JPH0525182B2 - - Google Patents

Info

Publication number
JPH0525182B2
JPH0525182B2 JP59137175A JP13717584A JPH0525182B2 JP H0525182 B2 JPH0525182 B2 JP H0525182B2 JP 59137175 A JP59137175 A JP 59137175A JP 13717584 A JP13717584 A JP 13717584A JP H0525182 B2 JPH0525182 B2 JP H0525182B2
Authority
JP
Japan
Prior art keywords
metal layer
substrate
semiconductor device
adhesion
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59137175A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6118157A (ja
Inventor
Kunizo Sawara
Kanji Ootsuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP59137175A priority Critical patent/JPS6118157A/ja
Publication of JPS6118157A publication Critical patent/JPS6118157A/ja
Publication of JPH0525182B2 publication Critical patent/JPH0525182B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W76/157—
    • H10W70/611—
    • H10W90/401—
    • H10W72/07251—
    • H10W72/20—

Landscapes

  • Die Bonding (AREA)
JP59137175A 1984-07-04 1984-07-04 半導体装置 Granted JPS6118157A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59137175A JPS6118157A (ja) 1984-07-04 1984-07-04 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59137175A JPS6118157A (ja) 1984-07-04 1984-07-04 半導体装置

Publications (2)

Publication Number Publication Date
JPS6118157A JPS6118157A (ja) 1986-01-27
JPH0525182B2 true JPH0525182B2 (cg-RX-API-DMAC10.html) 1993-04-12

Family

ID=15192564

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59137175A Granted JPS6118157A (ja) 1984-07-04 1984-07-04 半導体装置

Country Status (1)

Country Link
JP (1) JPS6118157A (cg-RX-API-DMAC10.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0732867A (ja) * 1993-07-19 1995-02-03 Showa Alum Corp 熱交換器
JPH07190668A (ja) * 1993-12-28 1995-07-28 Showa Alum Corp 熱交換器

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11653568B2 (en) * 2020-01-08 2023-05-16 Texas Instmments Incorporated Integrated circuit stress sensor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0732867A (ja) * 1993-07-19 1995-02-03 Showa Alum Corp 熱交換器
JPH07190668A (ja) * 1993-12-28 1995-07-28 Showa Alum Corp 熱交換器

Also Published As

Publication number Publication date
JPS6118157A (ja) 1986-01-27

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