JPS636148B2 - - Google Patents
Info
- Publication number
- JPS636148B2 JPS636148B2 JP12021582A JP12021582A JPS636148B2 JP S636148 B2 JPS636148 B2 JP S636148B2 JP 12021582 A JP12021582 A JP 12021582A JP 12021582 A JP12021582 A JP 12021582A JP S636148 B2 JPS636148 B2 JP S636148B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- sealed container
- capacitor
- snubber circuit
- airtight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 75
- 239000003990 capacitor Substances 0.000 claims description 67
- 238000001816 cooling Methods 0.000 claims description 24
- 239000012071 phase Substances 0.000 claims description 17
- 239000007791 liquid phase Substances 0.000 claims description 15
- 238000009835 boiling Methods 0.000 claims description 12
- 239000011810 insulating material Substances 0.000 claims description 6
- 239000002826 coolant Substances 0.000 claims description 4
- 239000003507 refrigerant Substances 0.000 description 34
- 239000004020 conductor Substances 0.000 description 25
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 238000010521 absorption reaction Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000005476 soldering Methods 0.000 description 5
- 238000003466 welding Methods 0.000 description 4
- 230000002159 abnormal effect Effects 0.000 description 3
- 230000033228 biological regulation Effects 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000004904 shortening Methods 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 241000287227 Fringillidae Species 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12021582A JPS5910248A (ja) | 1982-07-09 | 1982-07-09 | 半導体沸騰冷却装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12021582A JPS5910248A (ja) | 1982-07-09 | 1982-07-09 | 半導体沸騰冷却装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5910248A JPS5910248A (ja) | 1984-01-19 |
| JPS636148B2 true JPS636148B2 (enrdf_load_stackoverflow) | 1988-02-08 |
Family
ID=14780737
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12021582A Granted JPS5910248A (ja) | 1982-07-09 | 1982-07-09 | 半導体沸騰冷却装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5910248A (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2564077B2 (ja) * | 1992-07-06 | 1996-12-18 | カネボウ・エヌエスシー株式会社 | 合成樹脂系塗膜の製法およびそれに用いる合成樹脂系塗膜形成用薬剤 |
| JP4900148B2 (ja) * | 2007-09-13 | 2012-03-21 | 三菱電機株式会社 | 半導体装置 |
| DK177528B1 (en) | 2012-02-22 | 2013-09-08 | Keld Krogh Nielsen | A dispensing device for dispensing a liquid product |
-
1982
- 1982-07-09 JP JP12021582A patent/JPS5910248A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5910248A (ja) | 1984-01-19 |
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