JPS6354223B2 - - Google Patents

Info

Publication number
JPS6354223B2
JPS6354223B2 JP58074021A JP7402183A JPS6354223B2 JP S6354223 B2 JPS6354223 B2 JP S6354223B2 JP 58074021 A JP58074021 A JP 58074021A JP 7402183 A JP7402183 A JP 7402183A JP S6354223 B2 JPS6354223 B2 JP S6354223B2
Authority
JP
Japan
Prior art keywords
semiconductor element
recess
bonding material
heat sink
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58074021A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59200447A (ja
Inventor
Sadayuki Sone
Haruo Yamanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP58074021A priority Critical patent/JPS59200447A/ja
Publication of JPS59200447A publication Critical patent/JPS59200447A/ja
Publication of JPS6354223B2 publication Critical patent/JPS6354223B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/30
    • H10W72/073
    • H10W72/07336
    • H10W72/5363
    • H10W72/884

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP58074021A 1983-04-28 1983-04-28 半導体装置 Granted JPS59200447A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58074021A JPS59200447A (ja) 1983-04-28 1983-04-28 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58074021A JPS59200447A (ja) 1983-04-28 1983-04-28 半導体装置

Publications (2)

Publication Number Publication Date
JPS59200447A JPS59200447A (ja) 1984-11-13
JPS6354223B2 true JPS6354223B2 (cg-RX-API-DMAC10.html) 1988-10-27

Family

ID=13535042

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58074021A Granted JPS59200447A (ja) 1983-04-28 1983-04-28 半導体装置

Country Status (1)

Country Link
JP (1) JPS59200447A (cg-RX-API-DMAC10.html)

Also Published As

Publication number Publication date
JPS59200447A (ja) 1984-11-13

Similar Documents

Publication Publication Date Title
JP3650001B2 (ja) 半導体装置およびその製造方法
US6482674B1 (en) Semiconductor package having metal foil die mounting plate
CN100409434C (zh) 半导体模块及其制造方法
JP3316714B2 (ja) 半導体装置
US5834835A (en) Semiconductor device having an improved structure for storing a semiconductor chip
JP2001326236A (ja) 半導体装置の製造方法
JP2009295959A (ja) 半導体装置及びその製造方法
JPS6324647A (ja) 半導体パッケ−ジ
JPH05109975A (ja) 樹脂封止型半導体装置
US20050142691A1 (en) Mounting structure of semiconductor chip, semiconductor device and method of making the semiconductor device
JP2003078105A (ja) スタックチップモジュール
EP1195813A2 (en) Semiconductor device, semiconductor module and hard disk
JP4385324B2 (ja) 半導体モジュールおよびその製造方法
JPH04179263A (ja) 樹脂封止型半導体装置とその製造方法
JP2002270647A (ja) 半導体チップ実装基板およびその製造方法
JP3634735B2 (ja) 半導体装置および半導体モジュール
US12476218B2 (en) Semiconductor device manufacturing method
US10964627B2 (en) Integrated electronic device having a dissipative package, in particular dual side cooling package
US6111309A (en) Semiconductor device
JP3082170B2 (ja) ワイヤボンド対応ペルチェ素子
JPS6354223B2 (cg-RX-API-DMAC10.html)
JP3295987B2 (ja) 半導体装置の製造方法
JPS63169749A (ja) 半導体装置
JPS59136953A (ja) 複合素子
JPH0525182B2 (cg-RX-API-DMAC10.html)