JPS636117B2 - - Google Patents
Info
- Publication number
- JPS636117B2 JPS636117B2 JP9658880A JP9658880A JPS636117B2 JP S636117 B2 JPS636117 B2 JP S636117B2 JP 9658880 A JP9658880 A JP 9658880A JP 9658880 A JP9658880 A JP 9658880A JP S636117 B2 JPS636117 B2 JP S636117B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- heat insulating
- epoxy resin
- insulating board
- wall surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000853 adhesive Substances 0.000 claims description 71
- 230000001070 adhesive effect Effects 0.000 claims description 71
- 239000003822 epoxy resin Substances 0.000 claims description 27
- 229920000647 polyepoxide Polymers 0.000 claims description 27
- 238000010276 construction Methods 0.000 claims description 17
- 239000006260 foam Substances 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 17
- 238000009413 insulation Methods 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 13
- 239000011162 core material Substances 0.000 claims description 12
- 239000002994 raw material Substances 0.000 claims description 12
- 239000003085 diluting agent Substances 0.000 claims description 10
- 239000000945 filler Substances 0.000 claims description 10
- 239000003795 chemical substances by application Substances 0.000 claims description 9
- 229920003002 synthetic resin Polymers 0.000 claims description 6
- 239000000057 synthetic resin Substances 0.000 claims description 6
- 229920001971 elastomer Polymers 0.000 description 9
- 239000005060 rubber Substances 0.000 description 9
- 239000010440 gypsum Substances 0.000 description 8
- 229910052602 gypsum Inorganic materials 0.000 description 8
- 238000002156 mixing Methods 0.000 description 8
- 238000003756 stirring Methods 0.000 description 8
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 206010040844 Skin exfoliation Diseases 0.000 description 4
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 4
- 238000009833 condensation Methods 0.000 description 4
- 230000005494 condensation Effects 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229920005830 Polyurethane Foam Polymers 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- YACLQRRMGMJLJV-UHFFFAOYSA-N chloroprene Chemical compound ClC(=C)C=C YACLQRRMGMJLJV-UHFFFAOYSA-N 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- 229920000582 polyisocyanurate Polymers 0.000 description 2
- 239000011495 polyisocyanurate Substances 0.000 description 2
- 229920006327 polystyrene foam Polymers 0.000 description 2
- 239000011496 polyurethane foam Substances 0.000 description 2
- 229920003051 synthetic elastomer Polymers 0.000 description 2
- 239000005061 synthetic rubber Substances 0.000 description 2
- VVHFXJOCUKBZFS-UHFFFAOYSA-N 2-(chloromethyl)-2-methyloxirane Chemical compound ClCC1(C)CO1 VVHFXJOCUKBZFS-UHFFFAOYSA-N 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000011505 plaster Substances 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000011550 stock solution Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
Landscapes
- Building Environments (AREA)
- Finishing Walls (AREA)
- Adhesives Or Adhesive Processes (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9658880A JPS5721650A (en) | 1980-07-15 | 1980-07-15 | Installation of heat insulating plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9658880A JPS5721650A (en) | 1980-07-15 | 1980-07-15 | Installation of heat insulating plate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5721650A JPS5721650A (en) | 1982-02-04 |
JPS636117B2 true JPS636117B2 (pt-PT) | 1988-02-08 |
Family
ID=14169077
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9658880A Granted JPS5721650A (en) | 1980-07-15 | 1980-07-15 | Installation of heat insulating plate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5721650A (pt-PT) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59187939A (ja) * | 1983-04-09 | 1984-10-25 | 佐藤 輝男 | 断熱壁又は床の施工法 |
JPS62228541A (ja) * | 1986-03-31 | 1987-10-07 | 東急建設株式会社 | 断熱遮音パネルの後貼工法 |
CN112480849A (zh) * | 2020-12-17 | 2021-03-12 | 宁夏黑金科技有限公司 | 利用废石料加工的建筑板材结合处用粘合剂 |
-
1980
- 1980-07-15 JP JP9658880A patent/JPS5721650A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5721650A (en) | 1982-02-04 |
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