JPS6351378B2 - - Google Patents

Info

Publication number
JPS6351378B2
JPS6351378B2 JP55134224A JP13422480A JPS6351378B2 JP S6351378 B2 JPS6351378 B2 JP S6351378B2 JP 55134224 A JP55134224 A JP 55134224A JP 13422480 A JP13422480 A JP 13422480A JP S6351378 B2 JPS6351378 B2 JP S6351378B2
Authority
JP
Japan
Prior art keywords
substrate
semiconductor substrate
semiconductor
holding
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55134224A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5759349A (en
Inventor
Haruo Mori
Yasuo Oono
Yutaka Oota
Hiroshi Tanabe
Kotaro Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
NTT Inc
Original Assignee
Nippon Telegraph and Telephone Corp
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp, Oki Electric Industry Co Ltd filed Critical Nippon Telegraph and Telephone Corp
Priority to JP55134224A priority Critical patent/JPS5759349A/ja
Priority to US06/302,351 priority patent/US4530001A/en
Publication of JPS5759349A publication Critical patent/JPS5759349A/ja
Publication of JPS6351378B2 publication Critical patent/JPS6351378B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P14/683—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/764—Air gaps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/201—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates the substrates comprising an insulating layer on a semiconductor body, e.g. SOI
    • H10P14/6506—
    • H10P14/6922—
    • H10W10/021—
    • H10W10/20—
    • H10W70/695—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H10W72/073—
    • H10W72/07337—
    • H10W72/354—

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Element Separation (AREA)
  • Formation Of Insulating Films (AREA)
JP55134224A 1980-09-29 1980-09-29 Manufacture of semiconductor device Granted JPS5759349A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP55134224A JPS5759349A (en) 1980-09-29 1980-09-29 Manufacture of semiconductor device
US06/302,351 US4530001A (en) 1980-09-29 1981-09-15 High voltage integrated semiconductor devices using a thermoplastic resin layer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55134224A JPS5759349A (en) 1980-09-29 1980-09-29 Manufacture of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5759349A JPS5759349A (en) 1982-04-09
JPS6351378B2 true JPS6351378B2 (show.php) 1988-10-13

Family

ID=15123316

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55134224A Granted JPS5759349A (en) 1980-09-29 1980-09-29 Manufacture of semiconductor device

Country Status (2)

Country Link
US (1) US4530001A (show.php)
JP (1) JPS5759349A (show.php)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4866501A (en) * 1985-12-16 1989-09-12 American Telephone And Telegraph Company At&T Bell Laboratories Wafer scale integration
US4793883A (en) * 1986-07-14 1988-12-27 National Starch And Chemical Corporation Method of bonding a semiconductor chip to a substrate
US5191224A (en) * 1987-04-22 1993-03-02 Hitachi, Ltd. Wafer scale of full wafer memory system, packaging method thereof, and wafer processing method employed therein
GB2206445A (en) * 1987-07-01 1989-01-05 Spectrol Reliance Ltd Method of manufacturing dielectrically isolated integrated circuits and circuit elements
JPS6437492U (show.php) * 1987-08-31 1989-03-07
US4904610A (en) * 1988-01-27 1990-02-27 General Instrument Corporation Wafer level process for fabricating passivated semiconductor devices
JP3034528B2 (ja) * 1988-04-06 2000-04-17 ソニー株式会社 半導体装置の製造方法
US4918505A (en) * 1988-07-19 1990-04-17 Tektronix, Inc. Method of treating an integrated circuit to provide a temperature sensor that is integral therewith
US4871921A (en) * 1988-08-09 1989-10-03 Honeywell Inc. Detector array assembly having bonding means joining first and second surfaces except where detectors are disposed
US6262434B1 (en) 1996-08-23 2001-07-17 California Micro Devices Corporation Integrated circuit structures and methods to facilitate accurate measurement of the IC devices
FR2782840B1 (fr) * 1998-08-25 2003-09-05 Commissariat Energie Atomique Circuit electronique et procede de realisation d'un circuit electronique integre comprenant au moins un composant electronique de puissance dans une plaque de substrat
EP1161769A1 (en) * 1999-12-24 2001-12-12 Koninklijke Philips Electronics N.V. Method of manufacturing a semiconductor device comprising semiconductor elements formed in a top layer of a silicon wafer situated on a buried insulating layer

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3475664A (en) * 1965-06-30 1969-10-28 Texas Instruments Inc Ambient atmosphere isolated semiconductor devices
US3416224A (en) * 1966-03-08 1968-12-17 Ibm Integrated semiconductor devices and fabrication methods therefor
US4296428A (en) * 1979-06-28 1981-10-20 Rockwell International Corporation Merged field effect transistor circuit and fabrication process

Also Published As

Publication number Publication date
JPS5759349A (en) 1982-04-09
US4530001A (en) 1985-07-16

Similar Documents

Publication Publication Date Title
US6621161B2 (en) Semiconductor device having a package structure
KR20180027679A (ko) 반도체 패키지 및 그의 제조 방법
US10943857B2 (en) Substrate with multi-layer resin structure and semiconductor device including the substrate
JPS6351378B2 (show.php)
US20250069992A1 (en) Dual-side cooling semiconductor packages and related methods
JPH06244360A (ja) 半導体装置
US20230268310A1 (en) Semiconductor device and semiconductor device manufacturing method
JPH11168157A (ja) マルチチップ半導体装置
JP2002270720A (ja) 半導体装置およびその製造方法
CN113035792B (zh) 具有模制金属互连基板的功率模块及其制造方法
US6337225B1 (en) Method of making stacked die assemblies and modules
US3594619A (en) Face-bonded semiconductor device having improved heat dissipation
US7528054B2 (en) Semiconductor component with a thin semiconductor chip and a stiff wiring substrate, and methods for producing and further processing of thin semiconductor chips
KR102371636B1 (ko) 양면 기판 반도체 제조 방법
US20250239557A1 (en) Clip
US3419955A (en) Semiconductor fabrication
US11948878B2 (en) Semiconductor chip package and method of assembly
US20220359229A1 (en) Semiconductor device and method for manufacturing the semiconductor device
EP0032565B1 (en) Mounting and packaging of silicon devices on ceramic substrates, and packaged silicon devices
JP2002252309A (ja) 半導体チップのパッケージ構造及びパッケージ方法
JP2001332685A (ja) 半導体装置の製造方法
JP3391321B2 (ja) 半導体集積回路およびその製造方法
JPH05304282A (ja) 集積回路装置
JPS5998533A (ja) 半導体基板およびその製造方法
JPS6259910B2 (show.php)