JPS6361387B2 - - Google Patents

Info

Publication number
JPS6361387B2
JPS6361387B2 JP58102757A JP10275783A JPS6361387B2 JP S6361387 B2 JPS6361387 B2 JP S6361387B2 JP 58102757 A JP58102757 A JP 58102757A JP 10275783 A JP10275783 A JP 10275783A JP S6361387 B2 JPS6361387 B2 JP S6361387B2
Authority
JP
Japan
Prior art keywords
target
substrate
electrode
film
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58102757A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59229480A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10275783A priority Critical patent/JPS59229480A/ja
Publication of JPS59229480A publication Critical patent/JPS59229480A/ja
Publication of JPS6361387B2 publication Critical patent/JPS6361387B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/225—Oblique incidence of vaporised material on substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
JP10275783A 1983-06-10 1983-06-10 スパツタリング装置 Granted JPS59229480A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10275783A JPS59229480A (ja) 1983-06-10 1983-06-10 スパツタリング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10275783A JPS59229480A (ja) 1983-06-10 1983-06-10 スパツタリング装置

Publications (2)

Publication Number Publication Date
JPS59229480A JPS59229480A (ja) 1984-12-22
JPS6361387B2 true JPS6361387B2 (fr) 1988-11-29

Family

ID=14336072

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10275783A Granted JPS59229480A (ja) 1983-06-10 1983-06-10 スパツタリング装置

Country Status (1)

Country Link
JP (1) JPS59229480A (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2607727Y2 (ja) * 1992-01-29 2002-07-08 バルツァース ウント ライボルト ドイチュラント ホールディング アクチエンゲゼルシャフト カソードスパッタリング装置
JPH05287524A (ja) * 1992-04-09 1993-11-02 Anelva Corp マグネトロンスパッタリング用ターゲット
EP0704878A1 (fr) * 1994-09-27 1996-04-03 Applied Materials, Inc. DépÔt de film d'épaisseur uniforme de matériaux pulvérisés
JP5026631B2 (ja) * 1999-06-24 2012-09-12 株式会社アルバック スパッタリング装置
US6267851B1 (en) * 1999-10-28 2001-07-31 Applied Komatsu Technology, Inc. Tilted sputtering target with shield to block contaminants
JP5916980B2 (ja) * 2009-09-11 2016-05-11 シャープ株式会社 窒化物半導体発光ダイオード素子の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5776185A (en) * 1980-10-30 1982-05-13 Ulvac Corp Sputtering device
JPS57141930A (en) * 1981-02-27 1982-09-02 Hitachi Ltd Device for formation of thin film

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5776185A (en) * 1980-10-30 1982-05-13 Ulvac Corp Sputtering device
JPS57141930A (en) * 1981-02-27 1982-09-02 Hitachi Ltd Device for formation of thin film

Also Published As

Publication number Publication date
JPS59229480A (ja) 1984-12-22

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