JPS6361136U - - Google Patents
Info
- Publication number
- JPS6361136U JPS6361136U JP15455986U JP15455986U JPS6361136U JP S6361136 U JPS6361136 U JP S6361136U JP 15455986 U JP15455986 U JP 15455986U JP 15455986 U JP15455986 U JP 15455986U JP S6361136 U JPS6361136 U JP S6361136U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor manufacturing
- objective lenses
- finished
- inspecting
- semi
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000007689 inspection Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15455986U JPS6361136U (enExample) | 1986-10-08 | 1986-10-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15455986U JPS6361136U (enExample) | 1986-10-08 | 1986-10-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6361136U true JPS6361136U (enExample) | 1988-04-22 |
Family
ID=31074460
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15455986U Pending JPS6361136U (enExample) | 1986-10-08 | 1986-10-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6361136U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009524071A (ja) * | 2006-02-10 | 2009-06-25 | アーテーゲー ルーテル ウント メルツァー ゲーエムベーハー | コンポーネント化されていない印刷回路基板の検査のためのフィンガーテスター及びフィンガーテスターでコンポーネント化されていない印刷回路基板を検査する方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53113309A (en) * | 1977-03-16 | 1978-10-03 | Howa Mach Ltd | Reciprocating compressor |
-
1986
- 1986-10-08 JP JP15455986U patent/JPS6361136U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53113309A (en) * | 1977-03-16 | 1978-10-03 | Howa Mach Ltd | Reciprocating compressor |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009524071A (ja) * | 2006-02-10 | 2009-06-25 | アーテーゲー ルーテル ウント メルツァー ゲーエムベーハー | コンポーネント化されていない印刷回路基板の検査のためのフィンガーテスター及びフィンガーテスターでコンポーネント化されていない印刷回路基板を検査する方法 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS645779A (en) | Robot arrangement examination system | |
| JPH04148544A (ja) | ワイヤボンディング検査装置 | |
| US3588347A (en) | Method and apparatus for aligning a mask and a substrate using infrared radiation | |
| JPS6361136U (enExample) | ||
| JPS57167651A (en) | Inspecting device for surface of semiconductor wafer | |
| JPH0522176B2 (enExample) | ||
| JPH01214118A (ja) | 半導体製造装置 | |
| JPH05332739A (ja) | 外観検査装置 | |
| JPH03152408A (ja) | Icパッケージのリード検査装置 | |
| JPH07103730A (ja) | リードフレーム検査装置 | |
| JPS6224581U (enExample) | ||
| JP3184640B2 (ja) | ボンディングワイヤ検査装置 | |
| DE19613516C2 (de) | Sauggreifer | |
| JPS62141279U (enExample) | ||
| DE10115149A1 (de) | Reintegration einer digitalen Kamera in ein Bildverarbeitungssystem, welche aus einer kalibrierten Position in eine unkalibrierte Position versetzt worden ist | |
| KR100214013B1 (ko) | 칩 얼라이먼트 장치 | |
| JPH0260245U (enExample) | ||
| JPS63103932A (ja) | 複合レンズの芯出し方法及び装置 | |
| JPH0732188B2 (ja) | 半導体装置の検査装置 | |
| HEMEL | Operator and technician tasks for the heads-up display test set and versatile avionics shop test/VAST | |
| JPS61280628A (ja) | 半導体リ−ド検査装置 | |
| JPH02131334U (enExample) | ||
| JPS63158847A (ja) | 半導体検査装置 | |
| JPS58184644U (ja) | 光学検査装置 | |
| JPH03269246A (ja) | ボンディングワイヤ検査装置 |