JPS6356719B2 - - Google Patents
Info
- Publication number
- JPS6356719B2 JPS6356719B2 JP19030684A JP19030684A JPS6356719B2 JP S6356719 B2 JPS6356719 B2 JP S6356719B2 JP 19030684 A JP19030684 A JP 19030684A JP 19030684 A JP19030684 A JP 19030684A JP S6356719 B2 JPS6356719 B2 JP S6356719B2
- Authority
- JP
- Japan
- Prior art keywords
- resist layer
- film
- conductive pattern
- present
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000007788 liquid Substances 0.000 claims description 21
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 8
- 239000010410 layer Substances 0.000 description 54
- 239000011229 interlayer Substances 0.000 description 12
- 238000005516 engineering process Methods 0.000 description 7
- 238000001259 photo etching Methods 0.000 description 7
- 229920006267 polyester film Polymers 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000011810 insulating material Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000000740 bleeding effect Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19030684A JPS6167990A (ja) | 1984-09-11 | 1984-09-11 | 多層配線基板の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19030684A JPS6167990A (ja) | 1984-09-11 | 1984-09-11 | 多層配線基板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6167990A JPS6167990A (ja) | 1986-04-08 |
JPS6356719B2 true JPS6356719B2 (enrdf_load_stackoverflow) | 1988-11-09 |
Family
ID=16255963
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19030684A Granted JPS6167990A (ja) | 1984-09-11 | 1984-09-11 | 多層配線基板の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6167990A (enrdf_load_stackoverflow) |
-
1984
- 1984-09-11 JP JP19030684A patent/JPS6167990A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6167990A (ja) | 1986-04-08 |
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