JP2602269B2 - Optical coupling device - Google Patents
Optical coupling deviceInfo
- Publication number
- JP2602269B2 JP2602269B2 JP4903388A JP4903388A JP2602269B2 JP 2602269 B2 JP2602269 B2 JP 2602269B2 JP 4903388 A JP4903388 A JP 4903388A JP 4903388 A JP4903388 A JP 4903388A JP 2602269 B2 JP2602269 B2 JP 2602269B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- lead
- resin body
- optical coupling
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は光結合素子に関する。Description: TECHNICAL FIELD The present invention relates to an optical coupling device.
従来の光結合素子は、第３図（ａ），（ｂ）の切欠正
面図及びＺ−Ｚ′線断面図に示すように、第１のリード
１に発光素子３をマウントし、発光素子３と第２のリー
ド２との間をボンディング線４で電気的に接続した後、
発光素子３を透光性シリコン樹脂層５で被覆する。次
に、リード６に受光素子８をマウントして受光素子８と
リード７との間をボンディング線９で電気的に接続す
る。次に、発光素子３と受光素子８を対向させた状態で
両者をエポキシ樹脂等の透光性樹脂体10で封止し、透光
性樹脂体10の外周を遮光性樹脂体11で封止する。As shown in a cutaway front view and a sectional view taken along line ZZ 'of FIGS. 3 (a) and 3 (b), a conventional light coupling element mounts a light emitting element 3 on a first lead 1; After the electrical connection between the second lead 2 and the second lead 2 is made,
The light emitting element 3 is covered with the translucent silicon resin layer 5. Next, the light receiving element 8 is mounted on the lead 6, and the light receiving element 8 and the lead 7 are electrically connected by the bonding wire 9. Next, with the light emitting element 3 and the light receiving element 8 facing each other, both are sealed with a light transmitting resin body 10 such as an epoxy resin, and the outer periphery of the light transmitting resin body 10 is sealed with a light shielding resin body 11. I do.
上述した従来の光結合素子は、発光素子に接続された
ボンディング線の一部がシリコン樹脂層に被覆され、残
りの部分が透光性樹脂体で封止されているが、シリコン
樹脂層の線膨張係数30×10-5と透光性樹脂体の線膨張係
数２×10-5が大きく異なっているため、高温雰囲気と低
温雰囲気を交互に繰返す温度サイクル試験を実施する
と、シリコン樹脂層と透光性樹脂体の境界部分でボンデ
ィング線が切断するという問題があった。In the above-described conventional optical coupling element, a part of the bonding wire connected to the light emitting element is covered with a silicone resin layer, and the remaining part is sealed with a translucent resin body. Since the coefficient of expansion of 30 × 10 -5 is significantly different from the coefficient of linear expansion of the translucent resin of 2 × 10 -5 , a temperature cycle test in which a high-temperature atmosphere and a low-temperature atmosphere are alternately performed shows that There is a problem that the bonding line is cut at the boundary between the optical resin bodies.
本発明の目的は、温度サイクル試験においてもボンデ
ィング線の切断を生じない信頼性の高い光結合素子を提
供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a highly reliable optical coupling element that does not break a bonding line even in a temperature cycle test.
本発明の光結合素子は、第１のリード上にマウントし
た発光素子と、前記発光素子と第２のリードとの間を電
気的に接続するボンディング線と、前記発光素子及び前
記ボンディング線の全部を含むように被覆する透光性シ
リコン樹脂と、前記発光素子と対向させて設けた受光素
子と、前記発光素子及び前記受光素子を一体化して封止
する透光性樹脂体と、前記透光性樹脂体の外周を被覆し
て封止する遮光性樹脂体とを有する。An optical coupling device according to the present invention includes a light emitting device mounted on a first lead, a bonding wire for electrically connecting the light emitting device and the second lead, and all of the light emitting device and the bonding wire. A light-transmitting silicone resin for covering the light-emitting element, a light-receiving element provided to face the light-emitting element, a light-transmitting resin body for integrally sealing the light-emitting element and the light-receiving element, and A light-shielding resin body that covers and seals the outer periphery of the conductive resin body.
