JPS635237Y2 - - Google Patents
Info
- Publication number
- JPS635237Y2 JPS635237Y2 JP1982173735U JP17373582U JPS635237Y2 JP S635237 Y2 JPS635237 Y2 JP S635237Y2 JP 1982173735 U JP1982173735 U JP 1982173735U JP 17373582 U JP17373582 U JP 17373582U JP S635237 Y2 JPS635237 Y2 JP S635237Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- wiring pattern
- sealing
- semiconductor device
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W70/63—
-
- H10W90/754—
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982173735U JPS5977231U (ja) | 1982-11-16 | 1982-11-16 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982173735U JPS5977231U (ja) | 1982-11-16 | 1982-11-16 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5977231U JPS5977231U (ja) | 1984-05-25 |
| JPS635237Y2 true JPS635237Y2 (enExample) | 1988-02-12 |
Family
ID=30378401
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1982173735U Granted JPS5977231U (ja) | 1982-11-16 | 1982-11-16 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5977231U (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2575331B1 (fr) * | 1984-12-21 | 1987-06-05 | Labo Electronique Physique | Boitier pour composant electronique |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5413966A (en) * | 1977-07-01 | 1979-02-01 | Nippon Electric Co | Substrate for multiilayer wiring |
| JPS5471572A (en) * | 1977-11-18 | 1979-06-08 | Fujitsu Ltd | Semiconductor device |
| JPS5731165A (en) * | 1980-07-31 | 1982-02-19 | Fujitsu Ltd | Semiconductor device |
-
1982
- 1982-11-16 JP JP1982173735U patent/JPS5977231U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5977231U (ja) | 1984-05-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5897724A (en) | Method of producing a hybrid integrated circuit | |
| US4712161A (en) | Hybrid and multi-layer circuitry | |
| US5227583A (en) | Ceramic package and method for making same | |
| US4472762A (en) | Electronic circuit interconnection system | |
| US5006923A (en) | Stackable multilayer substrate for mounting integrated circuits | |
| US4697204A (en) | Leadless chip carrier and process for fabrication of same | |
| US5652466A (en) | Package for a semiconductor element | |
| JPS635237Y2 (enExample) | ||
| US5094969A (en) | Method for making a stackable multilayer substrate for mounting integrated circuits | |
| JPH10303327A (ja) | 半導体チップの接点変換構造と該接点変換構造を有する半導体チップの製造法 | |
| JPH05211256A (ja) | 半導体装置 | |
| JP3394479B2 (ja) | 半導体装置 | |
| JPH11214432A (ja) | 半導体装置およびスペーサ形成方法 | |
| JP3359521B2 (ja) | 半導体装置の製造方法 | |
| JP2867737B2 (ja) | 混成集積回路 | |
| JP3279846B2 (ja) | 半導体装置の製造方法 | |
| JP2507175B2 (ja) | プリント回路板 | |
| JP2728583B2 (ja) | 半導体素子収納用パッケージの製造方法 | |
| JPS6041853B2 (ja) | 電子回路装置 | |
| JP3808358B2 (ja) | 配線基板 | |
| JPS63111697A (ja) | 配線基板およびその製造方法 | |
| JP3894935B2 (ja) | 半導体装置およびその製造方法 | |
| JPH075642Y2 (ja) | 固定部材付集積回路パッケージ | |
| JPH06310628A (ja) | 混成集積回路 | |
| JPS6223143A (ja) | 半導体装置 |