JPS6356702B2 - - Google Patents
Info
- Publication number
- JPS6356702B2 JPS6356702B2 JP24639883A JP24639883A JPS6356702B2 JP S6356702 B2 JPS6356702 B2 JP S6356702B2 JP 24639883 A JP24639883 A JP 24639883A JP 24639883 A JP24639883 A JP 24639883A JP S6356702 B2 JPS6356702 B2 JP S6356702B2
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- reference marks
- inspected
- output
- deviation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000012937 correction Methods 0.000 claims description 28
- 238000013461 design Methods 0.000 claims description 25
- 238000006243 chemical reaction Methods 0.000 claims description 14
- 238000013139 quantization Methods 0.000 claims description 12
- 238000007689 inspection Methods 0.000 claims description 9
- 238000004364 calculation method Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 13
- 230000002159 abnormal effect Effects 0.000 description 11
- 230000015654 memory Effects 0.000 description 11
- 238000012545 processing Methods 0.000 description 11
- 238000005259 measurement Methods 0.000 description 8
- 238000013507 mapping Methods 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- 238000003384 imaging method Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000001514 detection method Methods 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 2
- 206010010071 Coma Diseases 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Image Processing (AREA)
- Image Analysis (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58246398A JPS60138921A (ja) | 1983-12-27 | 1983-12-27 | パタ−ン形状検査装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58246398A JPS60138921A (ja) | 1983-12-27 | 1983-12-27 | パタ−ン形状検査装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60138921A JPS60138921A (ja) | 1985-07-23 |
JPS6356702B2 true JPS6356702B2 (fr) | 1988-11-09 |
Family
ID=17147916
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58246398A Granted JPS60138921A (ja) | 1983-12-27 | 1983-12-27 | パタ−ン形状検査装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60138921A (fr) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63286752A (ja) * | 1987-05-20 | 1988-11-24 | Toshiba Mach Co Ltd | パタ−ンの欠陥検査または寸法測定方法 |
KR100265827B1 (ko) * | 1993-10-30 | 2000-09-15 | 김영환 | 레티클 제조 정확도 측정방법 |
JP4767665B2 (ja) * | 2005-01-05 | 2011-09-07 | 富士通セミコンダクター株式会社 | レチクル検査装置およびレチクル検査方法 |
JP5793093B2 (ja) * | 2012-02-17 | 2015-10-14 | 株式会社ニューフレアテクノロジー | 検査装置および検査方法 |
JP2014211352A (ja) * | 2013-04-18 | 2014-11-13 | 株式会社東芝 | テンプレートの検査装置及びテンプレートの検査方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5654038A (en) * | 1979-10-08 | 1981-05-13 | Toshiba Corp | Checking device for shape of photomask |
JPS5837923A (ja) * | 1981-08-31 | 1983-03-05 | Toshiba Corp | フオトマスクの検査装置 |
-
1983
- 1983-12-27 JP JP58246398A patent/JPS60138921A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5654038A (en) * | 1979-10-08 | 1981-05-13 | Toshiba Corp | Checking device for shape of photomask |
JPS5837923A (ja) * | 1981-08-31 | 1983-03-05 | Toshiba Corp | フオトマスクの検査装置 |
Also Published As
Publication number | Publication date |
---|---|
JPS60138921A (ja) | 1985-07-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4767665B2 (ja) | レチクル検査装置およびレチクル検査方法 | |
US5671056A (en) | Three-dimensional form measuring apparatus and method | |
JP6209833B2 (ja) | 検査用具、検査方法、ステレオカメラの生産方法及びシステム | |
EP0132122B1 (fr) | Appareil pour l'inspection de masques utilisés dans la réalisation de circuits intégrés à haute densité | |
JP3958327B2 (ja) | 試料検査装置及び試料検査方法 | |
JPS643050B2 (fr) | ||
JPS59119204A (ja) | マ−ク位置検出方法 | |
US6819789B1 (en) | Scaling and registration calibration especially in printed circuit board fabrication | |
JP2005316411A (ja) | 露光装置及び露光方法 | |
US5640243A (en) | Position detection method | |
JP4478496B2 (ja) | ローカルアライメント機能を有する露光装置 | |
JPS6356702B2 (fr) | ||
JP3040845B2 (ja) | アライメントマーク | |
JP7310541B2 (ja) | 位置測定方法 | |
JP4261535B2 (ja) | マスク検査装置におけるアライメント方法および評価方法 | |
JP3111869B2 (ja) | 2次元位置姿勢測定方法及び装置 | |
JP2005136743A (ja) | 撮像素子の位置調整装置及び位置調整方法 | |
JPH11132735A (ja) | Icリード浮き検査装置及び検査方法 | |
JPH10311705A (ja) | 画像入力装置 | |
JPH08330219A (ja) | 走査型露光装置 | |
JPH07302754A (ja) | 走査型露光装置 | |
US11443419B2 (en) | Reference image generation method and pattern inspection method | |
JP2795790B2 (ja) | 3次元計測装置のセンサ座標補正方法 | |
WO2023236069A1 (fr) | Système d'étalonnage d'alignement et procédé associé | |
JPH0522847Y2 (fr) |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |