JPH01222463A - Optically coupled element - Google Patents
Optically coupled elementInfo
- Publication number
- JPH01222463A JPH01222463A JP63049033A JP4903388A JPH01222463A JP H01222463 A JPH01222463 A JP H01222463A JP 63049033 A JP63049033 A JP 63049033A JP 4903388 A JP4903388 A JP 4903388A JP H01222463 A JPH01222463 A JP H01222463A
- Authority
- JP
- Japan
- Prior art keywords
- light
- emitting element
- lead
- bonding line
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 claims abstract description 29
- 239000011347 resin Substances 0.000 claims abstract description 29
- 229920002050 silicone resin Polymers 0.000 claims abstract description 14
- 239000011248 coating agent Substances 0.000 claims abstract 2
- 238000000576 coating method Methods 0.000 claims abstract 2
- 230000008878 coupling Effects 0.000 claims description 12
- 238000010168 coupling process Methods 0.000 claims description 12
- 238000005859 coupling reaction Methods 0.000 claims description 12
- 230000003287 optical effect Effects 0.000 claims description 12
- 239000003822 epoxy resin Substances 0.000 abstract description 4
- 229920000647 polyepoxide Polymers 0.000 abstract description 4
- 229910017401 Au—Ge Inorganic materials 0.000 abstract description 3
- 229910045601 alloy Inorganic materials 0.000 abstract description 3
- 239000000956 alloy Substances 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 229920001187 thermosetting polymer Polymers 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は光結合素子に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to an optical coupling device.
従来の光結合素子は、第３図（ａ）、（ｂ）の切欠正面
図及びｚ−ｚ’線断面図に示すように、第１のリード１
に発光素子３をマウント・し、発光素子３と第２のり−
ド２との間をボンディング線４で電気的に接続した後、
発光素子３を透光性シリコン樹脂層５で被覆する０次に
、リード６に受光素子８をマウントして受光素子８とリ
ード７との間をボンディング線９で電気的に接続する０
次に、発光′素子３と受光素子８を対向させた状態で両
者をエポキシ樹脂等の透光性樹脂体１０で封止し、透光
性樹脂体１０の外周を遮光性樹脂体１１で封止する。In the conventional optical coupling element, as shown in the cutaway front view and the sectional view taken along the line z-z' in FIGS. 3(a) and 3(b), the first lead 1
Mount the light emitting element 3 on the
After electrically connecting the board 2 with the bonding wire 4,
The light emitting element 3 is covered with a transparent silicone resin layer 5. Next, the light receiving element 8 is mounted on the lead 6, and the light receiving element 8 and the lead 7 are electrically connected with the bonding wire 9.
Next, with the light-emitting element 3 and the light-receiving element 8 facing each other, they are sealed with a light-transmitting resin body 10 such as epoxy resin, and the outer periphery of the light-transmitting resin body 10 is sealed with a light-shielding resin body 11. Stop.
（発明が解決しようとする課題〕
上述した従来の光結合素子は、発光素子に接続されたボ
ンディング線の一部がシリコン樹脂層に被覆され、残り
の部分が透光性槽″脂体で封止されているが、シリコン
樹脂層の線膨張係数３０Ｘ１０−’と透光性樹脂体の線
膨張係数２×１０’″うが大きく異なっているため、高
温雰囲気と低温雰囲気を交互に繰返す温度サイクル試験
を実施すると、シリコン樹脂層と透光性樹脂体の境界部
分でボンディング線が切断するという問題があった。(Problems to be Solved by the Invention) In the conventional optical coupling device described above, a part of the bonding wire connected to the light emitting element is covered with a silicone resin layer, and the remaining part is sealed with a transparent bath. However, because the coefficient of linear expansion of the silicone resin layer, 30 x 10-', and the coefficient of linear expansion of the translucent resin body, 2 x 10', are significantly different, a temperature cycle in which high-temperature and low-temperature atmospheres are alternately repeated is required. When testing was conducted, there was a problem that the bonding line was cut at the boundary between the silicone resin layer and the transparent resin body.
本発明の目的は、温度サイクル試験においてもボンディ
ング線の切断を生じない信頼性の高い光結合素子を提供
することにある。An object of the present invention is to provide a highly reliable optical coupling device that does not cause bonding wires to break even in a temperature cycle test.
