JPS6356719B2 - - Google Patents

Info

Publication number

JPS6356719B2

JPS6356719B2 JP19030684A JP19030684A JPS6356719B2 JP S6356719 B2 JPS6356719 B2 JP S6356719B2 JP 19030684 A JP19030684 A JP 19030684A JP 19030684 A JP19030684 A JP 19030684A JP S6356719 B2 JPS6356719 B2 JP S6356719B2

Authority

JP

Japan

Prior art keywords

resist layer

film

conductive pattern

present

liquid

Prior art date

1984-09-11

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

• Espacenet
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• 239000007788 liquid Substances 0.000 claims description 21
• 238000004519 manufacturing process Methods 0.000 claims description 9
• 238000000034 method Methods 0.000 claims description 9
• 239000000758 substrate Substances 0.000 claims description 8
• 239000010410 layer Substances 0.000 description 54
• 239000011229 interlayer Substances 0.000 description 12
• 238000005516 engineering process Methods 0.000 description 7
• 238000001259 photo etching Methods 0.000 description 7
• 229920006267 polyester film Polymers 0.000 description 6
• 230000000694 effects Effects 0.000 description 5
• 239000011810 insulating material Substances 0.000 description 4
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
• 239000000853 adhesive Substances 0.000 description 3
• 230000001070 adhesive effect Effects 0.000 description 3
• PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
• 230000000740 bleeding effect Effects 0.000 description 2
• 239000011889 copper foil Substances 0.000 description 2
• 238000005530 etching Methods 0.000 description 2
• 239000003960 organic solvent Substances 0.000 description 2
• 238000007747 plating Methods 0.000 description 2
• 238000007788 roughening Methods 0.000 description 2
• 238000007650 screen-printing Methods 0.000 description 2
• 239000002253 acid Substances 0.000 description 1
• XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
• 229910052782 aluminium Inorganic materials 0.000 description 1
• 230000001680 brushing effect Effects 0.000 description 1
• 239000000919 ceramic Substances 0.000 description 1
• 238000003486 chemical etching Methods 0.000 description 1
• 239000011248 coating agent Substances 0.000 description 1
• 238000000576 coating method Methods 0.000 description 1
• 229910052802 copper Inorganic materials 0.000 description 1
• 239000010949 copper Substances 0.000 description 1
• 238000000151 deposition Methods 0.000 description 1
• 238000001035 drying Methods 0.000 description 1
• 238000010438 heat treatment Methods 0.000 description 1
• 229910052759 nickel Inorganic materials 0.000 description 1
• 239000002904 solvent Substances 0.000 description 1
• 238000004544 sputter deposition Methods 0.000 description 1
• 230000003746 surface roughness Effects 0.000 description 1