JPS5910248A - 半導体沸騰冷却装置 - Google Patents

半導体沸騰冷却装置

Info

Publication number
JPS5910248A
JPS5910248A JP12021582A JP12021582A JPS5910248A JP S5910248 A JPS5910248 A JP S5910248A JP 12021582 A JP12021582 A JP 12021582A JP 12021582 A JP12021582 A JP 12021582A JP S5910248 A JPS5910248 A JP S5910248A
Authority
JP
Japan
Prior art keywords
semiconductor
capacitor
sealed container
airtight
snubber circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12021582A
Other languages
English (en)
Japanese (ja)
Other versions
JPS636148B2 (enrdf_load_stackoverflow
Inventor
Haruo Tetsuno
鉄野　治雄
Taku Kameda
卓 亀田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP12021582A priority Critical patent/JPS5910248A/ja
Publication of JPS5910248A publication Critical patent/JPS5910248A/ja
Publication of JPS636148B2 publication Critical patent/JPS636148B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP12021582A 1982-07-09 1982-07-09 半導体沸騰冷却装置 Granted JPS5910248A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12021582A JPS5910248A (ja) 1982-07-09 1982-07-09 半導体沸騰冷却装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12021582A JPS5910248A (ja) 1982-07-09 1982-07-09 半導体沸騰冷却装置

Publications (2)

Publication Number Publication Date
JPS5910248A true JPS5910248A (ja) 1984-01-19
JPS636148B2 JPS636148B2 (enrdf_load_stackoverflow) 1988-02-08

Family

ID=14780737

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12021582A Granted JPS5910248A (ja) 1982-07-09 1982-07-09 半導体沸騰冷却装置

Country Status (1)

Country Link
JP (1) JPS5910248A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06121965A (ja) * 1992-07-06 1994-05-06 Kanebo Nsc Ltd 塗膜の製法およびそれに用いる塗膜形成用薬剤
JP2009071064A (ja) * 2007-09-13 2009-04-02 Mitsubishi Electric Corp 半導体装置
US9499305B2 (en) 2012-02-22 2016-11-22 Mezurware, Llc Dispensing device for dispensing a liquid product

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06121965A (ja) * 1992-07-06 1994-05-06 Kanebo Nsc Ltd 塗膜の製法およびそれに用いる塗膜形成用薬剤
JP2009071064A (ja) * 2007-09-13 2009-04-02 Mitsubishi Electric Corp 半導体装置
US9499305B2 (en) 2012-02-22 2016-11-22 Mezurware, Llc Dispensing device for dispensing a liquid product

Also Published As

Publication number Publication date
JPS636148B2 (enrdf_load_stackoverflow) 1988-02-08

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