本発明の光結合素子は、第１のリード上にマウントした
発光素子と、前記発光素子と第２のリードとの間を電気
的に接続するボンディング線と、前記発光素子及び前記
ボンディング線の全部を含むように被覆する透光性しリ
コン樹脂と、前記発光素子と対向させて設けた受光素子
と、前記発光素子及び前記受光素子を一体化して封止す
る透光性樹脂体と、前記透光性樹脂体の外周を被覆して
封止する遮光性樹脂体とを有する。The optical coupling device of the present invention includes a light emitting device mounted on a first lead, a bonding wire electrically connecting the light emitting device and the second lead, and all of the light emitting device and the bonding wire. a light-transmitting resin coated to contain a light-transmitting resin, a light-receiving element provided opposite to the light-emitting element, a light-transmitting resin body integrally sealing the light-emitting element and the light-receiving element; It has a light-shielding resin body that covers and seals the outer periphery of the photosensitive resin body.
次に、本発明の実施例について図面を参照して説明する
。Next, embodiments of the present invention will be described with reference to the drawings.
第１図（ａ）、（ｂ）は本発明の一実施例を説明するた
めの光結合素子の切欠正面図及びＸ−Ｘ′線断面図であ
る。FIGS. 1(a) and 1(b) are a cutaway front view and a sectional view taken along the line X-X' of an optical coupling element for explaining one embodiment of the present invention.
第１図（ａ）、（ｂ）に示すように、第１のリード１の
上に発光素子３をＡｇペースト又はＡｕ−Ｇｅ合金によ
りマウントし、発光素子３と第２のり−ド２との間を金
線等のボンディング線４で電気的に接続した後、発光素
子３及びボンディング線４の全部を含むようにシリ、コ
ン樹脂を０．５〜２ｍｇ滴下し熱硬化させた透光性シリ
コン樹脂層５で被覆する。次に、リード６の上にＡｇペ
ースト又はＡｕ−Ｇｅ合金により受光素子８をマウント
し、受光素子８とリード７との間をボンディング線９で
接続する。次に、発光素子３と受光素子８とを互いに対
向させてエポキシ樹脂等の透光性樹脂体１０により一体
化して封止し、透光性樹脂体１０の外周を遮光性樹脂体
１１で被覆するように封止する。As shown in FIGS. 1(a) and (b), the light emitting element 3 is mounted on the first lead 1 with Ag paste or Au-Ge alloy, and the light emitting element 3 and the second lead 2 are connected. After electrically connecting them with a bonding wire 4 such as a gold wire, 0.5 to 2 mg of silicone resin is dropped onto the light-transmitting silicone resin so as to cover the entire light emitting element 3 and the bonding wire 4, and the resin is heat-cured. Cover with resin layer 5. Next, a light receiving element 8 is mounted on the lead 6 using Ag paste or an Au-Ge alloy, and a bonding wire 9 is used to connect the light receiving element 8 and the lead 7. Next, the light-emitting element 3 and the light-receiving element 8 are made to face each other and are integrally sealed with a light-transmitting resin body 10 such as epoxy resin, and the outer periphery of the light-transmitting resin body 10 is covered with a light-shielding resin body 11. Seal as shown.
第２図（ａ）、（ｂ）は本発明の第２の実施例を説明す
るための光結合素子の切欠正面図及びＹ−Ｙ’線断面図
である。FIGS. 2(a) and 2(b) are a cutaway front view and a sectional view taken along the line Y-Y' of an optical coupling element for explaining a second embodiment of the present invention.
第２図（ａ）、（ｂ）に示すように、第１のり−ド１に
発光素子３をマウントし、第２のリード２に発光素子３
ａをマウントし、発光素子３とり−ド２との間をボンデ
ィング線４で、また、発光素子３ａとリード１との間を
ボンディング線４ａにより互にそれぞれ電気的に接続し
た後、発光素子３，３ａ及びボンディング線４，４ａの
全部を含むように透光性シリコン樹脂層５で被覆する。As shown in FIGS. 2(a) and 2(b), the light emitting element 3 is mounted on the first lead 1, and the light emitting element 3 is mounted on the second lead 2.
After mounting the light emitting element 3 and the lead 2 with the bonding wire 4 and electrically connecting the light emitting element 3a and the lead 1 with the bonding wire 4a, the light emitting element 3 is mounted. , 3a and the bonding lines 4, 4a are all covered with a transparent silicone resin layer 5.
