JPS635254Y2 - - Google Patents
Info
- Publication number
- JPS635254Y2 JPS635254Y2 JP1982192790U JP19279082U JPS635254Y2 JP S635254 Y2 JPS635254 Y2 JP S635254Y2 JP 1982192790 U JP1982192790 U JP 1982192790U JP 19279082 U JP19279082 U JP 19279082U JP S635254 Y2 JPS635254 Y2 JP S635254Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- resin
- opening
- chip
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1982192790U JPS5996846U (ja) | 1982-12-20 | 1982-12-20 | 樹脂封止型モジユ−ル |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1982192790U JPS5996846U (ja) | 1982-12-20 | 1982-12-20 | 樹脂封止型モジユ−ル |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5996846U JPS5996846U (ja) | 1984-06-30 |
JPS635254Y2 true JPS635254Y2 (enrdf_load_stackoverflow) | 1988-02-12 |
Family
ID=30414806
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1982192790U Granted JPS5996846U (ja) | 1982-12-20 | 1982-12-20 | 樹脂封止型モジユ−ル |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5996846U (enrdf_load_stackoverflow) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5732508B2 (enrdf_load_stackoverflow) * | 1974-01-28 | 1982-07-12 | ||
JPS5242249U (enrdf_load_stackoverflow) * | 1975-09-19 | 1977-03-25 | ||
JPS626698Y2 (enrdf_load_stackoverflow) * | 1980-04-30 | 1987-02-16 |
-
1982
- 1982-12-20 JP JP1982192790U patent/JPS5996846U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5996846U (ja) | 1984-06-30 |
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