JPS6173387A - Lead frame for photo-coupler - Google Patents

Lead frame for photo-coupler

Info

Publication number
JPS6173387A
JPS6173387A JP59196155A JP19615584A JPS6173387A JP S6173387 A JPS6173387 A JP S6173387A JP 59196155 A JP59196155 A JP 59196155A JP 19615584 A JP19615584 A JP 19615584A JP S6173387 A JPS6173387 A JP S6173387A
Authority
JP
Japan
Prior art keywords
light
lead
lead frame
emitting element
receiving element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59196155A
Other languages
Japanese (ja)
Inventor
Takashi Ono
隆 小野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP59196155A priority Critical patent/JPS6173387A/en
Publication of JPS6173387A publication Critical patent/JPS6173387A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto

Abstract

PURPOSE:To hold a space between elements positively by previously surrounding the outer circumference of an optical transmitting resin by a cap for holidng the space when a lead conductor, on a lower surface thereof a light-emitting element is fitted, and a lead conductor, on an upper surface thereof a light-receiving element is mounted, are opposed while holding the optical transmitting resin and the whole is sealed with an external-beam shielding resin while the end sections of the conductors are lead out to the outside. CONSTITUTION:A light-emitting element 1 is fixed to a lower surface in the vicinity of another end section of a lead conductor 3a in which an end section lead out to the outside is bent at a right angle, and a light-receiving element 2 is fastened to the upper surface of a lead conductor 4a having the same structure. The elements 1 and 2 are opposed and the conductors 3a and 3a near by the elements are stuck by an optical transmitting resin 5 as an optical path including the elements, but the outer circumference of the resin 5 is surrounded previously by a cap 8 for holding a space at that time, and the opposite surfaces of the elements 1 and 2 are made to run parallel precisely, thus resulting in no contact, etc., between the conductors 3a and 4a. The end sections of the conductors are protruded, and the whole element section is sealed with an optical shielding black resin 6.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、半導体発光素子および半導体受光素子によ
って構成される半導体フォトカプラ（以下、「フォトカ
プラ」と略称する）を製作するための７オトカグラ用リ
ードフレームに関するものである。Detailed Description of the Invention [Industrial Field of Application] The present invention is directed to a 7-address camera for manufacturing a semiconductor photocoupler (hereinafter abbreviated as "photocoupler") composed of a semiconductor light-emitting element and a semiconductor light-receiving element. This relates to lead frames for

〔従来の技術〕[Conventional technology]

半導体発光素子（以下、「発光素子」と略称する）およ
び半導体受光素子（以下、「受光素子」と略称する）に
よって構成され、画素子間が電気的に絶縁されており、
発光素子から発せられた光信号を受光素子で受光し電気
信号に変換するフォトカプラは、最近、多方面で利用さ
れている。It is composed of a semiconductor light-emitting element (hereinafter abbreviated as "light-emitting element") and a semiconductor light-receiving element (hereinafter abbreviated as "light-receiving element"), and the pixel elements are electrically insulated,
2. Description of the Related Art Photocouplers, which receive optical signals emitted from a light emitting element with a light receiving element and convert them into electrical signals, have recently been used in a variety of fields.

第３図は従来から用いられているＤＩＬ形フォトカプラ
の外観を示す斜視図、第４図は第３図の７オトカプラの
発光素子および受光素子の位置における断面図である。FIG. 3 is a perspective view showing the appearance of a conventionally used DIL type photocoupler, and FIG. 4 is a cross-sectional view of the seven photocoupler shown in FIG. 3 at the positions of the light emitting element and the light receiving element.

第４図において、（１）は発光素子、（２）はフォトダ
イオード、フォトサイリスタなどの受光素子、（３）は
発光素子（１）を搭載するリード導体、（４）は受光素
子を搭載するリード導体、（５）は相対向する発光素子
（１）と受光素子（２）との間に埋め込まれて光の経路
を形成する光透過樹脂、（６）は発光素子（１）、受光
素子（２）、リード導体＋３１　、　（４１の所要部分
および光透過樹脂（５）ヲ取り囲んで封止し外光を遮断
する黒色樹脂である。In Figure 4, (1) is a light-emitting element, (2) is a light-receiving element such as a photodiode or photothyristor, (3) is a lead conductor on which the light-emitting element (1) is mounted, and (4) is a light-receiving element. Lead conductor, (5) is a light-transmitting resin embedded between opposing light emitting element (1) and light receiving element (2) to form a light path, (6) is light emitting element (1) and light receiving element (2) is a black resin that surrounds and seals the required portions of the lead conductors +31 and (41) and the light-transmitting resin (5) to block external light.

