JPS6353984A - Photocoupler package - Google Patents
Photocoupler packageInfo
- Publication number
- JPS6353984A JPS6353984A JP61197915A JP19791586A JPS6353984A JP S6353984 A JPS6353984 A JP S6353984A JP 61197915 A JP61197915 A JP 61197915A JP 19791586 A JP19791586 A JP 19791586A JP S6353984 A JPS6353984 A JP S6353984A
- Authority
- JP
- Japan
- Prior art keywords
- light
- resin
- periphery
- receiving element
- mounting part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims abstract description 24
- 239000011347 resin Substances 0.000 claims abstract description 24
- 238000007789 sealing Methods 0.000 claims abstract description 18
- 239000004593 Epoxy Substances 0.000 claims abstract description 13
- 239000003822 epoxy resin Substances 0.000 claims abstract description 8
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 8
- 229920002050 silicone resin Polymers 0.000 claims description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 6
- 229910052710 silicon Inorganic materials 0.000 abstract description 6
- 239000010703 silicon Substances 0.000 abstract description 6
- 238000010276 construction Methods 0.000 abstract 1
- 230000035939 shock Effects 0.000 description 2
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Abstract
Description
【発明の詳細な説明】
（技術分野）
この発明は発光素子４と受光素子５とを対向せしめ封止
樹脂３で封止一体化したフォトカプラパッケージに関す
る。DETAILED DESCRIPTION OF THE INVENTION (Technical Field) The present invention relates to a photocoupler package in which a light emitting element 4 and a light receiving element 5 are placed facing each other and integrally sealed with a sealing resin 3.
（背景技術）
第５図に示すのはこの種の従来のものであり、リード端
子１の先端に登載部２を形成してリードフレーム６とし
、リードフレーム６の登載部２に発光素子４を登載した
ものと登載部２に受光素子５を登載したものを、該発光
素子４と受光素子５とが対向するように配置し、発光素
子４と受光素子５との間に透光性のシリコン系樹脂７を
充填し、透光性のシリコン系樹脂７の周囲を白色のシリ
コン系樹脂８で被覆し、かつその周囲をエポキシ系封止
樹脂３で封止してなるフォトカプラパッケージである。(Background Art) A conventional device of this type is shown in FIG. The mounted device and the device in which the light receiving element 5 is mounted on the mounting part 2 are arranged so that the light emitting element 4 and the light receiving element 5 face each other, and a transparent silicon is placed between the light emitting element 4 and the light receiving element 5. This is a photocoupler package in which the periphery of the translucent silicone resin 7 is covered with a white silicone resin 8, and the periphery thereof is sealed with an epoxy sealing resin 3.
しかるに、シリコン系樹脂８とエポキシ系封止樹脂３及
びリードフレーム６相互の密着性が悪いため熱衝撃に対
してこれらの界面に隙間が生じ耐湿性等が悪化するとい
う欠点があった（発明の目的）
この発明は上記欠点を除去せんとするものである。この
発明の目的は、透光性のシリコン゛ 系樹脂７がフォ
トカプラパッケージの中心部に配置され、透光性のシリ
コン系樹脂７とｖｉ透光性のシリコン系樹脂７の周囲を
被覆する白色等の反射性のエポキシ系封止樹脂９及びリ
ードフレーム６相互間に隙間が生じてもその影響がパッ
ケージの外周部に及ばず封止効果が高く信頼性の高いフ
ォトカプラパッケージを提供することである。However, since the adhesion between the silicone resin 8, the epoxy sealing resin 3, and the lead frame 6 is poor, a gap is created at the interface between them due to thermal shock, which deteriorates moisture resistance. Purpose) The present invention aims to eliminate the above-mentioned drawbacks. The object of the present invention is to arrange a light-transmitting silicone resin 7 in the center of a photocoupler package, and to cover the periphery of the light-transparent silicone resin 7 and the vi light-transparent silicone resin 7. By providing a highly reliable photocoupler package which has a high sealing effect and does not affect the outer periphery of the package even if a gap occurs between the reflective epoxy sealing resin 9 and the lead frame 6. be.
（発明の開示）
この発明の要旨とするところは、リード端子１の先端に
登載部２を形成してリードフレーム６とし、リードフレ
ーム６の登載部２に発光素子４を登載したものと拡大部
２に受光素子５を登載したものを、該発光素子４と受光
素子５とが対向するように配置し、発光素子４と受光素
子５との間に透光性のシリコン系樹脂７を充填し、該透
光性のシリコン系樹脂７の周囲を白色等の反射性のエポ
キシ系樹脂９で被覆し、かつその周囲をエポキシ系封止
樹脂３で封止してなるフォトカプラパッケージである。(Disclosure of the Invention) The gist of the present invention is to form a lead frame 6 by forming a mounting part 2 at the tip of a lead terminal 1, and to form a lead frame 6 with a light emitting element 4 mounted on the mounting part 2 of the lead frame 6 and an enlarged part. A light-receiving element 5 mounted on a light-emitting element 2 is arranged so that the light-emitting element 4 and the light-receiving element 5 face each other, and a transparent silicone resin 7 is filled between the light-emitting element 4 and the light-receiving element 5. This is a photocoupler package in which the periphery of the transparent silicone resin 7 is coated with a reflective epoxy resin 9 such as white, and the periphery thereof is sealed with an epoxy sealing resin 3.
