JPS6354223B2 - - Google Patents
Info
- Publication number
- JPS6354223B2 JPS6354223B2 JP58074021A JP7402183A JPS6354223B2 JP S6354223 B2 JPS6354223 B2 JP S6354223B2 JP 58074021 A JP58074021 A JP 58074021A JP 7402183 A JP7402183 A JP 7402183A JP S6354223 B2 JPS6354223 B2 JP S6354223B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- recess
- bonding material
- heat sink
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W72/30—
-
- H10W72/073—
-
- H10W72/07336—
-
- H10W72/5363—
-
- H10W72/884—
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58074021A JPS59200447A (ja) | 1983-04-28 | 1983-04-28 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58074021A JPS59200447A (ja) | 1983-04-28 | 1983-04-28 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59200447A JPS59200447A (ja) | 1984-11-13 |
| JPS6354223B2 true JPS6354223B2 (cg-RX-API-DMAC10.html) | 1988-10-27 |
Family
ID=13535042
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58074021A Granted JPS59200447A (ja) | 1983-04-28 | 1983-04-28 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59200447A (cg-RX-API-DMAC10.html) |
-
1983
- 1983-04-28 JP JP58074021A patent/JPS59200447A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59200447A (ja) | 1984-11-13 |
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