第５図は第４図に示す７オトカプラが複数個組み立てら
れるリードフレームの斜視図である。第５図において、
（３０）は発光素子（１）全搭載するリード導体（３）
が複数個形成されている発光素子搭載リードフレーム、
（４０は受光素子（２）全搭載するリード導体（４）が
プ数個形成されている受光素子搭載リードフレームであ
る。FIG. 5 is a perspective view of a lead frame in which a plurality of seven Otocouplers shown in FIG. 4 are assembled. In Figure 5,
(30) is the light emitting element (1) and the lead conductor (3) that is fully mounted.
A lead frame equipped with a light emitting element, in which a plurality of
(The reference numeral 40 denotes a lead frame for mounting a light-receiving element, in which several lead conductors (4) for mounting all the light-receiving elements (2) are formed.

第４図に示すようなフォトカプラを組み立てる場合、複
数個の発光素子（１）を搭載する発光素子搭載リードフ
レーム（（至）と複数個の受光素子搭載する受光素子搭
載リードフレーム（イ）とを、第５図に示すように、発
光素子（１）と受光素子（２）とが１対づつ対向するよ
うに固定しく第５図においては１フオト力ブラ分以外は
詳細の図示を省略した）第４図に示すように光透過樹脂
（５）の塗布、黒色樹脂（６）によるモールディングを
行なった後に、個々の７オトカプラに分割し特性検査を
行なって、組立工程を完了する。When assembling a photocoupler as shown in Fig. 4, a light emitting element mounting lead frame ((to)) on which a plurality of light emitting elements (1) are mounted and a light receiving element mounting lead frame (a) on which a plurality of light receiving elements are mounted. As shown in Fig. 5, the light emitting element (1) and the light receiving element (2) are fixed so that they face each other one pair at a time. ) As shown in FIG. 4, after coating with light-transmitting resin (5) and molding with black resin (6), the parts are divided into seven individual Otocouplers and their characteristics are inspected to complete the assembly process.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

しかし、従来のリードフレームを使った組み立てにおい
ては、発光素子搭載リードフレーム（３０）と受光素子
搭載リードフレーム（４１とを、第５図に示すように、
対向・固定させるときに、リードフレーム（鋤、（イ）
が傾いて第６図に発光素子・受光素子搭載部分の断面図
を代表的に示すように発光素子（１）を搭載するリード
導体（３）と受光素子（２）全搭載するリード導体（４
）との間隔が不均一になった場合、または振動によりリ
ードフレーム（淵、四が動揺したりした場合、発光素子
（１）または受光素子（２）が対向するリード導体（４
）またはリード導体＋３１に当ったり、リード導体＋３
１　、　（４）相互が接触したり、内部配線〔例えば、
第５図に例示する内部配線（７）〕が接触したり断線し
たりすることがしばしばあった。However, in assembly using conventional lead frames, the light emitting element mounting lead frame (30) and the light receiving element mounting lead frame (41) are assembled as shown in FIG.
When facing and fixing the lead frame (plow, (a)
The lead conductor (3) on which the light emitting element (1) is mounted and the lead conductor (4) on which all the light receiving elements (2) are mounted are shown in FIG.
), or if the lead frame (Fuchi, 4) sways due to vibration, the light emitting element (1) or the light receiving element (2) may
) or lead conductor +31, or lead conductor +3
1, (4) Do not allow mutual contact or internal wiring [e.g.
The internal wiring (7) illustrated in FIG. 5 often came into contact or was disconnected.

この発明は、上記の点に鑑みてなされたものであり、発
光素子搭載リードフレームと受光素子搭載リードフレー
ムとを対向・固定したときに、相対向するリード導体の
間が所要の間隔の保持されるよう（でするフォトカプラ
用リードフレームを提供することを目的としたものであ
る。This invention has been made in view of the above points, and provides a method for maintaining a required spacing between opposing lead conductors when a light emitting element mounting lead frame and a light receiving element mounting lead frame are faced and fixed. The purpose of this product is to provide a lead frame for photocouplers that can be used in a photocoupler.

〔問題点全解決する念めの手段〕[A precautionary measure to resolve all problems]

この発明による７オト力プラ用リードフレーム搭載用リ
ード４体の素子搭載パッド側の；端部の対向するリード
導体側に、対向するリード導体間を所要の間隔に保持す
る電気絶縁性の間隔保持用キャップを設けたものである
。According to the present invention, on the element mounting pad side of the four leads for mounting a lead frame for 7 OTO plastics; on the opposing lead conductor sides of the ends, an electrically insulating gap is maintained to maintain the required spacing between the opposing lead conductors. It is equipped with a cap for use.

〔作用〕[Effect]

フォトカプラを嗅作するために、複数個の発光素子を搭
載した発光素子搭載リードフレームと複数個の受光素子
を搭載した受光素子搭載リードフレームとを対向・固定
したときに、間隔保持用キャップが画リードフレームの
各リード導体の素子搭載パッド側の端部の対向するリー
ド導体側に間隔保持用キャップが設けられているので、
相対向するリード導体間が所要の間隔に保持される。In order to fabricate a photocoupler, when a light emitting element mounting lead frame equipped with multiple light emitting elements and a light receiving element mounting lead frame equipped with multiple light receiving elements are placed facing each other and fixed, the spacing cap is removed. Since a gap-maintaining cap is provided on the opposite end of each lead conductor of the image lead frame on the element mounting pad side,
A required spacing is maintained between the opposing lead conductors.

〔実施例〕〔Example〕

第１図はこの発明によるフォトカプラ用リードフレーム
の一実施例を用いて製作されたフォトカプラの断面図で
ある。第１図において、第４図と同一符号は第４図に示
したものと同様のものを表わしている。（３ａ）は素子
搭載パッド側の先端が対向するリード導体の方向にほぼ
直角に曲げられた発光素子搭載リード導体、（”）は素
子搭載パッド側の先端が対向するリード導体の方向にほ
ぼ直角に曲げられた受光素子搭載リード導体、（８）は
両リード導体（３ａ）？　（４ａ）の先端のほぼ直角に
１出げられた部分にそう入ぢれた間隔保持用キャップで
ある、 第２図は第１図に示すフォトカプラの製作に用いられた
この発明による７オトカプラ用リードフレームの一実施
例の受光素子′ＪＳ載り−ドフレームの一部を拡大して
示す斜視図である。第２図に２いて、（４ａ）は受光素
子搭載リード導体、（８）は絶縁材料からなる間隔保持
用キャップ、（４１は受光素子搭載リードフレーム、（
４１）は受光素子搭載Ｉ）　−ド導体（４ａ）の素子搭
載パッドであ゛る。FIG. 1 is a sectional view of a photocoupler manufactured using an embodiment of a photocoupler lead frame according to the present invention. In FIG. 1, the same reference numerals as in FIG. 4 represent the same components as shown in FIG. (3a) is a light emitting element mounting lead conductor whose tip on the element mounting pad side is bent almost perpendicular to the direction of the opposing lead conductor, ('') is a lead conductor with a light emitting element whose tip on the element mounting pad side is bent almost at right angles to the direction of the opposing lead conductor. The lead conductor mounted with the photodetector is bent to the left, and (8) is a spacing-maintaining cap inserted into the almost right-angled part of the tip of both lead conductors (3a)? (4a). FIG. 2 is an enlarged perspective view of a part of the frame on which the light-receiving element 'JS is mounted, which is one embodiment of the lead frame for the 7-opto coupler according to the present invention, which was used in the production of the photocoupler shown in FIG. 2 in Fig. 2, (4a) is a lead conductor with a light receiving element mounted thereon, (8) is a gap maintaining cap made of an insulating material, (41 is a lead frame with a light receiving element mounted thereon, (
41) is an element mounting pad of the light-receiving element-mounted conductor (4a).

この実施例の７オトカプラ用リードフレームを用いて、
７オトカプラ全組み立てるときは、発光素子搭載リード
フレーム国および受光素子搭載リードフレーム（伯のリ
ード導体（３ａ）ｔ　（”）の素子搭載パッド側の先端
のほぼ直角に曲げられた部分にそう人された間隔保持用
キャップ（８）が相対向するリード導体＜３ａ）＊　（
”）間を所要の間隔に保つから、発光素子（１）または
受光素子（２）が対向するリード導体（４ａ）またはリ
ード導体（３ａ）に当ったり、リード導体（３ａ）、　
（４７Ｌ）相互が接触したジ、内部配線が接触したり断
線したりすることがない。Using the lead frame for 7 Oto couplers of this example,
7. When assembling the entire Otocoupler, make sure that the lead frame with the light emitting element and the lead frame with the light receiving element (lead conductor (3a)t (") on the element mounting pad side are bent at almost right angles. Lead conductor <3a)* (
”), the light emitting element (1) or the light receiving element (2) may hit the opposing lead conductor (4a) or the lead conductor (3a), or the lead conductor (3a),
(47L) When they come into contact with each other, the internal wiring will not come into contact or be disconnected.

上記の実施例においては、リード導体の素子搭載パッド
側の先端を対向するリード導体方向にほぼ直角に曲げ、
この曲げた部分に間隔保持用キャップをそう人した場合
について述べたが、直角に曲げることは必ずしも必要で
はなく、曲げない先端の対向するリード導体（！：１の
而に間隔保持用キャンプを固着させてもよい。In the above embodiment, the tip of the lead conductor on the element mounting pad side is bent almost at right angles in the direction of the opposing lead conductor.
We have described the case where a spacing cap is attached to this bent part, but it is not necessarily necessary to bend it at right angles, and the spacing cap is fixed to the opposite lead conductor (!:1) at the unbent tip. You may let them.

〔発明の効果〕〔Effect of the invention〕

この発明によりフォトカプラ用リードフレームにおいて
は、発光素子搭載リードフレームおよび受光素子搭載リ
ードフレームの発光素子または受光素子を搭載するリー
ド導体の素子搭載パッド側の先端に、両リードフレーム
を対向・固定させたとき、対向するリード導体との間を
所要の間隔に保持する間隔保持用キャップが装着されて
いるので、相対向するり−ド尋体が所要の間隔に保持さ
れ、発光素子または受光素子が対向するリード導体に当
ったり、リード導体相互が接触したり、内部配線が接触
した！ｌｌ断線したりすることがない。According to the present invention, in a lead frame for a photocoupler, both lead frames are faced and fixed to the ends of the lead conductor on which the light emitting element or the light receiving element is mounted on the element mounting pad side of the lead frame with a light emitting element and the lead frame with a light receiving element. Since the gap-maintaining cap is attached to maintain the required distance between the opposing lead conductors, the opposing lead conductors are maintained at the required distance, and the light-emitting element or light-receiving element is Opposite lead conductors were hit, lead conductors came into contact with each other, or internal wiring came into contact! There is no possibility of wire breakage.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はこの発明によるフォトカプラ用リードフレーム
の一実施例を用いて製作されたフォトカプラの断面図、
第２図はこの発明の一実施例の一部を拡大して示す斜視
図、第３図は従来のフォトカプラの斜視図、第４図は従
来のフォトカプラの断面図、抛５図は従来のフォトカプ
ラ用リードフレームの斜視図、第６図；は発光素子搭載
リード導体と受″／を素子搭載リード導体との間隔が一
様でなくなった状態を示す断面図である。 図において、（１）は半導体発光素子、（２）は半一本
体受光素子、（３−）は発光素子搭載リード導体、（４
ａ）は受光素−子搭載リード導体、（８）は間隔保持用
キャップ、（Ｗは発光素子搭載リードフレーム、（イ）
は受光素子搭載リードフレーム、（４１）は素子搭載パ
ッドででンる。 なお・、各図中同一符号は同−ｌたは相当部分を示す。FIG. 1 is a sectional view of a photocoupler manufactured using an embodiment of a photocoupler lead frame according to the present invention.
Fig. 2 is an enlarged perspective view of a part of an embodiment of the present invention, Fig. 3 is a perspective view of a conventional photocoupler, Fig. 4 is a sectional view of a conventional photocoupler, and Fig. 5 is a conventional photocoupler. FIG. 6 is a perspective view of the lead frame for a photocoupler shown in FIG. 1) is a semiconductor light emitting device, (2) is a half-unit light receiving device, (3-) is a lead conductor mounted with a light emitting device, and (4) is a semiconductor light emitting device.
a) is the lead conductor mounted with the light receiving element, (8) is the gap maintaining cap, (W is the lead frame with the light emitting element mounted, (a)
(41) is a lead frame on which a light receiving element is mounted, and (41) is a pad on which an element is mounted. Note that the same reference numerals in each figure indicate the same or equivalent parts.

Claims (2)

【特許請求の範囲】[Claims] （１）半導体発光素子と半導体受光素子とが相対向する
ように配置された半導体フォトカプラの製作に使用する
ものにおいて、上記半導体発光素子および上記半導体受
光素子をそれぞれ複数個搭載する発光素子搭載リードフ
レームおよび受光素子搭載リードフレームの個々の上記
半導体発光素子または上記半導体受光素子を搭載するリ
ード導体の素子搭載パッド側の端部に、上記発光素子搭
載リードフレームと上記受光素子搭載リードフレームと
を対向・固定したときに対向するリード導体間を所要の
間隔に保持する電気絶縁性の間隔保持用キャップを設け
たことを特徴とするフォトカプラ用リードフレーム。(1) A light-emitting element mounting lead on which a plurality of the semiconductor light-emitting elements and a plurality of the semiconductor light-receiving elements are mounted, in a device used for manufacturing a semiconductor photocoupler in which a semiconductor light-emitting element and a semiconductor light-receiving element are arranged to face each other. The light-emitting element-mounted lead frame and the light-receiving element-mounted lead frame are placed so as to face each other at the end of the lead conductor on which the semiconductor light-emitting element or the semiconductor light-receiving element is mounted on the element-mounting pad side of the frame and the light-receiving element-mounted lead frame. - A lead frame for a photocoupler characterized by being provided with an electrically insulating spacing cap that maintains a required spacing between opposing lead conductors when fixed. （２）リード導体の素子搭載パッド側の先端をほぼ直角
に曲げこの曲げた部分に間隔保持用キャップをそう入し
たことを特徴とする特許請求の範囲第１項記載のフォト
カプラ用リードフレーム。(2) The lead frame for a photocoupler as set forth in claim 1, wherein the tip of the lead conductor on the element mounting pad side is bent at a substantially right angle and a gap-maintaining cap is inserted into the bent portion.
JP59196155A 1984-09-17 1984-09-17 Lead frame for photo-coupler Pending JPS6173387A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59196155A JPS6173387A (en) 1984-09-17 1984-09-17 Lead frame for photo-coupler

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59196155A JPS6173387A (en) 1984-09-17 1984-09-17 Lead frame for photo-coupler

Publications (1)

Publication Number Publication Date
JPS6173387A true JPS6173387A (en) 1986-04-15

Family

ID=16353119

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59196155A Pending JPS6173387A (en) 1984-09-17 1984-09-17 Lead frame for photo-coupler

Country Status (1)

Country Link
JP (1) JPS6173387A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5614759A (en) * 1994-07-12 1997-03-25 General Instrument Corp. Automated assembly of semiconductor devices using a pair of lead frames
EP1121603A1 (en) * 1998-10-15 2001-08-08 Handy and Harman Method and system for manufacturing lamp tiles

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5614759A (en) * 1994-07-12 1997-03-25 General Instrument Corp. Automated assembly of semiconductor devices using a pair of lead frames
EP1121603A1 (en) * 1998-10-15 2001-08-08 Handy and Harman Method and system for manufacturing lamp tiles
EP1121603A4 (en) * 1998-10-15 2007-10-24 Handy And Harman Method and system for manufacturing lamp tiles

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