以下、この発明を図示せる実施例にもとずいて説明する
。Hereinafter, the present invention will be explained based on illustrative embodiments.
第１図乃至第４図に示すのはこの発明の一実施例である
。What is shown in FIGS. 1 to 4 is one embodiment of the present invention.
６はリード端子１の先端に登載部２を形成せるリードフ
レームであり、登載部２に発光素子４を登載したものと
登載部２に受光素子５を登載したものを、該発光素子４
と受光素子５とが対向するように配置されている。Reference numeral 6 denotes a lead frame in which a mounting part 2 is formed at the tip of the lead terminal 1, and a structure in which a light emitting element 4 is mounted on the mounting part 2 and a structure in which a light receiving element 5 is mounted in the mounting part 2 are used to form the light emitting element 4.
and the light receiving element 5 are arranged to face each other.
受光側若しくは発行側の発光素子４若しくは受光素子５
は一個とは限らず、例えば、この実施例の如く、発光素
子４を二個直列接続して使用するときは、リードフレー
ム６ａ’ｂ６ｂｓ６Ｃを三個平面的に配列し、その内の
二個にＬＥＤを発光素子４として登載し、発光素子４を
登載していないリードフレーム６ａをプラス端子とし、
該リードフレーム６ａをワイヤボンディングによりリー
ドフレーム６ｂの発光素子４と接続し、かつ該リードフ
レーム６ｂをワイヤボンディングによりリードフレーム
６Ｃの発光素子４と接続し、リードフレーム６Ｃをマイ
ナス端子として使用する。Light emitting element 4 or light receiving element 5 on the light receiving side or emitting side
For example, when two light emitting elements 4 are connected in series as in this embodiment, three lead frames 6a'b6bs6C are arranged in a plane, and two of them are The LED is mounted as a light emitting element 4, and the lead frame 6a on which the light emitting element 4 is not mounted is used as a positive terminal,
The lead frame 6a is connected to the light emitting element 4 of the lead frame 6b by wire bonding, and the lead frame 6b is connected to the light emitting element 4 of the lead frame 6C by wire bonding, and the lead frame 6C is used as a negative terminal.
受光素子５はプラス端子となるリードフレーム６ｄに登
載され、ワイヤボンディングにより該リードフレーム６
ｄ及びマイナス端子となるリードフレーム６ｅに接続さ
れている。The light receiving element 5 is mounted on a lead frame 6d which serves as a positive terminal, and is attached to the lead frame 6d by wire bonding.
d and is connected to a lead frame 6e which serves as a negative terminal.
７は透光性のシリコン系樹脂７で、発光素子４と受光素
子５との間に充填されている。Reference numeral 7 denotes a transparent silicone resin 7, which is filled between the light emitting element 4 and the light receiving element 5.
該透光性のシリコン系樹脂７の周囲は白色、黄色、うす
い桃色°等め反射性のエポキシ系樹脂９で被覆されてい
る。The periphery of the translucent silicone resin 7 is coated with a reflective epoxy resin 9 of white, yellow, or pale pink color.
而して発光素子４の出す光は透光性のシリコン系樹脂７
を介して受光素子５に受光される。白色等の反射性のエ
ポキシ系樹脂９は、この際に、発光素子４の出す光が反
射されて効率的に受光素子５に集まるように設けられて
いる。The light emitted by the light emitting element 4 is transmitted through the transparent silicone resin 7.
The light is received by the light receiving element 5 via. The reflective epoxy resin 9, which is white or the like, is provided so that the light emitted by the light emitting element 4 is reflected and efficiently collected on the light receiving element 5 at this time.
３はエポキシ系封止樹脂３で、該白色等の反射性のエポ
キシ系樹脂９の周囲を厚く封止し、発光素子４及び受光
素子５の登載部２を外力及び熱、湿気等より保護してい
る。3 is an epoxy sealing resin 3 that thickly seals the periphery of the white or other reflective epoxy resin 9 to protect the mounting portion 2 of the light emitting element 4 and light receiving element 5 from external force, heat, moisture, etc. ing.
