682 A JP362682 A JP 362682A JP S636153 B2 JPS636153 B2 JP S636153B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- glass
- wire
- diode
- cuprous oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP362682A JPS58119661A (ja) | 1982-01-11 | 1982-01-11 | Dhd型ガラス封止ダイオ−ド電極の製造法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP362682A JPS58119661A (ja) | 1982-01-11 | 1982-01-11 | Dhd型ガラス封止ダイオ−ド電極の製造法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58119661A JPS58119661A (ja) | 1983-07-16 |
JPS636153B2 true JPS636153B2 (enrdf_load_html_response) | 1988-02-08 |
Family
ID=11562701
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP362682A Granted JPS58119661A (ja) | 1982-01-11 | 1982-01-11 | Dhd型ガラス封止ダイオ−ド電極の製造法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58119661A (enrdf_load_html_response) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04344863A (ja) * | 1991-05-23 | 1992-12-01 | Kobe Steel Ltd | 高品質鋳物の高圧鋳造方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61156242U (enrdf_load_html_response) * | 1985-03-18 | 1986-09-27 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57122555A (en) * | 1981-01-23 | 1982-07-30 | Toshiba Corp | Glass sealed metallic piece electrode |
-
1982
- 1982-01-11 JP JP362682A patent/JPS58119661A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04344863A (ja) * | 1991-05-23 | 1992-12-01 | Kobe Steel Ltd | 高品質鋳物の高圧鋳造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS58119661A (ja) | 1983-07-16 |
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