JPS59945A - 半導体沸騰冷却装置 - Google Patents

半導体沸騰冷却装置

Info

Publication number
JPS59945A
JPS59945A JP11010382A JP11010382A JPS59945A JP S59945 A JPS59945 A JP S59945A JP 11010382 A JP11010382 A JP 11010382A JP 11010382 A JP11010382 A JP 11010382A JP S59945 A JPS59945 A JP S59945A
Authority
JP
Japan
Prior art keywords
semiconductor
sealed container
case
capacitor
condenser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11010382A
Other languages
English (en)
Japanese (ja)
Other versions
JPS636145B2 (enrdf_load_stackoverflow
Inventor
Haruo Tetsuno
鉄野 治雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP11010382A priority Critical patent/JPS59945A/ja
Publication of JPS59945A publication Critical patent/JPS59945A/ja
Publication of JPS636145B2 publication Critical patent/JPS636145B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP11010382A 1982-06-25 1982-06-25 半導体沸騰冷却装置 Granted JPS59945A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11010382A JPS59945A (ja) 1982-06-25 1982-06-25 半導体沸騰冷却装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11010382A JPS59945A (ja) 1982-06-25 1982-06-25 半導体沸騰冷却装置

Publications (2)

Publication Number Publication Date
JPS59945A true JPS59945A (ja) 1984-01-06
JPS636145B2 JPS636145B2 (enrdf_load_stackoverflow) 1988-02-08

Family

ID=14527108

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11010382A Granted JPS59945A (ja) 1982-06-25 1982-06-25 半導体沸騰冷却装置

Country Status (1)

Country Link
JP (1) JPS59945A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS636145B2 (enrdf_load_stackoverflow) 1988-02-08

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