次に、本発明の実施例について図面を参照して説明す
る。Next, embodiments of the present invention will be described with reference to the drawings.
第１図（ａ），（ｂ）は本発明の一実施例を説明する
ための光結合素子の切欠正面及びＸ−Ｘ′線断面図であ
る。FIGS. 1 (a) and 1 (b) are a cutaway front view and an XX 'line cross-sectional view of an optical coupling device for explaining an embodiment of the present invention.
第１図（ａ），（ｂ）に示すように、第１のリード１
の上に発光素子３をAgペースト又はAu−Ge合金によりマ
ウントし、発光素子３と第２のリード２との間を金線等
のボンディング線４で電気的に接続した後、発光素子３
及びボンディング線４の全部を含むようにシリコン樹脂
を0.5〜2mg滴下し熱硬化させた透光性シリコン樹脂層５
で被覆する。次に、リード６の上にAgペースト又はAu−
Ge合金により受光素子８をマウントし、受光素子８とリ
ード７との間をボンディング線９で接続する。次に、発
光素子３と受光素子８とを互いに対向させてエポキシ樹
脂等の透光性樹脂体10により一体化して封止し、透光性
樹脂体10の外周を遮光性樹脂体11で被覆するように封止
する。As shown in FIGS. 1A and 1B, the first lead 1
The light emitting element 3 is mounted thereon with an Ag paste or an Au—Ge alloy, and the light emitting element 3 and the second lead 2 are electrically connected to each other with a bonding wire 4 such as a gold wire.
And a translucent silicone resin layer 5 which is thermally cured by dropping 0.5 to 2 mg of silicone resin so as to include all of the bonding wires 4
Cover with. Next, an Ag paste or Au-
The light receiving element 8 is mounted with a Ge alloy, and the light receiving element 8 and the lead 7 are connected by a bonding wire 9. Next, the light emitting element 3 and the light receiving element 8 are opposed to each other, integrated and sealed with a light transmitting resin body 10 such as an epoxy resin, and the outer periphery of the light transmitting resin body 10 is covered with a light shielding resin body 11. Sealing.
第２図（ａ），（ｂ）は本発明の第２の実施例を説明
するための光結合素子の切欠正面図及びＹ−Ｙ′線断面
図である。FIGS. 2 (a) and 2 (b) are a cutaway front view and a sectional view taken along the line YY 'of an optical coupling device for explaining a second embodiment of the present invention.
第２図（ａ），（ｂ）に示すように、第１のリード１
に発光素子３をマウントし、第２のリード２に発光素子
3aをマウントし、発光素子３とリード２との間をボンデ
ィング線４で、また、発光素子3aとリード１との間をボ
ンディング線4aにより互にそれぞれ電気的に接続した
後、発光素子3,3a及びボンディング線4,4aの全部を含む
ように透光性シリコン樹脂層５で被覆する。次に、リー
ド６の上にマウントした受光素子８とリード７との間を
ボンディング線９で接続し、発光素子3,3aと受光素子８
とを対向させて透光性樹脂体10により一体化して封止
し、透光性樹脂体10の外周を遮光性樹脂体11で被覆する
ように封止する。As shown in FIGS. 2A and 2B, the first lead 1
The light emitting element 3 is mounted on the second lead 2, and the light emitting element 3 is mounted on the second lead 2.
3a is mounted, and the light emitting element 3 and the lead 2 are electrically connected to each other by a bonding wire 4 and the light emitting element 3a and the lead 1 are electrically connected to each other by a bonding wire 4a. The light-transmitting silicon resin layer 5 is covered so as to include all of the bonding wires 3a and the bonding wires 4 and 4a. Next, the light receiving element 8 mounted on the lead 6 and the lead 7 are connected by a bonding wire 9, and the light emitting elements 3, 3a and the light receiving element 8 are connected.
Are sealed together by a translucent resin body 10 so as to face each other, and the outer periphery of the translucent resin body 10 is sealed so as to be covered with a light-shielding resin body 11.
以上説明したように本発明は、従来シリコン樹脂層と
エポキシ樹脂等の透光性樹脂体の線膨張係数の違う２層
の樹脂の中を通り抜けていたボンディング線を発光素子
と一体化してシリコン樹脂層により被覆することによ
り、温度サイクル試験においてもボンディング線は切断
されることがなく光結合素子の信頼性を向上させるとい
う効果を有する。As described above, according to the present invention, a bonding line that has passed through two layers of resin having different linear expansion coefficients between a silicon resin layer and a light-transmitting resin body such as an epoxy resin has been integrated with a light emitting element to form a silicon resin. Covering with a layer has the effect of improving the reliability of the optical coupling element without cutting the bonding line even in a temperature cycle test.
第１図（ａ），（ｂ）は本発明の第１の実施例を説明す
るための光結合素子の切欠正面図及びＸ−Ｘ′線断面
図、第２図（ａ），（ｂ）は本発明の第２の実施例を説
明するための光結合素子の切欠正面図及びＹ−Ｙ′線断
面図、第３図（ａ），（ｂ）は従来の光結合素子の一例
を説明するための切欠正面図及びＺ−Ｚ′断面図であ
る。 1,2……リード、3,3a……発光素子、4,4a……ボンディ
ング線、５……透光性シリコン樹脂層、6,7……リー
ド、８……受光素子、９……ボンディング線、10……透
光性樹脂体、11……遮光性樹脂体。FIGS. 1 (a) and 1 (b) are a cutaway front view and a sectional view taken along the line XX 'of an optical coupling element for explaining a first embodiment of the present invention, and FIGS. 2 (a) and 2 (b). FIG. 3 is a cutaway front view and a cross-sectional view taken along the line YY 'of the optical coupling device for explaining a second embodiment of the present invention. FIGS. 3A and 3B illustrate an example of a conventional optical coupling device. It is a notch front view and ZZ 'sectional drawing for performing. 1,2 ... lead, 3,3a ... light emitting element, 4,4a ... bonding wire, 5 ... translucent silicon resin layer, 6,7 ... lead, 8 ... light receiving element, 9 ... bonding Line, 10: translucent resin body, 11: light-shielding resin body.
Claims (1)
と、前記発光素子と第２のリードとの間を電気的に接続
するボンディング線と、前記発光素子及び前記ボンディ
ング線の全部を含むように被覆する透光性シリコン樹脂
と、前記発光素子と対向させて設けた受光素子と、前記
発光素子及び前記受光素子を一体化して封止する透光性
樹脂体と、前記透光性樹脂体の外周を被覆して封止する
遮光性樹脂体とを有することを特徴とする光結合素子。1. A light emitting device mounted on a first lead, a bonding wire for electrically connecting the light emitting device and the second lead, and all of the light emitting device and the bonding wire. A light-transmitting silicone resin, a light-receiving element provided to face the light-emitting element, a light-transmitting resin body for integrally sealing the light-emitting element and the light-receiving element, and the light-transmitting resin body And a light-shielding resin body that covers and seals the outer periphery of the optical coupling element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4903388A JP2602269B2 (en) | 1988-03-01 | 1988-03-01 | Optical coupling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4903388A JP2602269B2 (en) | 1988-03-01 | 1988-03-01 | Optical coupling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01222463A JPH01222463A (en) | 1989-09-05 |
| JP2602269B2 true JP2602269B2 (en) | 1997-04-23 |
Family
ID=12819779
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4903388A Expired - Fee Related JP2602269B2 (en) | 1988-03-01 | 1988-03-01 | Optical coupling device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2602269B2 (en) |
-
1988
- 1988-03-01 JP JP4903388A patent/JP2602269B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01222463A (en) | 1989-09-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |