JPS5910248A - 半導体沸騰冷却装置 - Google Patents
半導体沸騰冷却装置Info
- Publication number
- JPS5910248A JPS5910248A JP12021582A JP12021582A JPS5910248A JP S5910248 A JPS5910248 A JP S5910248A JP 12021582 A JP12021582 A JP 12021582A JP 12021582 A JP12021582 A JP 12021582A JP S5910248 A JPS5910248 A JP S5910248A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- capacitor
- sealed container
- airtight
- snubber circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 80
- 238000001816 cooling Methods 0.000 title claims description 22
- 239000003990 capacitor Substances 0.000 claims abstract description 66
- 239000007791 liquid phase Substances 0.000 claims abstract description 16
- 239000012071 phase Substances 0.000 claims description 15
- 238000009835 boiling Methods 0.000 claims description 10
- 230000008859 change Effects 0.000 claims description 5
- 239000002826 coolant Substances 0.000 claims description 5
- 239000011810 insulating material Substances 0.000 claims description 3
- 239000003507 refrigerant Substances 0.000 abstract description 32
- 239000004020 conductor Substances 0.000 abstract description 24
- 230000000694 effects Effects 0.000 abstract description 11
- 238000010521 absorption reaction Methods 0.000 abstract description 8
- 239000012212 insulator Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 239000007789 gas Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000005476 soldering Methods 0.000 description 5
- 230000033228 biological regulation Effects 0.000 description 4
- 239000012774 insulation material Substances 0.000 description 4
- 238000004904 shortening Methods 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 2
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 2
- 230000036541 health Effects 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 230000008439 repair process Effects 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000007792 gaseous phase Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12021582A JPS5910248A (ja) | 1982-07-09 | 1982-07-09 | 半導体沸騰冷却装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12021582A JPS5910248A (ja) | 1982-07-09 | 1982-07-09 | 半導体沸騰冷却装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5910248A true JPS5910248A (ja) | 1984-01-19 |
| JPS636148B2 JPS636148B2 (enrdf_load_stackoverflow) | 1988-02-08 |
Family
ID=14780737
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12021582A Granted JPS5910248A (ja) | 1982-07-09 | 1982-07-09 | 半導体沸騰冷却装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5910248A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06121965A (ja) * | 1992-07-06 | 1994-05-06 | Kanebo Nsc Ltd | 塗膜の製法およびそれに用いる塗膜形成用薬剤 |
| JP2009071064A (ja) * | 2007-09-13 | 2009-04-02 | Mitsubishi Electric Corp | 半導体装置 |
| US9499305B2 (en) | 2012-02-22 | 2016-11-22 | Mezurware, Llc | Dispensing device for dispensing a liquid product |
-
1982
- 1982-07-09 JP JP12021582A patent/JPS5910248A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06121965A (ja) * | 1992-07-06 | 1994-05-06 | Kanebo Nsc Ltd | 塗膜の製法およびそれに用いる塗膜形成用薬剤 |
| JP2009071064A (ja) * | 2007-09-13 | 2009-04-02 | Mitsubishi Electric Corp | 半導体装置 |
| US9499305B2 (en) | 2012-02-22 | 2016-11-22 | Mezurware, Llc | Dispensing device for dispensing a liquid product |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS636148B2 (enrdf_load_stackoverflow) | 1988-02-08 |
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