次に、リード６の上にマウントした受光素子８とリード
７との間をボンディング線９で接続し、発光素子３，３
ａと受光素子８とを対向させて透光性樹脂体１０により
一体化して封止し、透光性樹脂体１０の外周を遮光性樹
脂体１１で被覆するように封止する。Next, the light receiving element 8 mounted on the lead 6 and the lead 7 are connected with a bonding wire 9, and the light emitting elements 3, 3
a and the light-receiving element 8 are opposed to each other and are integrally sealed with a light-transmitting resin body 10, and the outer periphery of the light-transmitting resin body 10 is covered with a light-shielding resin body 11 for sealing.
以上説明したように本発明は、従来シリコン樹脂層とエ
ポキシ樹脂等の透光性樹脂体の線膨張係数の違う２層の
樹脂の中を通り抜けていたボンディング線を発光素子と
一体化してシリコン樹脂層により被覆することにより、
温度サイクル試験においてもボンディング線は切断され
ることがなく光結合素子の信頼性を向上させるという効
果を有する。As explained above, the present invention integrates the bonding wire, which had conventionally passed through two layers of resin with different linear expansion coefficients, such as a silicone resin layer and an epoxy resin, with a silicone resin layer and a light-emitting element. By covering with a layer,
The bonding wire is not broken even in a temperature cycle test, which has the effect of improving the reliability of the optical coupling device.
第１図（ａ＞、（ｂ）は本発明の第１の実施例を説明す
るための光結合素子の切欠正面図及びＸ−ｘ’線断面図
、第２図（ａ＞、（ｂ）は本発明の第２の実施例を説明
するための光結合素子の切欠正面図及びＹ−Ｙ’線断面
図、第３図（ａ）。
（ｂ）は従来の光結合素子の一例を説明するための切欠
正面図及びｚ−ｚ’断面図である。
１．２・・・リード、３．３ａ・・・発光素子、４゜４
ａ・・・ボンディング線、５・・・透光性シリコン樹脂
層、６，７・・・リード、８・・・受光素子、９・・・
ボンディング線、１０・・・透光性樹脂体、１１・・・
遮光性樹脂体。FIGS. 1(a>, (b) are a cutaway front view and a cross-sectional view taken along the line X-x' of an optical coupling element for explaining the first embodiment of the present invention, and FIGS. 2(a>, (b) are FIG. 3(a) is a cutaway front view and a cross-sectional view taken along the Y-Y' line of an optical coupling element for explaining the second embodiment of the present invention. FIG. 3(b) is an illustration of an example of a conventional optical coupling element. 1.2...Lead, 3.3a...Light emitting element, 4°4
a... Bonding wire, 5... Transparent silicone resin layer, 6, 7... Lead, 8... Light receiving element, 9...
Bonding wire, 10... Transparent resin body, 11...
Light-shielding resin body.
Claims (1)
素子と第２のリードとの間を電気的に接続するボンディ
ング線と、前記発光素子及び前記ボンディング線の全部
を含むように被覆する透光性シリコン樹脂と、前記発光
素子と対向させて設けた受光素子と、前記発光素子及び
前記受光素子を一体化して封止する透光性樹脂体と、前
記透光性樹脂体の外周を被覆して封止する遮光性樹脂体
とを有することを特徴とする光結合素子。A light-emitting element mounted on a first lead, a bonding wire electrically connecting the light-emitting element and the second lead, and a transparent coating covering the light-emitting element and the bonding wire so as to cover them all. a transparent silicone resin, a light-receiving element provided opposite to the light-emitting element, a translucent resin body that integrates and seals the light-emitting element and the light-receiving element, and covering the outer periphery of the translucent resin body. 1. An optical coupling element comprising: a light-shielding resin body sealed with a light-shielding resin body;
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4903388A JP2602269B2 (en) | 1988-03-01 | 1988-03-01 | Optical coupling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4903388A JP2602269B2 (en) | 1988-03-01 | 1988-03-01 | Optical coupling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01222463A true JPH01222463A (en) | 1989-09-05 |
| JP2602269B2 JP2602269B2 (en) | 1997-04-23 |
Family
ID=12819779
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4903388A Expired - Fee Related JP2602269B2 (en) | 1988-03-01 | 1988-03-01 | Optical coupling device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2602269B2 (en) |
-
1988
- 1988-03-01 JP JP4903388A patent/JP2602269B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2602269B2 (en) | 1997-04-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |