JPS63192279A - Photocoupler package - Google Patents
Photocoupler packageInfo
- Publication number
- JPS63192279A JPS63192279A JP62023326A JP2332687A JPS63192279A JP S63192279 A JPS63192279 A JP S63192279A JP 62023326 A JP62023326 A JP 62023326A JP 2332687 A JP2332687 A JP 2332687A JP S63192279 A JPS63192279 A JP S63192279A
- Authority
- JP
- Japan
- Prior art keywords
- light
- resin
- light emitting
- mounting part
- photodetector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims abstract description 38
- 239000011347 resin Substances 0.000 claims abstract description 38
- 238000007789 sealing Methods 0.000 claims abstract description 14
- 239000004593 Epoxy Substances 0.000 claims abstract description 7
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 230000035939 shock Effects 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Abstract
Description
【発明の詳細な説明】
［技術分野］
本発明は、発光素子と受光素子とを対向せしめ封止樹脂
で封止一体化したフォトカプラパッケージに関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a photocoupler package in which a light emitting element and a light receiving element are placed facing each other and are integrally sealed with a sealing resin.
［背景技術］
第６図乃至第８図はこの種の従来例を示すもので、リー
ド端子ｌの先端に登載部２を形成してリードフレーム３
とし、リードフレーム３の登載部２に発光素子４を登載
したものと、登載部２に受光素子５を登載したものを、
その発光素子４と受光素子５とが対向するように配置す
ると共に、発光素子４と受光素子５との間に透光性のシ
リコン系樹脂６を充填し、その周囲をエポキシ系封止樹
脂７で封止して成るフォトカプラパッケージである。[Background Art] FIGS. 6 to 8 show conventional examples of this type, in which a mounting portion 2 is formed at the tip of a lead terminal l and a lead frame 3 is mounted.
The light emitting element 4 is mounted on the mounting part 2 of the lead frame 3, and the light receiving element 5 is mounted on the mounting part 2 of the lead frame 3.
The light-emitting element 4 and the light-receiving element 5 are arranged to face each other, and a translucent silicone resin 6 is filled between the light-emitting element 4 and the light-receiving element 5, and an epoxy sealing resin 7 is placed around the light-emitting element 4 and the light-receiving element 5. It is a photocoupler package sealed with
しかしながら、かかる従来例においては、発光素子４の
ワイヤーＷが透光性樹脂６と封止樹脂７の異なる二つの
樹脂をまたいでいる為、熱衝撃等により透光性樹脂６と
封止樹脂７の界面にずれが生じ、ワイヤーＷが断線する
という欠点があった、また、シリコン系樹脂６、エポキ
シ系封止樹脂７、リードフレーム３相互の密着性が悪い
為、熱衝撃等に対してこれらの界面に隙間が生じ、耐湿
性等が悪化するという欠点があった。However, in such a conventional example, since the wire W of the light emitting element 4 straddles two different resins, the translucent resin 6 and the sealing resin 7, the translucent resin 6 and the sealing resin 7 may be damaged due to thermal shock or the like. There was a drawback that the wire W was disconnected due to a shift in the interface of the This has the disadvantage that a gap is formed at the interface, which deteriorates moisture resistance.
［発明の目的］
本発明は、上記の欠点を改善するためになされたもので
、その目的とするところは、透光性の樹脂により光伝達
を行なう一体化構造のフォトカプラにおいて、耐熱衝撃
性の優れたパッケージを提供するにある。[Object of the Invention] The present invention has been made to improve the above-mentioned drawbacks, and its purpose is to improve thermal shock resistance in a photocoupler with an integrated structure in which light is transmitted using a translucent resin. We are here to provide you with an excellent package.
［発明の開示〕 以下、本発明を実施例に基づいて説明する。[Disclosure of invention] Hereinafter, the present invention will be explained based on examples.
第１図乃至第３図は本発明の一実施例を示すもので、リ
ード端子１の先端に登載部２を形成してリードフレーム
３とし、リードフレーム３の登載部２に発光素子４を登
載したものと登載部２に受光素子５を登載したものを、
その発光素子４と受光素子５とが対向するように配置す
る。ここで、発光側若しくは受光側の発光素子４若しく
は受光素子５は１１１Ｍとは限らない、６は透光性の樹
脂で、発光素子４と受光素子５との間に充填されており
、且２この透光性樹脂６内に発光素子４及び受光素子５
に打たれているワイヤーＷを包み込んでいる。７はエポ
キシ系封止樹脂で、フォトカプラを外力、熱、湿気等よ
り保護している。1 to 3 show an embodiment of the present invention, in which a mounting part 2 is formed at the tip of a lead terminal 1 to form a lead frame 3, and a light emitting element 4 is mounted on the mounting part 2 of the lead frame 3. The one with the light receiving element 5 mounted on the mounting part 2,
The light emitting element 4 and the light receiving element 5 are arranged to face each other. Here, the light-emitting element 4 or the light-receiving element 5 on the light-emitting side or the light-receiving side is not necessarily 111M, and 6 is a translucent resin filled between the light-emitting element 4 and the light-receiving element 5, and 2 A light-emitting element 4 and a light-receiving element 5 are disposed within this translucent resin 6.
It wraps around the wire W that is being struck. 7 is an epoxy sealing resin that protects the photocoupler from external forces, heat, moisture, etc.
このように本実施例においては、従来例のようにワイヤ
ーＷは異なる二つの樹脂をまたいでいないので、熱衝撃
等により透光性樹脂６と封止樹脂７の界面にずれが生じ
ても、ワイヤーＷが断線するということはない。In this way, in this embodiment, unlike the conventional example, the wire W does not straddle two different resins, so even if a shift occurs at the interface between the translucent resin 6 and the sealing resin 7 due to thermal shock, etc. There is no possibility that the wire W will be disconnected.
なお、上記透光性樹脂６は、熱？！４ｉｖ？ｉ等により
封止樹脂７との界面に隙間ができないようにするために
は透光性エポキシ系樹脂が望ましい。このようにすると
、耐湿性等も改善できる。In addition, the above-mentioned translucent resin 6 is heated? ! 4iv? In order to prevent a gap from forming at the interface with the sealing resin 7 due to i, etc., a translucent epoxy resin is preferable. In this way, moisture resistance etc. can also be improved.
第４図および第５図は本発明の異なる実施例を示すもの
で、前記実施例と異なる点は、透光性樹脂６が透光性エ
ポキシ系樹脂である前記実施例において、発光素子４に
シリコン系透光性樹脂８から成るジャンクションコート
を施したことで、他の構成は前記実施例と同様であるの
で、同等構成に同一符号を付すことにより説明を省略す
る。FIG. 4 and FIG. 5 show different embodiments of the present invention, and the difference from the above embodiment is that in the above embodiment, the light-transmitting resin 6 is a light-transmitting epoxy resin. Since the other configurations are the same as those of the previous embodiment except for the junction coat made of silicone-based translucent resin 8, the explanation will be omitted by assigning the same reference numerals to the same configurations.
このように構成することにより、前記実施例における効
果に加え、エポキシ系樹脂６が硬い為に発生し易い発光
素子４へのストレスを除去できる効果もある。なお、上
記ジャンクションコート８は発光素子４及び受光素子５
に施してもよく、また、受光素子５のみに施してもよい
。With this configuration, in addition to the effects of the embodiments described above, there is also the effect of eliminating stress on the light emitting element 4 that is likely to occur because the epoxy resin 6 is hard. Note that the junction coat 8 has a light emitting element 4 and a light receiving element 5.
Alternatively, it may be applied only to the light receiving element 5.
［発明の効果１
このように本発明に係るフォトカブラパッケージは、リ
ード端子の先端に登載部を形成してリードフレームとし
、リードフレームの登載部に発光素子を登載したものと
、登載部に受光素子を登載したものを、その発光素子と
受光素子とが対向するように配置し、上記発光素子と受
光素子との間に透光性の樹脂を充填すると共に、その樹
脂で発光素子と受光素子に打たれているワイヤーの全て
を包み込み、且つ上記透光性樹脂の周囲をエポキシ系封
止樹脂で封止したことを特徴とするので、熱衝撃性等に
よって発生するワイヤーの断線を防止することができる
効果がある。[Effect of the Invention 1 As described above, the photocoupler package according to the present invention has a lead frame in which a mounting part is formed at the tip of a lead terminal, a light emitting element is mounted on the mounting part of the lead frame, and a light receiving part is mounted on the mounting part of the lead frame. A device on which the device is mounted is arranged so that the light emitting device and the light receiving device face each other, a translucent resin is filled between the light emitting device and the light receiving device, and the resin is used to connect the light emitting device and the light receiving device. It is characterized by enveloping all of the wires that are connected to the wire and sealing the periphery of the transparent resin with an epoxy sealing resin, thereby preventing wire breakage caused by thermal shock, etc. It has the effect of
第１図乃至第３図は本発明の一実施例を示すもので、第
１図は断面図、第２図は第１図のＡ−Ａ線矢印方向から
見た図、第３図（ａ）は第２図のＡ−Ａ線矢印方向から
見た図、第３図１ｂ）は第２図のＢ−Ｂ線矢印方向から
見た図、第４図および第５図は本発明の異なる実施例を
示す断面図、第６図乃至第８図は従来例を示すもので、
第６図および第７図は断面図、第８図は要部平面図であ
る。
ｌ・・・リード端子、２・・・登載部、３・・・リード
フレーム３．４・・・発光素子、５・・・受光素子、６
・・・透光性樹脂、７・・・エポキシ系封止樹脂、８・
・・シリコン系透光性樹脂。1 to 3 show one embodiment of the present invention, in which FIG. 1 is a sectional view, FIG. 2 is a view seen from the direction of the arrow A-A in FIG. 1, and FIG. ) is a view seen from the direction of the arrow A-A in FIG. 2, FIG. 3 1b) is a view seen from the direction of the arrow B-B in FIG. The cross-sectional views showing the embodiment and FIGS. 6 to 8 show conventional examples.
6 and 7 are cross-sectional views, and FIG. 8 is a plan view of the main parts. l... Lead terminal, 2... Registration part, 3... Lead frame 3.4... Light emitting element, 5... Light receiving element, 6
... Translucent resin, 7... Epoxy sealing resin, 8.
...Silicone-based translucent resin.
Claims (3)
ームとし、リードフレームの登載部に発光素子を登載し
たものと、登載部に受光素子を登載したものを、その発
光素子と受光素子とが対向するように配置し、上記発光
素子と受光素子との間に透光性の樹脂を充填すると共に
、その樹脂で発光素子と受光素子に打たれているワイヤ
ーの全てを包み込み、且つ上記透光性樹脂の周囲をエポ
キシ系封止樹脂で封止して成るフォトカプラパッケージ
。(1) A lead frame is formed by forming a mounting part on the tip of a lead terminal, and a light-emitting element is mounted on the mounting part of the lead frame, and a light-receiving element is mounted on the mounting part. are arranged so that they face each other, and a translucent resin is filled between the light-emitting element and the light-receiving element, and the resin wraps all the wires connected to the light-emitting element and the light-receiving element. A photocoupler package made by sealing the periphery of a photosensitive resin with an epoxy sealing resin.
の範囲第１項記載のフォトカプラパッケージ。(2) The photocoupler package according to claim 1, wherein the light-transmitting resin is an epoxy resin.
にシリコン系透光性樹脂のジャンクションコートを施し
た特許請求の範囲第２項記載のフォトカプラパッケージ
。(3) The photocoupler package according to claim 2, wherein at least one of the light-emitting element and the light-receiving element is coated with a silicon-based translucent resin junction coat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62023326A JPS63192279A (en) | 1987-02-03 | 1987-02-03 | Photocoupler package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62023326A JPS63192279A (en) | 1987-02-03 | 1987-02-03 | Photocoupler package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63192279A true JPS63192279A (en) | 1988-08-09 |
Family
ID=12107458
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62023326A Pending JPS63192279A (en) | 1987-02-03 | 1987-02-03 | Photocoupler package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63192279A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5796714A (en) * | 1994-09-28 | 1998-08-18 | Matsushita Electric Industrial Co., Ltd. | Optical module having a vertical-cavity surface-emitting laser |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5540502B2 (en) * | 1975-04-04 | 1980-10-18 | ||
| JPS57143889A (en) * | 1981-03-02 | 1982-09-06 | Toshiba Corp | Photo-coupling semiconductor device |
-
1987
- 1987-02-03 JP JP62023326A patent/JPS63192279A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5540502B2 (en) * | 1975-04-04 | 1980-10-18 | ||
| JPS57143889A (en) * | 1981-03-02 | 1982-09-06 | Toshiba Corp | Photo-coupling semiconductor device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5796714A (en) * | 1994-09-28 | 1998-08-18 | Matsushita Electric Industrial Co., Ltd. | Optical module having a vertical-cavity surface-emitting laser |
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