（発明の効果）
以上の如くこの発明によるフォトカプラによれば、発光
素子４と受光素子５との間を充填する透光性のシリコン
系樹脂７の周囲は白色等の反射性のエポキシ系樹脂９で
被覆されており、このため周囲を白色のシリコン系樹脂
で被覆した場合にくらべて、フォトカプラパッケージの
中心部までエポキシ系封止樹脂で被覆することになり、
シリコン系樹脂７とエポキシ系封止樹脂９とリードフレ
ーム間に熱衝撃等により生ずる隙間を内部中心に閉じ込
めることができ、その影響がパッケージの外周部に及ば
ず封止効果が高く信頼性の高いフォトカプラパッケージ
と成っているのである。また、このようにすることによ
り、リードフレームとの密着性に優れるエポキシ系封止
樹脂との接触面積もひろくなり、外部よりの湿気の侵入
はより効果的に防止されているのである。(Effects of the Invention) As described above, according to the photocoupler according to the present invention, the transparent silicon resin 7 filling the space between the light emitting element 4 and the light receiving element 5 is surrounded by a reflective epoxy resin such as white. Therefore, compared to the case where the periphery is covered with white silicone resin, the center of the photocoupler package is covered with epoxy sealing resin.
It is possible to confine the gap caused by thermal shock between the silicon resin 7, epoxy sealing resin 9 and the lead frame to the center of the interior, and the effect does not extend to the outer periphery of the package, resulting in a high sealing effect and high reliability. It is made up of a photocoupler package. In addition, by doing this, the contact area with the epoxy sealing resin, which has excellent adhesion to the lead frame, is increased, and moisture infiltration from the outside is more effectively prevented.
【図面の簡単な説明】
第１図乃至第４図はこの発明の一実施例を示す図で、第
１図は断面図、第２図は第１図のＡ−Ａ矢視図、第３図
は第２図のＢ−Ｂ矢視図、第４図は第２図のＣ−Ｃ矢視
図である。第５図はこの発明の従来例を示す断面図であ
る。
１はリード端子、２は登載部、３はエポキシ系封止樹脂
、４は発光素子、５は受光素子、６はリードフレーム、
７は透光性のシリコン系樹脂、９は白色エポキシ系封止
樹脂である。[BRIEF DESCRIPTION OF THE DRAWINGS] FIGS. 1 to 4 are views showing an embodiment of the present invention, in which FIG. 1 is a cross-sectional view, FIG. 2 is a view taken along arrow A-A in FIG. The figure is a view taken along the line B--B in FIG. 2, and FIG. 4 is a view taken along the line C--C in FIG. FIG. 5 is a sectional view showing a conventional example of the present invention. 1 is a lead terminal, 2 is a mounting part, 3 is an epoxy sealing resin, 4 is a light emitting element, 5 is a light receiving element, 6 is a lead frame,
7 is a transparent silicon resin, and 9 is a white epoxy sealing resin.
Claims (1)
フレーム６とし、リードフレーム６の登載部２に発光素
子４を登載したものと登載部２に受光素子５を登載した
ものを、該発光素子４と受光素子５とが対向するように
配置し、発光素子４と受光素子５との間に透光性のシリ
コン系樹脂７を充填し、透光性のシリコン系樹脂７の周
囲を白色等の反射性のエポキシ系樹脂９で被覆し、かつ
その周囲をエポキシ系封止樹脂３で封止してなるフォト
カプラパッケージ。(1) A lead frame 6 is formed by forming a mounting part 2 on the tip of a lead terminal 1, a light emitting element 4 is mounted on the mounting part 2 of the lead frame 6, and a light receiving element 5 is mounted on the mounting part 2 of the lead frame 6. The light-emitting element 4 and the light-receiving element 5 are arranged so as to face each other, a light-transmitting silicone resin 7 is filled between the light-emitting element 4 and the light-receiving element 5, and the surrounding area of the light-transmitting silicone resin 7 is A photocoupler package which is coated with white or other reflective epoxy resin 9 and the surrounding area is sealed with epoxy sealing resin 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61197915A JPS6353984A (en) | 1986-08-22 | 1986-08-22 | Photocoupler package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61197915A JPS6353984A (en) | 1986-08-22 | 1986-08-22 | Photocoupler package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6353984A true JPS6353984A (en) | 1988-03-08 |
Family
ID=16382386
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61197915A Pending JPS6353984A (en) | 1986-08-22 | 1986-08-22 | Photocoupler package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6353984A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003083779A (en) * | 2001-09-14 | 2003-03-19 | Lube Corp | Flow detector for light transmitting pipe |
| US7009166B2 (en) * | 2002-03-26 | 2006-03-07 | Sharp Kabushiki Kaisha | Photocoupler, method for producing the same, and electronic device equipped with the photocoupler |
-
1986
- 1986-08-22 JP JP61197915A patent/JPS6353984A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003083779A (en) * | 2001-09-14 | 2003-03-19 | Lube Corp | Flow detector for light transmitting pipe |
| US7009166B2 (en) * | 2002-03-26 | 2006-03-07 | Sharp Kabushiki Kaisha | Photocoupler, method for producing the same, and electronic device equipped with the photocoupler |
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