JPS635254Y2 - - Google Patents

Info

Publication number
JPS635254Y2
JPS635254Y2 JP1982192790U JP19279082U JPS635254Y2 JP S635254 Y2 JPS635254 Y2 JP S635254Y2 JP 1982192790 U JP1982192790 U JP 1982192790U JP 19279082 U JP19279082 U JP 19279082U JP S635254 Y2 JPS635254 Y2 JP S635254Y2
Authority
JP
Japan
Prior art keywords
lead
resin
opening
chip
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1982192790U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5996846U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1982192790U priority Critical patent/JPS5996846U/ja
Publication of JPS5996846U publication Critical patent/JPS5996846U/ja
Application granted granted Critical
Publication of JPS635254Y2 publication Critical patent/JPS635254Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1982192790U 1982-12-20 1982-12-20 樹脂封止型モジユ−ル Granted JPS5996846U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982192790U JPS5996846U (ja) 1982-12-20 1982-12-20 樹脂封止型モジユ−ル

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982192790U JPS5996846U (ja) 1982-12-20 1982-12-20 樹脂封止型モジユ−ル

Publications (2)

Publication Number Publication Date
JPS5996846U JPS5996846U (ja) 1984-06-30
JPS635254Y2 true JPS635254Y2 (enrdf_load_stackoverflow) 1988-02-12

Family

ID=30414806

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982192790U Granted JPS5996846U (ja) 1982-12-20 1982-12-20 樹脂封止型モジユ−ル

Country Status (1)

Country Link
JP (1) JPS5996846U (enrdf_load_stackoverflow)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5732508B2 (enrdf_load_stackoverflow) * 1974-01-28 1982-07-12
JPS5242249U (enrdf_load_stackoverflow) * 1975-09-19 1977-03-25
JPS626698Y2 (enrdf_load_stackoverflow) * 1980-04-30 1987-02-16

Also Published As

Publication number Publication date
JPS5996846U (ja) 1984-06-30

Similar Documents

Publication Publication Date Title
JP2882143B2 (ja) 半導体装置の内部配線構造
JP4400965B2 (ja) 積層化半導体パッケージ及びその製造方法
US4506238A (en) Hybrid circuit device
KR100260102B1 (ko) 기능 분화형 온도 보상 수정 발진기 및 그 제조 방법
JPH07153907A (ja) 電力用半導体モジュール
US4032964A (en) Multiple hybrid semiconductor structure
JPS635254Y2 (enrdf_load_stackoverflow)
JP2600689B2 (ja) 半導体装置用中空パッケージ
JPS6218052Y2 (enrdf_load_stackoverflow)
JP2554040Y2 (ja) 電子部品取付構造
JP2737332B2 (ja) 集積回路装置
JPS5993148U (ja) 樹脂封止型モジユ−ル
JP2719459B2 (ja) 面実装用数字表示器およびその製造方法
JPH0648877Y2 (ja) 半導体装置
JPS643238Y2 (enrdf_load_stackoverflow)
JPH0436121Y2 (enrdf_load_stackoverflow)
KR200169730Y1 (ko) 반도체 패키지의 리드프레임
JP2591999Y2 (ja) 集積回路のパッケージの構造
JPH0119425Y2 (enrdf_load_stackoverflow)
JPH0215392Y2 (enrdf_load_stackoverflow)
JPH02201946A (ja) 半導体装置
JPH0214558A (ja) 半導体集積回路装置
JP2912813B2 (ja) 電子部品
JP2691409B2 (ja) チップ形コンデンサ
JP2539144Y2 (ja) 半導体モジュール