JPS636145B2 - - Google Patents
Info
- Publication number
- JPS636145B2 JPS636145B2 JP11010382A JP11010382A JPS636145B2 JP S636145 B2 JPS636145 B2 JP S636145B2 JP 11010382 A JP11010382 A JP 11010382A JP 11010382 A JP11010382 A JP 11010382A JP S636145 B2 JPS636145 B2 JP S636145B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- capacitor
- sealed container
- case
- bushing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 72
- 239000003990 capacitor Substances 0.000 claims description 68
- 238000001816 cooling Methods 0.000 claims description 27
- 239000012071 phase Substances 0.000 claims description 19
- 239000007791 liquid phase Substances 0.000 claims description 15
- 238000009835 boiling Methods 0.000 claims description 12
- 230000008859 change Effects 0.000 claims description 5
- 239000002826 coolant Substances 0.000 claims description 4
- 239000003507 refrigerant Substances 0.000 description 21
- 239000004020 conductor Substances 0.000 description 14
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 238000010521 absorption reaction Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- 230000001105 regulatory effect Effects 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 241000287227 Fringillidae Species 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000036541 health Effects 0.000 description 2
- 230000008439 repair process Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11010382A JPS59945A (ja) | 1982-06-25 | 1982-06-25 | 半導体沸騰冷却装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11010382A JPS59945A (ja) | 1982-06-25 | 1982-06-25 | 半導体沸騰冷却装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59945A JPS59945A (ja) | 1984-01-06 |
| JPS636145B2 true JPS636145B2 (enrdf_load_stackoverflow) | 1988-02-08 |
Family
ID=14527108
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11010382A Granted JPS59945A (ja) | 1982-06-25 | 1982-06-25 | 半導体沸騰冷却装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59945A (enrdf_load_stackoverflow) |
-
1982
- 1982-06-25 JP JP11010382A patent/JPS59945A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59945A (ja) | 1984-01-06 |
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